Semiconductor Manufacturing

Intel Secures $7.9 Billion Grant for Semiconductor Projects

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Under the 2022 U.S. CHIPS and Science Act, the Department of Commerce has given Intel $7.86 billion for its semiconductor manufacturing projects. This funding is aimed at supporting advanced packaging efforts at various Intel locations including Arizona, New Mexico, Ohio, and Oregon. This is the largest direct funding amount ever provided by the U.S. government to […]

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TSMC's Advanced Packaging Capacity Fully Booked by Nvidia and AMD

TSMC’s Advanced Packaging Capacity Fully Booked by Nvidia and AMD

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TSMC, the prominent semiconductor manufacturer globally, has declared that its advanced packaging capacity has been completely reserved for the next two years. This announcement coincides with Nvidia, AMD, and Guanghuida securing TSMC's cutting-edge packaging technologies for their high-performance computing (HPC) endeavors. Growing Demand for AI Processors The emphasis on high-performance computing is driven by its crucial

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NVIDIA chip supply stable despite Taiwan 7.5-magnitude quake

NVIDIA chip supply stable despite Taiwan 7.5-magnitude quake

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After the recent 7.5-magnitude earthquake near Taiwan, concerns have arisen about potential disruptions to the global chip supply chain. Taiwan plays a significant role in semiconductor manufacturing, leading to speculations about the status of semiconductor factories post-earthquake. However, NVIDIA, a prominent player in the AI industry, has reassured stakeholders that its chip supply remains unaffected. NVIDIA

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