Tag: Qualcomm

  • Introducing Snapdragon 7+ Gen 3 SoC: On-Device GenAI Capabilities

    Introducing Snapdragon 7+ Gen 3 SoC: On-Device GenAI Capabilities

    Qualcomm recently unveiled the Snapdragon 8s Gen 3 processor, a streamlined version of the flagship Snapdragon 8 Gen 3. Now, the American chipmaker has introduced a new mid-range System on Chip (SoC) that joins the Snapdragon 7 Gen 3 lineup. The latest addition is the Snapdragon 7+ Gen 3, serving as the successor to last year's Snapdragon 7+ Gen 2. This new chipset brings various enhancements, particularly in the realm of artificial intelligence (AI), indicating that devices powered by this SoC will boast advanced AI features.

    Snapdragon 7+ Gen 3 Unveiled

    The Snapdragon 7+ Gen 3 retains TSMC's 4nm process, similar to its predecessor. It shares the same CPU architecture as the flagship Snapdragon 8 Gen 3, comprising a prime core, four performance cores, and three efficiency cores. Notably, the prime core reaches a maximum speed of 2.8GHz. Qualcomm claims that this chipset offers a 15% improvement in CPU performance, a 45% boost in GPU performance, and a 15% enhancement in power efficiency.

    Enhanced Connectivity and AI Capabilities

    Equipped with an integrated X63 5G modem and FastConnect 7800 mobile connectivity system, the Snapdragon 7+ Gen 3 can achieve peak download speeds of up to 4.2 Gbps and supports WiFi-7 connectivity. One of its standout features is the support for on-device generative AI capabilities, enabling a wide array of large language models (LLM) like Baichuan-7B, Llama 2, and Gemini Nano. This empowers devices using this chipset to enhance virtual assistant functionalities and offer additional AI-powered features, including multi-language translation and transcription.

    Impressive Features and Specifications

    The Snapdragon 7+ Gen 3 boasts an 18-bit triple cognitive Image Signal Processor (ISP) and can capture images up to 200MP. Notable features include Snapdragon Low Light Vision and advanced audio capabilities such as Spatial Audio with head tracking, Snapdragon Sound technology, aptX Lossless, and LE audio support. This chipset can accommodate up to QHD+ display resolution at a 120Hz refresh rate, along with supporting up to 24GB LPDDR5x RAM and a UFS 4.0 storage system.

    The OnePlus Ace 3V has already been introduced in China, featuring the Snapdragon 7+ Gen 3 processor, showcasing the capabilities of this new mid-range SoC.

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  • Next-Gen Snapdragon “Pakala” Chip and Reference Device Unveiled in New Qualcomm Video

    Next-Gen Snapdragon “Pakala” Chip and Reference Device Unveiled in New Qualcomm Video

    Qualcomm had previously declared its intention to unveil the Snapdragon 8 Gen 4 later this year. In a recent YouTube video released by the company, keen observers were able to identify the codename of the upcoming chipset as well as the reference device. Let’s delve into the details.

    Snapdragon 8 Gen 4 Details Unveiled
    In a video titled “Behind the Silicon: Snapdragon X”, Qualcomm inadvertently revealed the moniker of the upcoming Snapdragon 8 Gen 4, which goes by the name “Pakala”. Just before the codename was spotted, viewers caught a glimpse of the reference device being utilized in the video. However, the video primarily focuses on the Snapdragon X Elite rather than the Snapdragon 8 Gen 4.

    Exciting Updates on Snapdragon 8 Gen 4
    It was previously speculated that the Snapdragon 8 Gen 4 would be identified as “Sun” on benchmarking platforms and as “Pakala” for the hardware, a speculation that has now been confirmed. This upcoming chipset from Qualcomm is highly awaited and signifies a significant chip redesign for the brand, not just a routine annual release of its top-of-the-line mobile Application Processor (AP). The Snapdragon 8 Gen 4 is reportedly transitioning from ARM cores to Qualcomm’s proprietary Oryon cores.

    Anticipated Performance and Features
    There are rumors circulating that suggest the Snapdragon 8 Gen 4 could potentially outperform the Apple A18 Pro chipset, although this remains unverified at the present time. Initial information indicates that the Snapdragon 8 Gen 4 might also offer support for LPDDR6 memory. The official unveiling of the chipset is scheduled for October 2024, so stay tuned for further developments.

    Next-Gen Snapdragon “Pakala” Chip and Reference Device Unveiled in New Qualcomm Video
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  • Introducing Snapdragon 7+ Gen 3 SoC: On-Device GenAI Features

    Introducing Snapdragon 7+ Gen 3 SoC: On-Device GenAI Features

    Qualcomm has recently unveiled the Snapdragon 8s Gen 3 processor, a streamlined variant of the flagship Snapdragon 8 Gen 3. In addition to this, the American chipmaker has introduced a new mid-range System on Chip (SoC) that joins the Snapdragon 7 Gen 3 family. This latest addition is known as the Snapdragon 7+ Gen 3, serving as the successor to the Snapdragon 7+ Gen 2 from the previous year. The Snapdragon 7+ Gen 3 brings forth a variety of enhancements, particularly in the realm of Artificial Intelligence (AI), indicating that devices powered by this chipset will incorporate advanced AI functionalities.

    Snapdragon 7+ Gen 3 Unveiled

    The Snapdragon 7+ Gen 3 retains the 4nm process technology from TSMC, similar to its predecessor. Its CPU architecture mirrors that of the flagship Snapdragon 8 Gen 3, comprising of a prime core, four performance cores, and three efficiency cores. Notably, the prime core reaches a maximum clock speed of 2.8GHz. Qualcomm asserts that this chipset offers a 15% improvement in CPU performance, 45% in GPU performance, and a 15% boost in power efficiency.

    Enhanced Features and Connectivity

    Equipped with an integrated X63 5G modem and the FastConnect 7800 mobile connectivity system, the Snapdragon 7+ Gen 3 can achieve peak download speeds of up to 4.2 Gbps while also supporting WiFi-7 technology.

    On-Device AI Capabilities

    One of the standout features of the Snapdragon 7+ Gen 3 is its on-device generative AI capabilities. This platform supports a diverse array of large language models (LLM) like Baichuan-7B, Llama 2, and Gemini Nano, enhancing virtual assistant functionalities, multi-language translation, and transcription capabilities for smartphones powered by this chipset.

    Photography and Audio Capabilities

    Featuring an 18-bit triple cognitive Image Signal Processor (ISP) that can capture images up to 200MP, the Snapdragon 7+ Gen 3 boasts additional features such as Snapdragon Low Light Vision. On the audio front, it supports Spatial Audio with head tracking, Snapdragon Sound technology, aptX Lossless, LE audio, and more. The chipset is capable of accommodating up to QHD+ display resolution at a refresh rate of 120Hz, and it supports up to 24GB of LPDDR5x RAM and a UFS 4.0 storage system.

    OnePlus Ace 3V Debut

    The OnePlus Ace 3V has already made its entrance in the Chinese market, featuring the Snapdragon 7+ Gen 3 processor.

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  • Snapdragon 8s Gen 3 SoC Launch: Supports 1080p 240FPS Video Recording

    Snapdragon 8s Gen 3 SoC Launch: Supports 1080p 240FPS Video Recording

    Qualcomm recently held a media event to unveil the latest Snapdragon 8s Gen 3 SoCs, a variant of the flagship Snapdragon 8 Gen 3 chip. This new chip retains key features like hardware-accelerated ray tracing, enhancing visual quality in games and apps by improving lighting, shadows, and reflections. Additionally, it incorporates the Adreno Frame Motion Engine 2.0 to potentially double game frame rates from 60fps to 120fps.

    Enhanced Features and Performance

    The CPU configuration comprises a Cortex-X4 prime core, four Cortex A720 cores, and three Cortex-A520 cores running at speeds of 3.0GHz, 2.8GHz, and 2.0GHz, respectively. Supporting up to 24GB LPDDR5x RAM clocked at 4,200MHz, it boasts an 18-bit triple cognitive ISP for image and video processing tasks. The chip offers various capabilities like always-on camera, photo enhancement, and 4K HDR video recording at 60FPS.

    Advanced Connectivity and AI Capabilities

    The Snapdragon 8s Gen 3 integrates the FastConnect 7800 Mobile Connectivity System, Wi-Fi 7 with HBS, Snapdragon X70 5G-Modem RF System, and 5G AI processor. It supports Release 17 5G, promising improved performance and broader coverage. On-device generative AI features include AI image generation and support for up to 10 billion parameters, catering to diverse AI applications.

    Adoption by Global Brands

    Qualcomm has announced partnerships with leading global OEMs and brands like HONOR, iQOO, realme, Redmi, and Xiaomi, who will incorporate the Snapdragon 8s Gen 3 platform into their upcoming devices. The first product launch utilizing this platform is anticipated in March.

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  • Qualcomm’s Upcoming Snapdragon Chip Launch Event on March 18: Expectations for 8s Gen 3 & 7+ Gen 3

    Qualcomm’s Upcoming Snapdragon Chip Launch Event on March 18: Expectations for 8s Gen 3 & 7+ Gen 3

    Qualcomm is gearing up for a product launch event scheduled for 14:30 on March 18th to introduce its highly anticipated Snapdragon flagship system-on-a-chip (SoC). The event's theme revolves around the concept that "Intelligence is in the core, and there is a dragon in it."

    Rumors circulating suggest that Qualcomm is set to reveal the Snapdragon 7+ Gen 3 (SM7675) and Snapdragon 8s Gen 3 (SM8635) chips during this upcoming event. These chips, internally referred to as "Cliffs," are believed to offer different variations of the same core technology, sharing the architecture of the Snapdragon 8 Gen 3.

    Speculated Chip Specifications

    Here's an overview of the rumored specifications for both the Snapdragon 7+ Gen 3 and Snapdragon 8s Gen 3, compared to the Snapdragon 8 Gen 3:

    ChipBig CoreMedium CoreSmall CoreGPU
    7+ Gen 31*2.9GHz Cortex-X44*2.6GHz Cortex-A723*1.9GHz Cortex-A52Adreno 732
    8s Gen 31*3.01GHz Cortex-X44*2.61GHz Cortex-A723*1.84GHz Cortex-A52Adreno 735
    8 Gen 31*3.3GHz Cortex-X43*3.25GHz Cortex-A722*2.27GHz Cortex-A52Adreno 750

    Potential Devices with New Processors

    There is speculation about upcoming devices that could potentially feature these new processors. Some of the devices that might be equipped with either the Snapdragon 8s Gen 3 or Snapdragon 7+ Gen 3 processors include:

    • Realme GT Neo6 series (Snapdragon 8s Gen 3 or Snapdragon 7+ Gen 3)
    • Redmi Note 13 Turbo (Snapdragon 8s Gen 3)
    • Xiaomi Civi 4 (Snapdragon 8s Gen 3)
    • OnePlus Ace 3V (Snapdragon 7+ Gen 3)
    • Vivo Pad 3 (Snapdragon 8s Gen 3)
    • iQOO Neo 9 series new devices (Snapdragon 8s Gen 3)

    To get concrete details on these specifications and device lineups, we will have to await Qualcomm's official event on March 18th.

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  • Samsung Galaxy Book 4 Edge Excels in Geekbench with Snapdragon X Elite

    Samsung Galaxy Book 4 Edge Excels in Geekbench with Snapdragon X Elite

    Samsung recently unveiled its Galaxy Book 4 series globally, but there’s a new arrival on the scene that’s caught attention – the Samsung Galaxy Book 4 Edge. This mysterious newcomer has made an appearance on the Geekbench benchmarking platform, teasing some intriguing details about the upcoming device.

    Samsung Galaxy Book 4 Edge Specifications

    The Galaxy Book 4 Edge surprises with Qualcomm’s latest Snapdragon X Elite processor coupled with a substantial 16GB of RAM, all while operating on Windows 11 Home (64-bit).

    The benchmark not only reveals Samsung’s collaboration with Qualcomm for laptops but also suggests a delay in deploying Samsung’s Exynos chips for larger devices. This move seems sensible as Samsung is presently concentrating on optimizing the Exynos line for smartphones.

    Impressive Performance Metrics

    The Galaxy Book 4 Edge, powered by the Snapdragon X Elite, impresses with Geekbench 6.2.2. scores of 2,706 points in single-core and an outstanding 12,646 points in multi-core tests, showcasing its robust performance capabilities.

    When compared, the Snapdragon X Elite surpasses Apple’s M1 and M2 chips but falls short against the newer M3 (excluding the M Pro line).

    Qualcomm’s Chip in the Market

    A direct comparison between the Snapdragon X Elite and Apple’s M-series chips is complex due to the inherent differences between Windows 11 on ARM and MacOS. Apple’s superior software optimization for its M-chips gives it an advantage, highlighting the significance of real-world performance beyond benchmarks.

    Rumors suggest that Qualcomm’s new chip might feature in Microsoft’s upcoming Surface Laptop 6 and Surface Pro 10, potentially positioning Samsung as a direct rival to Microsoft’s established Surface lineup.

    Samsung’s Strategic Partnership

    Samsung’s decision to collaborate with Qualcomm for its premium laptop lineup, including the Galaxy Book 4 Edge, is unexpected, considering Qualcomm’s recent foray into the consumer PC chip market.

    Samsung Galaxy Book 4 Edge Excels in Geekbench with Snapdragon X Elite
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  • MediaTek Overtakes Apple & Qualcomm as Top Smartphone Chipset Vendor 2023

    MediaTek Overtakes Apple & Qualcomm as Top Smartphone Chipset Vendor 2023

    Chipmaker MediaTek has been recognized as the leading System on Chip (SoC) vendor by the close of 2023. Known for developing the fastest smartphone processor currently available, MediaTek’s Dimensity 9300 and other chipsets have secured a significant share in the smartphone market.

    MediaTek’s Dominance in the SoC Market

    A recent report from Canalys sheds light on MediaTek’s ascent as the preferred SoC vendor in 2023. In the fourth quarter of the year, MediaTek sold 117 million units of chipsets, surpassing Apple’s 78 million and Qualcomm’s 69 million units. Noteworthy competitors in the smartphone SoC sector include Google, Samsung, and Unisoc. MediaTek’s smartphone shipments for the year exhibited a 21% year-on-year increase, amounting to $23 billion in revenue. Despite this, Apple’s revenue from shipments reached $87 billion, overshadowing MediaTek. Qualcomm also surpassed MediaTek with shipments valued at $30 billion in 2023.

    Market Dynamics and Competitors

    The Canalys report reveals a 2% decline in Qualcomm’s SoC shipment revenue from the previous year. Samsung experienced a significant 44% decrease in earnings from its Exynos chips, suggesting potential for improvement with chips from other providers in Q4 2023. This decline accounted for approximately 40% of Qualcomm’s returns and 25% of MediaTek’s figures for the quarter. Notably, Xiaomi emerged as a key buyer of Qualcomm chipsets, representing 25% of purchases. While Xiaomi also contributed about 20% of MediaTek chipsets shipped in Q4 2023, Samsung stood out as the primary customer for the vendor.

    Emerging Players and Growth Prospects

    Huawei made a substantial impact in the market in 2023 as per the Canalys report. With a remarkable 5,121% surge, the Chinese OEM shipped 7 million units and generated $7 billion in revenue, largely fueled by its new Kirin SoCs. Unisoc also demonstrated strong potential for growth, with a 24% increase in revenues year-on-year totaling $3 billion, alongside 27 million units shipped. The primary clientele of Unisoc included brands like Transsion, Realme, and Lenovo. In contrast, Google’s performance in SoC shipments was lackluster with estimated revenues of $2 billion and 3 million units sold, possibly due to the exclusive nature of its Tensor chipsets designed solely for Pixel phones.

    MediaTek Overtakes Apple & Qualcomm as Top Smartphone Chipset Vendor 2023
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  • Qualcomm Snapdragon 7+ Gen 3 Key Specs Revealed

    Qualcomm Snapdragon 7+ Gen 3 Key Specs Revealed

    Qualcomm is on the brink of introducing the Snapdragon 7+ Gen 3 processor, promising a remarkable leap in performance compared to its predecessor. Digital Chat Station, a well-known tech leaker, has unveiled crucial information regarding the upcoming chip, shedding light on its impressive clock speeds and architecture.

    Snapdragon 7+ Gen 3 Specifications (Leaked)

    The forthcoming chip, known as SM7675, is set to feature a Cortex-X4 prime core clocked at an astounding 2.9GHz. This boost in frequency, up from the previously reported 2.8GHz, signifies Qualcomm’s commitment to pushing the boundaries within the mid-range segment.

    This notable clock speed aligns with the prime core of the flagship Snapdragon 8 Gen 3, hinting that the 7+ Gen 3 could potentially deliver performance levels akin to high-end processors. Additionally, the chip’s architecture is reported to mirror that of the Snapdragon 8 Gen 3, with a “1+4+3” core configuration. The four A720 middle cores are anticipated to operate at 2.6GHz, while the three A520 efficient cores are likely to be clocked at 1.9GHz. The GPU will be equipped with an Adreno 732 GPU, promising improved graphics performance.

    OnePlus Ace 3V and Snapdragon 7+ Gen 3

    Earlier rumors had hinted that the OnePlus Ace 3V might be equipped with the SM7675 chip, potentially making it the first device to showcase the capabilities of the Snapdragon 7+ Gen 3. The Ace 3V is also expected to feature a flat OLED 1.5K 8T LTPO display with a 120Hz refresh rate, 16GB of RAM, a 5500mAh battery, and support for 100W fast charging, positioning it as a competitive player in the mid-range market.

    Qualcomm introduced the Snapdragon 7 Gen 3 processor last year, falling short in terms of power compared to its predecessor, the Snapdragon 7+ Gen 2. The latter featured a “1+3+4” architecture, incorporating a high-performance ARM Cortex-X2 core (up to 2.91 GHz), three mid-range ARM Cortex-A710 cores (up to 2.49 GHz), and four efficient ARM Cortex-A510 cores (up to 1.8 GHz).

    Future Possibilities with Snapdragon Chips

    The leaked information suggests that the SM7675 may not be the only chip based on this architecture. Speculations point towards another chip, codenamed SM8635, potentially being a variant with different frequencies based on the SM7675 architecture. These revelations align with earlier statements from Ice Universe, a prominent tech leaker, who indicated that Qualcomm might launch these chips by March 2024. Both chips, internally dubbed “Cliffs” at Qualcomm, are rumored to inherit the architecture of the Snapdragon 8 Gen 3, expanding the range of options available to manufacturers.

    Qualcomm Snapdragon 7+ Gen 3 Key Specs Revealed

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  • Qualcomm Reveals 5G Future: Snapdragon X80 Modem & FastConnect 7900 at MWC 2024

    Qualcomm Reveals 5G Future: Snapdragon X80 Modem & FastConnect 7900 at MWC 2024

    The heart of technology is beating at the MWC 2024 held in Barcelona. Many companies from around the world are showcasing their latest products and services at this fair. As Gizmochina, we are closely following the event and bringing you updates. One of the companies making a presence at MWC is Qualcomm. The company announced the Snapdragon X80 5G modem, FastConnect 7900, and much more at the event. Here are the details…

    Qualcomm Unveils Snapdragon X80 5G Modem, FastConnect 7900 and More

    At the MWC 2024, Qualcomm has introduced the next generation 5G modem and connectivity systems that will further advance the mobile world. Standout innovations among these include the Snapdragon X80 5G Modem-RF System and the FastConnect 7900 Mobile Connectivity System.

    Snapdragon X80 5G Modem: Pushing Boundaries

    The Snapdragon X80 modem pushes the boundaries of 5G speeds with capabilities for up to 10 Gbps download and 3.5 Gbps upload. It also incorporates 5G Advanced support for greater network capacity, reliability, and reduced latency. AI-powered optimizations further enhance its performance and power efficiency. This modem system is intended for use in a wide array of devices such as smartphones, mobile broadband devices, computers, XR devices, automobiles, industrial IoT, and fixed wireless access points.

    FastConnect 7900: Integrating Technologies

    The FastConnect 7900 Mobile Connectivity System stands out as the first chip to integrate Wi-Fi 7, Bluetooth, and Ultra Wideband technologies. Its Wi-Fi 7 support enables data speeds up to 5.8 Gbps for a faster, and more seamless wireless experience. Enhanced Bluetooth 5.4 and UWB capabilities improve precision for location-based services and proximity communications. This system’s low-power design contributes to longer battery life for devices.

    Additionally, Qualcomm introduced the Qualcomm AI Hub designed to drive next-generation AI-based connectivity experiences. The AI Hub can work seamlessly with the Snapdragon X80 modem, FastConnect 7900 system, as well as other Qualcomm platforms.

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  • Qualcomm Snapdragon X Elite Chip Appears on Geekbench

    Qualcomm Snapdragon X Elite Chip Appears on Geekbench

    Recently, a new Qualcomm chip, identified as model number Qualcomm ZH-WXX and thought to be the Snapdragon X Elite, made an appearance on the Geekbench benchmarking platform. This chip showcased impressive performance metrics with a single-core score of 2574 and a multi-core score of 12562. It was tested on a device operating on Microsoft Windows 11, equipped with a 12-core CPU at 4.01 GHz, and 32GB of RAM.

    In October 2023, Qualcomm introduced the Snapdragon X Elite, which features the custom-designed Qualcomm Oryon CPU. The chip is built on a TSMC’s 4nm process node, featuring 12 cores and 64-bit architecture. It boasts a base clock speed of 3.8GHz, with the capability to reach up to 4.3GHz in dual-core turbo frequency.

    Performance Boost with Snapdragon X Elite

    The company positions this CPU as a trailblazer in mobile computing, claiming it delivers up to twice the CPU performance of its competitors. It achieves this heightened level of performance at peak power while consuming only a third of the energy.

    AI Processing Capabilities of Snapdragon X Elite

    The standout feature of the Snapdragon X Elite is its AI processing capabilities. It is said to be 4.5 times faster in AI processing compared to its rivals, capable of handling complex AI models with over 13 billion parameters directly on the device. This capability enables a smoother user experience, enhancing multitasking and offering intuitive features like AI-powered assistants and advanced video conferencing tools.

    Market Impact and Future Expectations

    The company has made strong claims about the X Elite’s performance, stating it surpasses the Apple M2 Max and Intel Core i7-1355U in single-threaded performance metrics. According to Qualcomm, the X Elite not only outperforms the M2 Max in single-threaded tasks but also achieves peak performance with 30% lower power consumption. In multi-core tasks, it’s said to be 50% faster than the M2.

    Major PC manufacturers such as Dell, Acer, Honor, HP, Lenovo, Samsung, and ASUS are anticipated to release laptops featuring the Snapdragon X Elite starting in mid-2024. Even Xiaomi is reportedly preparing to unveil a new slim laptop, likely from the Redmi G Pro 2024 series, featuring this chip.

    Qualcomm Snapdragon X Elite Chip Appears on Geekbench
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