MediaTek

Dimensity 8300 Revealed by MediaTek, Equipped with Cutting-edge Generative AI Abilities

Dimensity 8300 Revealed by MediaTek, Equipped with Cutting-edge Generative AI Abilities

MediaTek Announces Dimensity 8300: A Powerful Chip for Mid-Range Smartphones Taiwanese semiconductor company MediaTek has recently unveiled its latest offering, the Dimensity 8300 system-on-a-chip (SoC). Designed specifically for mid-range smartphones, this new chip boasts significant improvements in performance, efficiency, and AI capabilities. Enhanced Performance and Efficiency The Dimensity 8300 is built on a second-generation TSMC 4nm […]

Dimensity 8300 Revealed by MediaTek, Equipped with Cutting-edge Generative AI Abilities Read More »

The Significance of Vivo in Influencing MediaTek Dimensity 9400 Chipset

The Significance of Vivo in Influencing MediaTek Dimensity 9400 Chipset

Vivo’s Role in Advancing MediaTek’s Dimensity Series Vivo has established itself as a key player in the development of MediaTek’s flagship chips, particularly in the field of artificial intelligence (AI). While the collaboration between Vivo and MediaTek on the Dimensity 9300 chip was already known, a recent report by CNMO reveals that Vivo is also actively

The Significance of Vivo in Influencing MediaTek Dimensity 9400 Chipset Read More »

Discover the Future: Oppo Reno 11, Honor 100, and More

Discover the Future: Oppo Reno 11, Honor 100, and More

Red Magic 6S Pro The upcoming debut from Red Magic is slated to be the Red Magic 6S Pro. This smartphone designed for gaming enthusiasts is expected to be equipped with Qualcomm’s most recent Snapdragon 888 Plus chipset. Reports suggest it will boast a high-refresh-rate screen and a generous battery capacity, catering to extended gaming sessions.

Discover the Future: Oppo Reno 11, Honor 100, and More Read More »

New information reveals MediaTek's Dimensity 8300 specs featuring an advanced 4nm fabrication process

New information reveals MediaTek’s Dimensity 8300 specs featuring an advanced 4nm fabrication process

MediaTek Dimensity 8300: A Closer Look at the Specifications After the successful launch of Dimensity 9300, MediaTek is all set to unveil its latest smartphone chipset, the Dimensity 8300, on November 21. As the release date approaches, more details about the chipset have started to emerge. Renowned tipster Digital Chat Station has recently provided a comprehensive

New information reveals MediaTek’s Dimensity 8300 specs featuring an advanced 4nm fabrication process Read More »

Anticipated Launch of Snapdragon 7 Gen 3 and Dimensity 8300 within the Next 14 Days

Anticipated Launch of Snapdragon 7 Gen 3 and Dimensity 8300 within the Next 14 Days

Qualcomm and MediaTek are set to release their latest flagship processors, the Snapdragon 8 Gen 3 and Dimensity 9300. However, recent leaks suggest that both companies are also preparing to announce sub-flagship chipsets, namely the Snapdragon 7 Gen 3 and Dimensity 8300. Snapdragon 7 Gen 3 and Dimensity 8300 Launch Timeframe According to tipster WHY LAB,

Anticipated Launch of Snapdragon 7 Gen 3 and Dimensity 8300 within the Next 14 Days Read More »

MediaTek and OPPO Spearhead Innovations in On-Device AI Ecosystem

MediaTek and OPPO Spearhead Innovations in On-Device AI Ecosystem

In a remarkable alliance, global semiconductor frontrunner MediaTek, smartphone technology powerhouse OPPO, and the robust operating system ColorOS have intertwined their expertise to foster a lightweight large model end-side AI deployment agenda. This pioneering consortium aspires to pioneer the seamless assimilation of large language model proficiencies right at the device’s terminus, heralding a new era of

MediaTek and OPPO Spearhead Innovations in On-Device AI Ecosystem Read More »

Scroll to Top