Tag: Qualcomm

  • Introducing Snapdragon 7+ Gen 3 SoC: On-Device GenAI Features

    Introducing Snapdragon 7+ Gen 3 SoC: On-Device GenAI Features

    Qualcomm has recently unveiled the Snapdragon 8s Gen 3 processor, a streamlined variant of the flagship Snapdragon 8 Gen 3. In addition to this, the American chipmaker has introduced a new mid-range System on Chip (SoC) that joins the Snapdragon 7 Gen 3 family. This latest addition is known as the Snapdragon 7+ Gen 3, serving as the successor to the Snapdragon 7+ Gen 2 from the previous year. The Snapdragon 7+ Gen 3 brings forth a variety of enhancements, particularly in the realm of Artificial Intelligence (AI), indicating that devices powered by this chipset will incorporate advanced AI functionalities.

    Snapdragon 7+ Gen 3 Unveiled

    The Snapdragon 7+ Gen 3 retains the 4nm process technology from TSMC, similar to its predecessor. Its CPU architecture mirrors that of the flagship Snapdragon 8 Gen 3, comprising of a prime core, four performance cores, and three efficiency cores. Notably, the prime core reaches a maximum clock speed of 2.8GHz. Qualcomm asserts that this chipset offers a 15% improvement in CPU performance, 45% in GPU performance, and a 15% boost in power efficiency.

    Enhanced Features and Connectivity

    Equipped with an integrated X63 5G modem and the FastConnect 7800 mobile connectivity system, the Snapdragon 7+ Gen 3 can achieve peak download speeds of up to 4.2 Gbps while also supporting WiFi-7 technology.

    On-Device AI Capabilities

    One of the standout features of the Snapdragon 7+ Gen 3 is its on-device generative AI capabilities. This platform supports a diverse array of large language models (LLM) like Baichuan-7B, Llama 2, and Gemini Nano, enhancing virtual assistant functionalities, multi-language translation, and transcription capabilities for smartphones powered by this chipset.

    Photography and Audio Capabilities

    Featuring an 18-bit triple cognitive Image Signal Processor (ISP) that can capture images up to 200MP, the Snapdragon 7+ Gen 3 boasts additional features such as Snapdragon Low Light Vision. On the audio front, it supports Spatial Audio with head tracking, Snapdragon Sound technology, aptX Lossless, LE audio, and more. The chipset is capable of accommodating up to QHD+ display resolution at a refresh rate of 120Hz, and it supports up to 24GB of LPDDR5x RAM and a UFS 4.0 storage system.

    OnePlus Ace 3V Debut

    The OnePlus Ace 3V has already made its entrance in the Chinese market, featuring the Snapdragon 7+ Gen 3 processor.

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  • Snapdragon 8s Gen 3 SoC Launch: Supports 1080p 240FPS Video Recording

    Snapdragon 8s Gen 3 SoC Launch: Supports 1080p 240FPS Video Recording

    Qualcomm recently held a media event to unveil the latest Snapdragon 8s Gen 3 SoCs, a variant of the flagship Snapdragon 8 Gen 3 chip. This new chip retains key features like hardware-accelerated ray tracing, enhancing visual quality in games and apps by improving lighting, shadows, and reflections. Additionally, it incorporates the Adreno Frame Motion Engine 2.0 to potentially double game frame rates from 60fps to 120fps.

    Enhanced Features and Performance

    The CPU configuration comprises a Cortex-X4 prime core, four Cortex A720 cores, and three Cortex-A520 cores running at speeds of 3.0GHz, 2.8GHz, and 2.0GHz, respectively. Supporting up to 24GB LPDDR5x RAM clocked at 4,200MHz, it boasts an 18-bit triple cognitive ISP for image and video processing tasks. The chip offers various capabilities like always-on camera, photo enhancement, and 4K HDR video recording at 60FPS.

    Advanced Connectivity and AI Capabilities

    The Snapdragon 8s Gen 3 integrates the FastConnect 7800 Mobile Connectivity System, Wi-Fi 7 with HBS, Snapdragon X70 5G-Modem RF System, and 5G AI processor. It supports Release 17 5G, promising improved performance and broader coverage. On-device generative AI features include AI image generation and support for up to 10 billion parameters, catering to diverse AI applications.

    Adoption by Global Brands

    Qualcomm has announced partnerships with leading global OEMs and brands like HONOR, iQOO, realme, Redmi, and Xiaomi, who will incorporate the Snapdragon 8s Gen 3 platform into their upcoming devices. The first product launch utilizing this platform is anticipated in March.

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  • Qualcomm’s Upcoming Snapdragon Chip Launch Event on March 18: Expectations for 8s Gen 3 & 7+ Gen 3

    Qualcomm’s Upcoming Snapdragon Chip Launch Event on March 18: Expectations for 8s Gen 3 & 7+ Gen 3

    Qualcomm is gearing up for a product launch event scheduled for 14:30 on March 18th to introduce its highly anticipated Snapdragon flagship system-on-a-chip (SoC). The event's theme revolves around the concept that "Intelligence is in the core, and there is a dragon in it."

    Rumors circulating suggest that Qualcomm is set to reveal the Snapdragon 7+ Gen 3 (SM7675) and Snapdragon 8s Gen 3 (SM8635) chips during this upcoming event. These chips, internally referred to as "Cliffs," are believed to offer different variations of the same core technology, sharing the architecture of the Snapdragon 8 Gen 3.

    Speculated Chip Specifications

    Here's an overview of the rumored specifications for both the Snapdragon 7+ Gen 3 and Snapdragon 8s Gen 3, compared to the Snapdragon 8 Gen 3:

    ChipBig CoreMedium CoreSmall CoreGPU
    7+ Gen 31*2.9GHz Cortex-X44*2.6GHz Cortex-A723*1.9GHz Cortex-A52Adreno 732
    8s Gen 31*3.01GHz Cortex-X44*2.61GHz Cortex-A723*1.84GHz Cortex-A52Adreno 735
    8 Gen 31*3.3GHz Cortex-X43*3.25GHz Cortex-A722*2.27GHz Cortex-A52Adreno 750

    Potential Devices with New Processors

    There is speculation about upcoming devices that could potentially feature these new processors. Some of the devices that might be equipped with either the Snapdragon 8s Gen 3 or Snapdragon 7+ Gen 3 processors include:

    • Realme GT Neo6 series (Snapdragon 8s Gen 3 or Snapdragon 7+ Gen 3)
    • Redmi Note 13 Turbo (Snapdragon 8s Gen 3)
    • Xiaomi Civi 4 (Snapdragon 8s Gen 3)
    • OnePlus Ace 3V (Snapdragon 7+ Gen 3)
    • Vivo Pad 3 (Snapdragon 8s Gen 3)
    • iQOO Neo 9 series new devices (Snapdragon 8s Gen 3)

    To get concrete details on these specifications and device lineups, we will have to await Qualcomm's official event on March 18th.

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  • Samsung Galaxy Book 4 Edge Excels in Geekbench with Snapdragon X Elite

    Samsung Galaxy Book 4 Edge Excels in Geekbench with Snapdragon X Elite

    Samsung recently unveiled its Galaxy Book 4 series globally, but there’s a new arrival on the scene that’s caught attention – the Samsung Galaxy Book 4 Edge. This mysterious newcomer has made an appearance on the Geekbench benchmarking platform, teasing some intriguing details about the upcoming device.

    Samsung Galaxy Book 4 Edge Specifications

    The Galaxy Book 4 Edge surprises with Qualcomm’s latest Snapdragon X Elite processor coupled with a substantial 16GB of RAM, all while operating on Windows 11 Home (64-bit).

    The benchmark not only reveals Samsung’s collaboration with Qualcomm for laptops but also suggests a delay in deploying Samsung’s Exynos chips for larger devices. This move seems sensible as Samsung is presently concentrating on optimizing the Exynos line for smartphones.

    Impressive Performance Metrics

    The Galaxy Book 4 Edge, powered by the Snapdragon X Elite, impresses with Geekbench 6.2.2. scores of 2,706 points in single-core and an outstanding 12,646 points in multi-core tests, showcasing its robust performance capabilities.

    When compared, the Snapdragon X Elite surpasses Apple’s M1 and M2 chips but falls short against the newer M3 (excluding the M Pro line).

    Qualcomm’s Chip in the Market

    A direct comparison between the Snapdragon X Elite and Apple’s M-series chips is complex due to the inherent differences between Windows 11 on ARM and MacOS. Apple’s superior software optimization for its M-chips gives it an advantage, highlighting the significance of real-world performance beyond benchmarks.

    Rumors suggest that Qualcomm’s new chip might feature in Microsoft’s upcoming Surface Laptop 6 and Surface Pro 10, potentially positioning Samsung as a direct rival to Microsoft’s established Surface lineup.

    Samsung’s Strategic Partnership

    Samsung’s decision to collaborate with Qualcomm for its premium laptop lineup, including the Galaxy Book 4 Edge, is unexpected, considering Qualcomm’s recent foray into the consumer PC chip market.

    Samsung Galaxy Book 4 Edge Excels in Geekbench with Snapdragon X Elite
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  • MediaTek Overtakes Apple & Qualcomm as Top Smartphone Chipset Vendor 2023

    MediaTek Overtakes Apple & Qualcomm as Top Smartphone Chipset Vendor 2023

    Chipmaker MediaTek has been recognized as the leading System on Chip (SoC) vendor by the close of 2023. Known for developing the fastest smartphone processor currently available, MediaTek’s Dimensity 9300 and other chipsets have secured a significant share in the smartphone market.

    MediaTek’s Dominance in the SoC Market

    A recent report from Canalys sheds light on MediaTek’s ascent as the preferred SoC vendor in 2023. In the fourth quarter of the year, MediaTek sold 117 million units of chipsets, surpassing Apple’s 78 million and Qualcomm’s 69 million units. Noteworthy competitors in the smartphone SoC sector include Google, Samsung, and Unisoc. MediaTek’s smartphone shipments for the year exhibited a 21% year-on-year increase, amounting to $23 billion in revenue. Despite this, Apple’s revenue from shipments reached $87 billion, overshadowing MediaTek. Qualcomm also surpassed MediaTek with shipments valued at $30 billion in 2023.

    Market Dynamics and Competitors

    The Canalys report reveals a 2% decline in Qualcomm’s SoC shipment revenue from the previous year. Samsung experienced a significant 44% decrease in earnings from its Exynos chips, suggesting potential for improvement with chips from other providers in Q4 2023. This decline accounted for approximately 40% of Qualcomm’s returns and 25% of MediaTek’s figures for the quarter. Notably, Xiaomi emerged as a key buyer of Qualcomm chipsets, representing 25% of purchases. While Xiaomi also contributed about 20% of MediaTek chipsets shipped in Q4 2023, Samsung stood out as the primary customer for the vendor.

    Emerging Players and Growth Prospects

    Huawei made a substantial impact in the market in 2023 as per the Canalys report. With a remarkable 5,121% surge, the Chinese OEM shipped 7 million units and generated $7 billion in revenue, largely fueled by its new Kirin SoCs. Unisoc also demonstrated strong potential for growth, with a 24% increase in revenues year-on-year totaling $3 billion, alongside 27 million units shipped. The primary clientele of Unisoc included brands like Transsion, Realme, and Lenovo. In contrast, Google’s performance in SoC shipments was lackluster with estimated revenues of $2 billion and 3 million units sold, possibly due to the exclusive nature of its Tensor chipsets designed solely for Pixel phones.

    MediaTek Overtakes Apple & Qualcomm as Top Smartphone Chipset Vendor 2023
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  • Qualcomm Snapdragon 7+ Gen 3 Key Specs Revealed

    Qualcomm Snapdragon 7+ Gen 3 Key Specs Revealed

    Qualcomm is on the brink of introducing the Snapdragon 7+ Gen 3 processor, promising a remarkable leap in performance compared to its predecessor. Digital Chat Station, a well-known tech leaker, has unveiled crucial information regarding the upcoming chip, shedding light on its impressive clock speeds and architecture.

    Snapdragon 7+ Gen 3 Specifications (Leaked)

    The forthcoming chip, known as SM7675, is set to feature a Cortex-X4 prime core clocked at an astounding 2.9GHz. This boost in frequency, up from the previously reported 2.8GHz, signifies Qualcomm’s commitment to pushing the boundaries within the mid-range segment.

    This notable clock speed aligns with the prime core of the flagship Snapdragon 8 Gen 3, hinting that the 7+ Gen 3 could potentially deliver performance levels akin to high-end processors. Additionally, the chip’s architecture is reported to mirror that of the Snapdragon 8 Gen 3, with a “1+4+3” core configuration. The four A720 middle cores are anticipated to operate at 2.6GHz, while the three A520 efficient cores are likely to be clocked at 1.9GHz. The GPU will be equipped with an Adreno 732 GPU, promising improved graphics performance.

    OnePlus Ace 3V and Snapdragon 7+ Gen 3

    Earlier rumors had hinted that the OnePlus Ace 3V might be equipped with the SM7675 chip, potentially making it the first device to showcase the capabilities of the Snapdragon 7+ Gen 3. The Ace 3V is also expected to feature a flat OLED 1.5K 8T LTPO display with a 120Hz refresh rate, 16GB of RAM, a 5500mAh battery, and support for 100W fast charging, positioning it as a competitive player in the mid-range market.

    Qualcomm introduced the Snapdragon 7 Gen 3 processor last year, falling short in terms of power compared to its predecessor, the Snapdragon 7+ Gen 2. The latter featured a “1+3+4” architecture, incorporating a high-performance ARM Cortex-X2 core (up to 2.91 GHz), three mid-range ARM Cortex-A710 cores (up to 2.49 GHz), and four efficient ARM Cortex-A510 cores (up to 1.8 GHz).

    Future Possibilities with Snapdragon Chips

    The leaked information suggests that the SM7675 may not be the only chip based on this architecture. Speculations point towards another chip, codenamed SM8635, potentially being a variant with different frequencies based on the SM7675 architecture. These revelations align with earlier statements from Ice Universe, a prominent tech leaker, who indicated that Qualcomm might launch these chips by March 2024. Both chips, internally dubbed “Cliffs” at Qualcomm, are rumored to inherit the architecture of the Snapdragon 8 Gen 3, expanding the range of options available to manufacturers.

    Qualcomm Snapdragon 7+ Gen 3 Key Specs Revealed

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  • Qualcomm Reveals 5G Future: Snapdragon X80 Modem & FastConnect 7900 at MWC 2024

    Qualcomm Reveals 5G Future: Snapdragon X80 Modem & FastConnect 7900 at MWC 2024

    The heart of technology is beating at the MWC 2024 held in Barcelona. Many companies from around the world are showcasing their latest products and services at this fair. As Gizmochina, we are closely following the event and bringing you updates. One of the companies making a presence at MWC is Qualcomm. The company announced the Snapdragon X80 5G modem, FastConnect 7900, and much more at the event. Here are the details…

    Qualcomm Unveils Snapdragon X80 5G Modem, FastConnect 7900 and More

    At the MWC 2024, Qualcomm has introduced the next generation 5G modem and connectivity systems that will further advance the mobile world. Standout innovations among these include the Snapdragon X80 5G Modem-RF System and the FastConnect 7900 Mobile Connectivity System.

    Snapdragon X80 5G Modem: Pushing Boundaries

    The Snapdragon X80 modem pushes the boundaries of 5G speeds with capabilities for up to 10 Gbps download and 3.5 Gbps upload. It also incorporates 5G Advanced support for greater network capacity, reliability, and reduced latency. AI-powered optimizations further enhance its performance and power efficiency. This modem system is intended for use in a wide array of devices such as smartphones, mobile broadband devices, computers, XR devices, automobiles, industrial IoT, and fixed wireless access points.

    FastConnect 7900: Integrating Technologies

    The FastConnect 7900 Mobile Connectivity System stands out as the first chip to integrate Wi-Fi 7, Bluetooth, and Ultra Wideband technologies. Its Wi-Fi 7 support enables data speeds up to 5.8 Gbps for a faster, and more seamless wireless experience. Enhanced Bluetooth 5.4 and UWB capabilities improve precision for location-based services and proximity communications. This system’s low-power design contributes to longer battery life for devices.

    Additionally, Qualcomm introduced the Qualcomm AI Hub designed to drive next-generation AI-based connectivity experiences. The AI Hub can work seamlessly with the Snapdragon X80 modem, FastConnect 7900 system, as well as other Qualcomm platforms.

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  • Qualcomm Snapdragon X Elite Chip Appears on Geekbench

    Qualcomm Snapdragon X Elite Chip Appears on Geekbench

    Recently, a new Qualcomm chip, identified as model number Qualcomm ZH-WXX and thought to be the Snapdragon X Elite, made an appearance on the Geekbench benchmarking platform. This chip showcased impressive performance metrics with a single-core score of 2574 and a multi-core score of 12562. It was tested on a device operating on Microsoft Windows 11, equipped with a 12-core CPU at 4.01 GHz, and 32GB of RAM.

    In October 2023, Qualcomm introduced the Snapdragon X Elite, which features the custom-designed Qualcomm Oryon CPU. The chip is built on a TSMC’s 4nm process node, featuring 12 cores and 64-bit architecture. It boasts a base clock speed of 3.8GHz, with the capability to reach up to 4.3GHz in dual-core turbo frequency.

    Performance Boost with Snapdragon X Elite

    The company positions this CPU as a trailblazer in mobile computing, claiming it delivers up to twice the CPU performance of its competitors. It achieves this heightened level of performance at peak power while consuming only a third of the energy.

    AI Processing Capabilities of Snapdragon X Elite

    The standout feature of the Snapdragon X Elite is its AI processing capabilities. It is said to be 4.5 times faster in AI processing compared to its rivals, capable of handling complex AI models with over 13 billion parameters directly on the device. This capability enables a smoother user experience, enhancing multitasking and offering intuitive features like AI-powered assistants and advanced video conferencing tools.

    Market Impact and Future Expectations

    The company has made strong claims about the X Elite’s performance, stating it surpasses the Apple M2 Max and Intel Core i7-1355U in single-threaded performance metrics. According to Qualcomm, the X Elite not only outperforms the M2 Max in single-threaded tasks but also achieves peak performance with 30% lower power consumption. In multi-core tasks, it’s said to be 50% faster than the M2.

    Major PC manufacturers such as Dell, Acer, Honor, HP, Lenovo, Samsung, and ASUS are anticipated to release laptops featuring the Snapdragon X Elite starting in mid-2024. Even Xiaomi is reportedly preparing to unveil a new slim laptop, likely from the Redmi G Pro 2024 series, featuring this chip.

    Qualcomm Snapdragon X Elite Chip Appears on Geekbench
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  • Samsung, Google Early Users in Qualcomm’s Snapdragon XR2+ Gen 2 Platform

    Samsung, Google Early Users in Qualcomm’s Snapdragon XR2+ Gen 2 Platform

    Qualcomm Unveils Snapdragon XR2+ Gen 2 Platform Enhancing VR Experience

    One year post the initial collaboration announcement involving Qualcomm, Samsung, and Google within the XR realm, the long-awaited Snapdragon XR2+ Gen 2 platform has been revealed. This updated chipset, which supersedes the XR2 Gen 2 present in the Meta Quest 3, delivers notable enhancements in graphics processing, potentially rivaling the performance prowess of Apple’s forthcoming Vision Pro headset.

    Augmented Resolution and Refresh Rate

    The standout attribute of the XR2+ Gen 2 lies in its support for an impressive 4.3K resolution per eye coupled with a 90fps refresh rate. This marks a substantial upgrade from the XR2 Gen 2’s 3K resolution, promising users a crisper and more engaging virtual reality (VR) encounter.

    Enhanced Tracking Capabilities

    Beyond the enhanced visual encounter, the XR2+ Gen 2 flaunts improved tracking capabilities. With the ability to accommodate up to 12 cameras and robust on-device AI, VR headsets leveraging this platform will proficiently track user movements and surroundings. This advancement should facilitate more seamless navigation and interaction within virtual environments.

    Amplified Processing Capability

    Qualcomm has also made notable progress in terms of processing power with the XR2+ Gen 2. The platform showcases a 15% escalation in GPU frequency and a 20% rise in CPU frequency in comparison to its forerunner. This performance boost equips the chipset to adeptly manage even the most demanding VR applications.

    Collaboration with Goertek for Reference Design

    To hasten VR headset development, Qualcomm has partnered with Goertek to craft a fresh reference design. This pre-configured platform is available in two variants – one powered by the XR2 Gen 2 for a 3K resolution adventure and another fueled by the XR2+ Gen 2 for the full 4K immersion.

    Expansion of Strategic Partnerships

    Qualcomm has affirmed that the novel Snapdragon XR2+ Gen 2 chip will find utility in the forthcoming XR innovations from Samsung and Google. Furthermore, the corporation has engaged with at least five other hardware manufacturers, including HTC, to advocate for its latest platform. With Samsung’s Unpacked event drawing near, thrilling VR revelations may be on the horizon as they gear up to rival Apple’s hotly anticipated Vision Pro headset.

    In summary, Qualcomm’s Snapdragon XR2+ Gen 2 platform ushers in significant progress in resolution, refresh rate, tracking capabilities, and processing potency for VR headsets. With collaborative alliances in place to bolster its integration, the landscape is primed for a new chapter of immersive virtual reality escapades.

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  • Qualcomm, MediaTek Choose TSMC Over Samsung for 3nm Tech

    Qualcomm, MediaTek Choose TSMC Over Samsung for 3nm Tech

    TSMC Preferred by Leading Chip Manufacturers

    Prominent chip manufacturers including Nvidia, Qualcomm, MediaTek, and various others have opted for TSMC to produce their upcoming top-tier chipsets. These cutting-edge chipsets will be developed using TSMC’s sophisticated 3nm process technology.

    TSMC Chosen Over Samsung by Qualcomm and MediaTek

    Initially, Qualcomm was rumored to be considering 3nm chip supplies from both Samsung and TSMC for the Qualcomm Snapdragon 8 Gen 4 SoC. However, according to a new report from China Times, industry behemoths MediaTek and Qualcomm have opted to partner with TSMC for its second-generation 3nm process (N3E). This process is slated for the production of the Dimensity 9400 and Snapdragon 8 Gen 4 chipsets.

    Apple’s Dependence on TSMC

    Apple, a key client for TSMC, is set to leverage its 3nm process line for the forthcoming M series and A series chipsets. Presently, Apple is utilizing TSMC’s first-generation 3nm process (N3B) in the A17 Pro processor, which energizes the iPhone 15 Pro series. However, Samsung Foundry is still seeking significant clients for its 3nm chip manufacturing technology.

    Shifting Landscape of Chipset Manufacture

    Historically, companies like Qualcomm, MediaTek, Apple, and Nvidia have turned to Samsung Foundry for their chipset requirements, albeit not always for flagship processors. With Samsung’s introduction of advanced 3nm process technology, it aimed to attract orders from these companies. Nonetheless, the transition to TSMC appears to be progressing slower than expected.

    In essence, leading chip manufacturers such as Nvidia, Qualcomm, MediaTek, and Apple are choosing TSMC for the production of their upcoming top-tier chipsets. While Samsung Foundry was initially anticipated to be a strong contender, it has not yet secured major clients for its 3nm chip manufacturing capabilities. TSMC’s advanced 3nm process technology is emerging as the preferred option among these industry giants.

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