Tag: Samsung Electronics

  • BOE faces Samsung’s termination amidst ongoing legal disputes

    BOE faces Samsung’s termination amidst ongoing legal disputes

    South Korean electronics giant Samsung Electronics has cut ties with BOE, China's largest display manufacturer. The decision comes as a result of patent infringement and trade secret theft allegations made by Samsung Display, a subsidiary of Samsung Electronics. Complaints have been filed with the U.S. International Trade Commission (ITC) accusing BOE of misappropriating OLED panel and module technology.

    The exclusion of BOE from Samsung Electronics' supplier list is significant as the Chinese company has been a major supplier of LCD panels, accounting for approximately 10% of the company's TV panel purchases in the first half of 2023. This marks the first time in nearly seven and a half years that BOE has not been included as a primary supplier for Samsung Electronics' Device Experience (DX) division.

    The termination of the partnership is expected to have a significant impact on BOE's business. As a major customer, Samsung's decision to end the contract will likely hurt the Chinese company's bottom line. BOE had been relying on Samsung as a key customer, and losing this contract will pose challenges for its operations.

    In response to cutting ties with BOE, Samsung Electronics is anticipated to increase its collaboration with other suppliers such as LG Display, Sharp, and AUO. LG Display, in particular, is expected to boost production at its Guangzhou, China LCD factory. This move could lead to an increase in shipments from 9 million units in 2023 to 16 million units in 2024.

    The severed ties between Samsung Electronics and BOE highlight the significance of intellectual property protection in the technology industry. Patent infringement and trade secret theft allegations can have severe consequences for companies involved, leading to the termination of partnerships and potential financial losses. As the industry continues to evolve, safeguarding intellectual property rights remains crucial for businesses to maintain their competitive edge.

  • Samsung considers implementing 3D chiplet technology in Exynos mobile APs

    Samsung considers implementing 3D chiplet technology in Exynos mobile APs

    Samsung Considers 3D Chiplets for Exynos Mobile APs

    Samsung Electronics is reportedly considering the application of 3D chiplet technology to its Exynos mobile application processors (APs). According to a company official familiar with the matter, Samsung believes that there are significant benefits to be gained from this technology.

    The Advantages of Chiplets

    Chiplets are a next-generation packaging technology that involves manufacturing semiconductors with different functions and vertically connecting them into a single chip. This approach offers several advantages over the traditional monolithic method.

    One key benefit of chiplets is improved yield. In the case of a problem occurring in a specific circuit on a monolithic chip, the entire chip must be discarded. However, with chiplets, only the affected component needs to be replaced.

    Another advantage is increased design efficiency. When a change needs to be made to a particular circuit on a monolithic chip, the entire design must be redone. With chiplets, only the specific circuit that needs to be changed requires redesign.

    Gaining a Competitive Edge

    The move to chiplets is driven by Samsung's desire to gain a competitive edge in the mobile AP market. Currently, Qualcomm holds the largest market share, followed by Apple and MediaTek. Samsung's Exynos APs have struggled to gain traction, leading the company to use Qualcomm's Snapdragon 8 Gen 2 chip in its flagship Galaxy S23 smartphone series.

    By implementing 3D chiplets, Samsung aims to differentiate its Exynos APs. Vertical stacking of chips through 3D packaging can reduce overall package size, increase bandwidth, and improve power efficiency. These advantages could make Exynos APs more competitive with offerings from Qualcomm and Apple.

    Chiplet Technology Across the Industry

    Samsung is not alone in exploring chiplet technology. Other major players in the industry, such as NVIDIA, AMD, and Intel, are also incorporating chiplets into the development of system semiconductors for high-performance computing (HPC).

    In conclusion, Samsung's consideration of 3D chiplets for its Exynos mobile APs reflects the company's pursuit of improved performance and competitiveness in the market. With the potential benefits that chiplet technology offers, Samsung aims to enhance its position in the mobile AP industry and provide users with more efficient and powerful devices.