Tag: MediaTek

  • Ultimate Guide to MediaTek Dimensity Smartphone Chipsets

    Ultimate Guide to MediaTek Dimensity Smartphone Chipsets

    Key Takeaways

    1. Dimensity 9000 Series: The flagship series offers top-tier performance with the Dimensity 9400, utilizing 3nm technology for high efficiency, advanced gaming features, and support for 320MP cameras and 8K video recording.

    2. Dimensity 8000 Series: This upper mid-range series provides strong performance at a lower price point, featuring the Dimensity 8400 with eight Cortex-A725 cores and support for 320MP cameras and 4K video recording.

    3. Dimensity 7000 Series: Targeting the mid-range market, the Dimensity 7350 balances power and efficiency, featuring a combination of Cortex-A715 and Cortex-A510 cores, with support for 200MP cameras and 4K video recording.

    4. Dimensity 6000 Series: Designed for budget-friendly devices, the Dimensity 6400 offers 5G connectivity and decent performance with Cortex-A76 and Cortex-A55 cores, supporting 108MP cameras and efficient battery life.

    5. AI and Connectivity Features: All series incorporate AI enhancements for improved performance in photography and power usage, along with standard 5G connectivity across the board.

    MediaTek has established a strong position in the mobile chipset market, powering a wide range of devices from high-end smartphones to more affordable options. The Dimensity series is continually improving, presenting various processors designed for different levels of performance. Let’s take a detailed look at each series in 2025.

    Dimensity 9000 Series (Flagship)

    At the peak of MediaTek’s offerings, the Dimensity 9000 series provides advanced performance for premium smartphones. The newest addition, the Dimensity 9400, utilizes TSMC’s 3nm N3P technology, maximizing efficiency and power like never before.

    The main part of this octa-core CPU is a powerful Cortex-X925 core that runs at 3.63GHz, accompanied by three Cortex-X4 cores at 3.3GHz and four Cortex-A720 cores at 2.4GHz. The outcome? Lightning-fast performance, whether for gaming, multitasking, or handling demanding applications.

    The Immortalis-G925 GPU takes things further with hardware-accelerated ray tracing, offering console-quality visuals for mobile gamers. Camera features are also stellar, with support for 320MP sensors and 8K video recording at 60fps. The NPU 890 enhances on-device AI, allowing for real-time improvements and smarter processing.

    Dimensity 8000 Series (Upper Mid-Range)

    For those seeking flagship-level power without paying a high price, the Dimensity 8000 series serves as the ideal middle ground. The Dimensity 8400 is made on TSMC’s 4nm N4P process, achieving a fine balance of efficiency and performance.

    This CPU setup consists of eight Cortex-A725 cores, operating at speeds up to 3.25 GHz, which guarantees smooth operation in apps and multitasking. It comes with a Mali-G720 MC7 GPU running at 1.3GHz, ensuring a fluid and responsive gaming experience.

    The series supports LPDDR5X RAM and UFS 4 storage, providing quicker memory speeds and reduced latency. Camera capabilities include support for 320MP sensors and 4K video recording at 60fps, while the integrated AI Processing Unit (APU) bolsters real-time image and voice processing. Naturally, 5G connectivity is standard here.

    Dimensity 7000 Series (Mid-Range)

    The Dimensity 7000 series focuses on offering dependable performance without a hefty price tag. The Dimensity 7350, produced on TSMC’s 4nm technology, combines power and efficiency, featuring two Cortex-A715 cores running at 2.8GHz alongside six Cortex-A510 cores for background tasks.

    Graphics are managed by the Arm Mali-G610 MC4 GPU, which operates at 1.3GHz, providing sufficient capability for gaming and multimedia. This chipset supports LPDDR4x/LPDDR5 RAM and UFS 3.1 for enhanced performance, with camera features supporting 200MP sensors and 4K video recording at 60fps.

    AI enhancements improve various aspects, from photography to power usage, while complete 5G support ensures rapid, low-latency connections.

    Dimensity 6000 Series (Budget)

    MediaTek’s Dimensity 6000 series introduces 5G to the budget-friendly segment without losing important features. The latest Dimensity 6400, constructed on a 6nm process, combines two Cortex-A76 cores at 2.5GHz with six Cortex-A55 cores at 2.0GHz, providing competent everyday performance while managing power use effectively.

    It supports 108MP cameras, dual 16MP sensors, and FHD+ displays (2520 × 1080) with refresh rates reaching 120Hz. Battery life is enhanced by UltraSave 3.0+, which reduces 5G power consumption by as much as 20% compared to other options. Connectivity features include dual 5G, VoNR, and full GNSS support, making it a solid choice in the entry-level market.

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  • MediaTek Dimensity 6400 Launches as Overclocked SoC Upgrade

    MediaTek Dimensity 6400 Launches as Overclocked SoC Upgrade

    Key Takeaways

    1. The Realme P3x 5G will launch as the first smartphone with the Dimensity 6400 chip.
    2. The Dimensity 6400 shares many specs with the previous 6300 model, including Wi-Fi 5, Bluetooth 5.2, and maximum RAM.
    3. The P3x is expected to feature an FHD+ display with a 120Hz refresh rate.
    4. The new chip has slightly improved dual Cortex-A76 cores, clocking up to 2.5GHz compared to 2.4GHz in the 6300.
    5. MediaTek claims the 6400 offers “faster” 5G, but maintains the same top download speed as the 6300, suggesting potential for more budget-friendly devices.

    The Realme P3x 5G is set to launch in less than 24 hours as the first smartphone featuring the Dimensity 6400 chip. MediaTek has already revealed details about this SoC, raising some doubts about the significance of this announcement.

    Specs and Features

    Interestingly, the specifications for the 6400’s Wi-Fi 5, Bluetooth 5.2, and UFS 2.2 storage are identical to those of the 6300. It also shares the same maximum RAM, which is LPDDR4X running at a speed of 2,133MHz, and features the same Arm Mali-G57 GPU.

    Display Expectations

    The P3x is expected to come with an FHD+ display, boasting a 120Hz refresh rate at maximum. The display capabilities of the 6400 haven’t changed from the 6300, so these expectations are not surprising.

    What separates the newer model from its predecessor is that the dual Arm Cortex-A76 cores can clock up to 2.5GHz instead of 2.4GHz, while the six Cortex-A55 cores continue to function at 2.0GHz each.

    Connectivity Hype

    The manufacturer promotes the 6400 as offering “faster” 5G, even though it maintains the same top download speed of 3.3 gigabits per second (Gb/s) for both its standalone and non-standalone global connectivity as the previous model. This might suggest that the new chip could lead to more budget-friendly smartphones.

    We will have a clearer picture when the P3x launches tomorrow (February 18, 2025), which appears to be a new color version of the 14x already for sale on Amazon.in with the 6300 chipset.

    Source:
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  • MediaTek Dimensity 6400: A Rebranded Dimensity 6100+

    MediaTek Dimensity 6400: A Rebranded Dimensity 6100+

    Key Takeaways

    1. The Dimensity 6400 is a minor update to the Dimensity 6300, featuring an overclocked prime core but lacking significant new features.
    2. It uses the same 6nm manufacturing process and octa-core configuration, with two Cortex-A76 cores and six Cortex-A55 cores.
    3. The chipset supports cameras up to 108MP and has memory support for LPDDR4x RAM and UFS 2.2 storage, which are standard for mid-range devices.
    4. Connectivity options include 5G support (SA and NSA), Wi-Fi 5, Bluetooth 5.2, and compatibility with various global navigation systems, but it lacks Wi-Fi 6.
    5. The Realme P3x 5G will be the first smartphone to use the Dimensity 6400, launching on February 18th in India.

    MediaTek has unveiled its latest System on Chip (SoC), the Dimensity 6400. However, there’s not much that’s new about it. This new chip is merely a small update to last year’s Dimensity 6300, featuring an overclocked prime core but not much else that distinguishes it.

    Specifications Overview

    The Dimensity 6400 continues to utilize TSMC’s 6nm manufacturing process and maintains the same octa-core configuration as its predecessor. It even retains the same GPU. It’s also worth noting that the Dimensity 6100+ from 2023 already had similar core specifications. Thus, at best, we can see this as a rebranded version of the 2023 chipset with just a minor increase in clock speed.

    CPU and Performance Details

    This new chip comes with an octa-core structure that includes two Cortex-A76 cores that can reach frequencies of up to 2.5GHz, alongside six Cortex-A55 cores running at 2.0GHz. The only change from the Dimensity 6300 is the slight increase in the frequency of the prime core from 2.4GHz to 2.5GHz, which probably won’t significantly enhance CPU performance. Like many modern SoCs, it supports heterogeneous multi-processing to better manage workloads across its cores.

    For graphics, MediaTek has chosen the Arm Mali-G57 MC2 GPU, which is again the same as the previous model. While this GPU isn’t top-tier, it should handle casual gaming and video watching adequately. The chipset can support displays with a maximum resolution of 2520 x 1080 and a refresh rate of 120Hz.

    Camera and Memory Features

    The Dimensity 6400 is equipped with an Image Signal Processor (ISP) that can handle cameras up to 108MP. For dual-camera configurations, it can support setups of 16MP + 16MP, which is typical for mid-range SoCs. Support for 3D LUT color management is included, but MediaTek has not revealed any notable advancements in computational photography.

    This chip also supports LPDDR4x RAM up to a speed of 2133MHz and UFS 2.2 storage. Although these aren’t the most advanced memory and storage options on the market, they should be sufficient for mid-range devices.

    Connectivity Options

    As anticipated, the Dimensity 6400 supports both SA and NSA 5G, with dual SIM capabilities. It boasts a peak download speed of 3.3Gbps, which is comparable to other mid-range 5G chips. The inclusion of 5G carrier aggregation (CA) and dual Voice over NR (VoNR) ensures that connectivity remains stable, even in areas with poor signal strength.

    The chip features Wi-Fi 5 (802.11ac) with a 1T1R antenna configuration, Bluetooth 5.2, and compatibility with multiple global navigation satellite systems like GPS, BeiDou, Glonass, Galileo, QZSS, and India’s NavIC. Nonetheless, the absence of Wi-Fi 6 could be a downside for those seeking more robust and future-ready connectivity options.

    The Realme P3x 5G has been confirmed as the first smartphone to be powered by the Dimensity 6400, with its launch scheduled for February 18th in India.

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  • Nvidia and MediaTek Aim to Compete with Qualcomm’s AI Smartphone Chip

    Nvidia and MediaTek Aim to Compete with Qualcomm’s AI Smartphone Chip

    Key Takeaways

    1. Nvidia is planning a comeback in the smartphone chip industry through a collaboration with MediaTek, which could lead to the development of high-performance mobile processors.

    2. Both companies are advancing in the PC processor market with an Arm-based chip focused on AI capabilities, expected to use TSMC’s 3nm technology.

    3. MediaTek’s expertise in energy-efficient mobile processors combined with Nvidia’s integrated graphics could result in a successful PC chip, anticipated for release in late 2025.

    4. Nvidia and MediaTek are exploring the possibility of launching an AI chip for smartphones, potentially disrupting the market dominated by Qualcomm and MediaTek.

    5. Nvidia aims to develop energy-efficient GPU cores for mobile processors, building on its past success in the smartphone chip field with products like the Tegra processors.

    Nvidia is said to be planning a comeback in the smartphone chip industry through a collaboration with MediaTek. The two firms are already collaborating on automotive chip developments. In the future, their partnership could grow to include high-performance mobile processors.

    New Developments in PC Processors

    Sources from the industry disclosed in August 2024 that Nvidia and MediaTek are making strides in the PC processor market with an Arm-based chip focused on high-performance AI capabilities. This chip is anticipated to be produced using TSMC’s 3nm fabrication technology.

    This type of processor seems poised for success. MediaTek has a strong background in creating high-performance, energy-efficient mobile processors, while Nvidia can bring its powerful integrated graphics to the table, which will also aid in AI applications. Reports indicate that this PC chip might be available as soon as the latter half of 2025.

    Potential in Smartphone AI Chips

    Recent reports suggest that Nvidia and MediaTek might go beyond just a PC processor and are considering launching an AI chip for smartphones as well. Although specifics about this initiative are limited, it could shake up the market significantly. With Samsung not releasing any high-performance chips lately, Qualcomm and MediaTek are the only players left in the premium segment. Partnering with Nvidia could give MediaTek a significant advantage in terms of graphics capabilities.

    It will be fascinating to observe whether Nvidia can create energy-efficient GPU cores for mobile processors. The company has a history of success in the smartphone chip field—its Tegra processors were once featured in high-end devices such as the LG Optimus 2X and HTC One X. Moreover, we shouldn’t forget its partnership with Nintendo, as the Switch utilizes Nvidia’s chip technology.

     

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  • MediaTek Dimensity 7300 AnTuTu and Geekbench Benchmark Scores

    MediaTek Dimensity 7300 AnTuTu and Geekbench Benchmark Scores

    The Dimensity 7300 is a well-liked chipset found in budget smartphones. Released last year, it powers devices from several brands such as Motorola, Xiaomi, Oppo, Vivo, and Nothing. We may see even more phones featuring this chip in 2025, particularly in the sub-INR 20,000 category.

    Performance Features

    This particular Dimensity chip consists of four performance cores and four efficiency cores. To evaluate its performance and compare it to others, we conducted various benchmarks, including AnTuTu and Geekbench. Although these benchmarks don’t fully represent real-world use, they provide a rough idea of the processor’s abilities.
    Note: The benchmark tests were performed using the CMF Phone (1), which is powered by the MediaTek Dimensity 7300.

    AnTuTu Benchmark Results

    AnTuTu is a popular benchmarking tool that assesses a device by running it through tests that measure CPU, GPU, memory, and user experience (UX). The overall score reflects the device’s complete performance.
    The MediaTek Dimensity 7300 earned a total AnTuTu score of 646,742. Breaking it down, the CPU received 190,224 points, the GPU got 147,556 points, memory scored 144,435 points, and the remaining 164,514 points were attributed to UX.
    AnTuTu Score: 646,742
    CPU: 190,224
    GPU: 147,556
    Memory: 144,435
    UX: 164,514

    Geekbench Performance Insights

    Geekbench assesses a device’s CPU performance through practical scenario tests, which include tasks like image processing, compression, speech recognition, and PDF rendering.
    On the Geekbench (v6) platform, the Dimensity 7300 achieved a score of 1,026 in the single-core test and 2,932 in the multi-core test.
    Geekbench 6
    Single-core: 1,026
    Multi-core: 2,932
    The single-core score indicates how well the CPU performs tasks using just one core, while the multi-core score shows its capability when multiple cores are engaged.

    Gaming Performance

    The MediaTek Dimensity 7300 was also evaluated using the 3DMark Wild Life Stress Test, which measures GPU performance under heavy load. The Mali-G615 CM2 GPU on this chipset demonstrated impressive stability at 98.9%. It recorded the best loop score of 3,126 and the lowest loop score of 3,104.
    3DMark Wild Life Extreme Stress Test
    Best Loop Score: 3,126
    Lowest Loop Score: 3,104
    Stability: 98.9%
    The GPU performs well for budget devices, supporting light gaming, but it may struggle with more demanding games like Genshin Impact and Diablo Immortal.

    Specifications Overview

    MediaTek Dimensity 7300
    Announced: June 2024
    Process Node: 4 nm
    Manufacturer: TSMC
    Cores: 8
    CPU Architecture: 4 x Cortex-A78 @ 2.5 GHz, 4 x Cortex-A55 @ 2 GHz
    GPU: Mali-G615 MC2
    MediaTek HyperEngine
    NPU: MediaTek NPU 655
    Camera: MediaTek Imagiq 950 ISP (12-bit), 200MP single camera
    Memory: LPDDR4X, LPDDR5 (Up to 6400Mbps max frequency)
    Storage: UFS 3.1
    Display: WFHD+ @ 120Hz, Full HD+ @ 144Hz
    Connectivity: MediaTek 5G R16 modem, Downlink: 3.27 Gbps, Wi-Fi 6E, Bluetooth 5.4

    Devices Featuring Dimensity 7300

    Some smartphones utilizing the Dimensity 7300 include:
    – Motorola Edge 50 Neo
    – Realme 14 Pro
    – iQOO Z9s
    – CMF Phone (1)
    – Realme Narzo 70 Turbo
    – Vivo V40e
    – Oppo Reno 12
    – Oppo Reno 12 Pro
    – Realme P1 Speed
    – Realme 13+

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  • Dimensity 8400 Processor Leak: New Cores and Immortalis GPU

    Dimensity 8400 Processor Leak: New Cores and Immortalis GPU

    The anticipated replacement for MediaTek’s Dimensity 8300 series is said to be a cutting-edge 4 nanometer (4nm) chip featuring at least one of ARM’s newest mobile processor cores, as suggested in earlier reports. Recently, the well-known leaker Digital Chat Station has come forward, seemingly substantiating these claims and providing additional intriguing insights.

    Performance Specs

    The Dimensity 8400 is expected to come with a single-core cluster that operates at a remarkable 3.25GHz, along with three additional cores running at 3GHz and four more at 2.15GHz, totaling the usual eight cores. While these specs may seem impressive, it’s worth noting that they are actually slower than those found in the 8300-Ultra. This difference is attributed to the fact that the older model utilized Cortex-A715 or A510 cores, whereas the 8400 will be equipped with newly designed A725 cores, according to the latest information from the well-known leaker.

    Efficiency Insights

    In addition, Digital Chat Station has suggested that none of these cores will focus on efficiency mode. This means the performance is likely aimed at power rather than energy-saving features.

    The new System on Chip (SoC) will also feature a variant of the Immortalis-G720 GPU known as the MC7, which could operate at a speed of 1.3GHz. This upgrade is projected to help the 8400 achieve impressive scores of around 1.8 million on the AnTuTu benchmark.

    Future Devices

    As of now, the first smartphone to utilize the Dimensity 8400 remains unidentified. However, potential candidates include the rumored Oppo Find X8S, which may succeed the Redmi K70E or Realme Neo6 SE. Meanwhile, the expected launch date for this processor is December 23, 2024.

    Source: Link

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  • Dimensity 9400 vs Snapdragon 8 Gen 3: Which Chip is Better?

    Dimensity 9400 vs Snapdragon 8 Gen 3: Which Chip is Better?

    MediaTek has recently unveiled its Dimensity 9400, which promises major improvements compared to its earlier model. Many of MediaTek’s assertions about the chip’s performance are accurate (check out our Dimensity 9400 vs 9300 comparison for further insights). The previous version, Dimensity 9300, did not perform as well as Snapdragon 8 Gen 3 in our benchmarking assessments. Nonetheless, the Dimensity 9400 is shaping up to be a formidable competitor.

    Comparing the Chips

    It will be fascinating to see how the new Dimensity 9400 measures up against the Snapdragon 8 Gen 3. In this article, we will delve into the benchmark statistics for these two chips and highlight their main distinctions.

    To kick off our comparison, let’s take a look at the specifications:

    FeatureDimensity 9400Snapdragon 8 Gen 3
    AnnouncedOctober 2024October 2023
    Model numberMT6991SM8650-AB, SM8650-AC
    Process node3nm4nm
    ManufacturerTSMCTSMC
    CPU1 x Cortex-X925 — 3.63GHz1 x Cortex-X4 — 3.3GHz
    3 x Cortex-X4 — 3.3GHz3 x Cortex-A720 — 3.15GHz
    4 x Cortex-A720 — 2.4GHz2 x Cortex-A720 — 2.96GHz
    2 x Cortex-A520 — 2.27GHz
    GPUArm Immortalis-G925 MC12Adreno 750 GPU
    MediaTek Adaptive Gaming Tech 3.0Support for Unreal Engine 5.2 Lumen
    Global illuminationSnapdragon Game Super Resolution
    NPUMediaTek NPU 890Qualcomm Hexagon NPU
    CameraMediaTek Imagiq 1090 ISPQualcomm Spectra Cognitive Triple 18-bit ISP
    Up to 320MP single cameraUp to 200MP single camera
    Up to 8K/60fps video recording8K/30fps or 4K/120fps video recording
    MemoryLPDDR5X at 10667MbpsLPDDR5x at 4.8GHz
    StorageUFS 4.0 + MCQUFS 4.0
    ConnectivityDownlink: 7.3GbpsDownlink: 7Gbps
    Wi-Fi 7Wi-Fi 7
    Bluetooth 5.4 standardBluetooth 5.4 standard

    Benchmark Results

    [Note: We tested Vivo X200 Pro with Dimensity 9400 and Red Magic 9S Pro with Snapdragon 8 Gen 3 for these benchmark results.]

    Geekbench Comparison
    Geekbench is well-known for assessing CPU performance on devices. In this regard, the Dimensity 9400 has outperformed the Snapdragon 8 Gen 3, achieving over 20% higher scores in both single-core and multi-core tests.

    Dimensity 9400SD 8 Gen 3
    Single core2,7512,273
    Multi core8,7127,054

    AnTuTu Comparison
    AnTuTu is a widely recognized benchmarking tool for evaluating a device’s overall performance. The Dimensity 9400 excels here too, boasting over 35% higher AnTuTu scores compared to the Snapdragon 8 Gen 3.

    Here’s a breakdown of the AnTuTu scores:

    Dimensity 9400SD 8 Gen 3
    AnTuTu score2,927,5652,165,760
    CPU634,512470,836
    GPU1,287,272946,221
    Memory507,889392,652
    UX497,892356,051

    The MediaTek Dimensity 9400 is significantly ahead in these benchmarks against the Snapdragon 8 Gen 3. But how did MediaTek achieve such a remarkable advancement? Let’s explore the core differences below.

    Core Differences

    Both Dimensity 9400 and Snapdragon 8 Gen 3 are produced by TSMC, but their manufacturing nodes differ. The Dimensity 9400 is built on a 3nm process, which provides enhanced performance and energy efficiency compared to the Snapdragon’s 4nm node.

    The Dimensity 9400 utilizes an all-big-core configuration, lacking small cores for efficiency. Conversely, the Snapdragon 8 Gen 3 includes two efficiency cores. The Dimensity features one Cortex-X925 core with a peak frequency of 3.63GHz, three Cortex-X4 cores at 3.3GHz, and four Cortex-A720 cores clocked at 2.4GHz.

    In contrast, the Snapdragon 8 Gen 3 has a single Cortex-X4 prime core at the same clock speed, alongside five Cortex-A720 performance cores (two at 3.15GHz and two at 2.96GHz), plus two Cortex-A520 efficiency cores at 2.27GHz. Because of its larger Cortex-X925 core and all-big-core design, the Dimensity 9400 offers substantially better performance than its rival.

    Even though the Dimensity 9400 is primarily designed for high performance, one might expect increased battery usage, but that’s not actually the case. In tests with Genshin Impact, the Vivo X200 Pro with Dimensity 9400 showed less power consumption than the Xiaomi 14 Ultra, which is powered by Snapdragon 8 Gen 3.

    The Dimensity chip incorporates the new Imagiq 1090 ISP, enabling HDR video capture across the entire zoom range, a first for any flagship chip. It also features AI-driven camera enhancements like Gen-AI Super Resolution and Gen-AI Super Zoom, improving output quality. The latter can achieve up to 100x magnification in photos, retaining clear details.

    MediaTek has also boosted the maximum camera resolution to 320MP (compared to 200MP on Snapdragon 8 Gen 3). It now supports 8K video recording at 60fps natively, while the Snapdragon variant is limited to 8K/30fps recording. Regarding connectivity, the Dimensity chip provides a higher peak download speed, though other connectivity features are quite similar.

    Conclusion

    MediaTek has excelled with the Dimensity 9400. In fact, it stands out as the finest Dimensity chip upgrade in recent years and surpasses the Snapdragon 8 Gen 3 in nearly every aspect. However, this doesn’t suddenly render the Snapdragon 8 Gen 3 an inferior option.

    The Snapdragon 8 Gen 3 remains one of the top smartphone chips available. Regardless of whether you choose Dimensity 9400 or Snapdragon 8 Gen 3, you’ll enjoy an excellent mobile gaming experience. Both chips come equipped with gaming-centric features designed to enhance the user experience, with the MediaTek chip demonstrating better power efficiency.

    If I had to choose one of these options, I would lean towards the Dimensity 9400. However, a great deal on Snapdragon 8 Gen 3 devices would be tough to resist.

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  • Redmi Note 14 Pro 4G Leaks with MediaTek Processor Inside

    Redmi Note 14 Pro 4G Leaks with MediaTek Processor Inside

    Xiaomi’s Redmi Note 14 series was announced last month in China, and now we’re eagerly awaiting their launch worldwide. The Chinese version features three models: the Redmi Note 14 5G, Note 14 Pro 5G, and Note 14 Pro Plus 5G. However, it appears that the global market will see the addition of a new model, the Redmi Note 14 Pro 4G.

    Possible Arrival of Redmi Note 14 Pro 4G

    According to a report from XiaomiTime, there is a listing for this device in the IMEI database. The Redmi Note 14 Pro 4G is identified with the model number 24116RACCG. While the IMEI database does not provide extensive details about the device, it is mentioned that the Redmi Note 14 Pro 4G is codenamed “Obsidian” and will utilize a MediaTek processor. However, the specific SoC remains unknown at this time. It’s worth noting that the Note 14 Pro 5G version also runs on a MediaTek chip, specifically the Dimensity 7300 Ultra.

    Typical Launch Patterns for Redmi

    Xiaomi usually introduces 4G versions of its Note series smartphones in international markets. For example, last year, the Redmi Note 13 lineup included the Note 13 Pro 5G with a Snapdragon 7s Gen 2 chip and the Note 13 Pro 4G which was equipped with a MediaTek Helio G99 Ultra chip. The other specifications of these models are generally quite alike. Therefore, we can anticipate that the Note 14 Pro 5G and 4G variants will have similar specs, except for their chipsets.

    Speculation on Global Models

    Interestingly, the report hints that the global version of the standard Note 14 might feature a Snapdragon chip, which is different from the Dimensity 7025 chip used in the Chinese version. This global model will still support 5G, but specific details regarding the chipset are still not revealed. Additionally, the source claims a 90% certainty on this information, suggesting that there might be changes ahead. So, it’s advisable to keep a cautious approach regarding this news.

    The Note 14 has also shown up on the IMEI database with several model numbers: 24117RN76L, 24117RN76O, 24117RN76G, and 24117RN76E. This model is reportedly codenamed “Tanzanite.”

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  • MediaTek Dimensity 9400 Launch: Boosting AI and Gaming Power

    MediaTek Dimensity 9400 Launch: Boosting AI and Gaming Power

    MediaTek has introduced its new top-tier chipset, the Dimensity 9400, which aims to provide unmatched performance and efficiency for future smartphones. This chipset marks a major improvement over the Dimensity 9300, bringing better CPU performance, enhanced AI functions, and upgraded gaming capabilities.

    Innovative CPU Design and Energy Efficiency

    The Dimensity 9400 features MediaTek’s second-generation All Big Core architecture. It includes a strong Arm Cortex-X925 core that runs at speeds exceeding 3.62GHz, alongside three Cortex-X4 cores and four Cortex-A720 cores. This setup achieves 35% improvement in single-core performance and 28% boost in multi-core performance when compared to the Dimensity 9300. Manufactured using TSMC’s advanced 3nm process, the Dimensity 9400 is up to 40% more efficient in power use, leading to a longer-lasting battery life.

    Superior AI Features

    One of the highlighted aspects of the Dimensity 9400 is its 8th Generation NPU, which brings pioneering advancements in generative AI capabilities. It is the first mobile chipset that allows on-device LoRA training and high-quality video generation directly on the device. MediaTek’s new Dimensity Agentic AI Engine (DAE) upgrades standard AI applications into more advanced agentic AI applications, achieving 80% faster performance in large language model (LLM) prompts while being 35% more efficient in power consumption.

    Outstanding Gaming Experience

    The Dimensity 9400 ensures a captivating gaming experience thanks to its 12-core Arm Immortalis-G925 GPU, which provides up to 40% faster ray tracing performance than its predecessor. It also supports opacity micromaps (OMM) for realistic visual effects and delivers a 41% increase in peak performance while saving up to 44% in power. Moreover, the HyperEngine technology, developed together with Arm, offers superb resolution and impressive image quality.

    Advanced Multimedia and Camera Capabilities

    This chipset comes with the MediaTek Imagiq 1090, which supports HDR video recording across the full zoom range. The Smooth Zoom feature makes it easier to capture moving subjects and cuts down power usage by as much as 14% during 4K60 video recording. It can handle a maximum camera sensor of 320MP and allows for 8K60 video capture.

    Connectivity and Extra Features

    The Dimensity 9400 includes a new 3GPP Release-17 5G modem with 4CC-CA, providing performance of up to 7Gbps in sub-6GHz bands. It also incorporates a fresh 4nm Wi-Fi/Bluetooth combo chip with data rates of 7.3Gbps and Wi-Fi 7 tri-band MLO support. The MediaTek Xtra RangeTM 3.0 feature enhances Wi-Fi coverage by up to 30 meters. This chipset supports 5G/4G Dual SIM Dual Active and tri-fold smartphones, allowing companies to create unique device designs.

    Launch Timeline

    Smartphones powered by the MediaTek Dimensity 9400 are set to be released in Q4 2024. The Vivo X200, X200 Pro, and X200 Pro Mini will be the first devices with the Dimensity 9400, launching on October 14 in China. Additionally, the Find X8 series, expected to be unveiled on October 24 in China, will also utilize the D9400 chipset.

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  • Huawei to Sue MediaTek This Month Over Patent Dispute

    Huawei to Sue MediaTek This Month Over Patent Dispute

    The ongoing clash over patents between Huawei and MediaTek is set to intensify around October 25th, following the end of China’s Golden Week holiday and major product launches, according to a fresh report from DigiTimes.

    The Core of the Issue

    Since July, both tech titans have been embroiled in disputes over claims of patent violations concerning cellular network technologies, which include 4G, 5G, and LTE. Each company has taken legal action against the other—Huawei has filed a lawsuit in a Chinese court, while MediaTek has pursued its case in the UK High Court. Although specific details regarding the lawsuits and court dates are still not clear, the latest information from DigiTimes hints at a possible start after October 25th.

    Licensing Agreement Problems

    The heart of this disagreement appears to be a failed licensing deal. Huawei, the Chinese tech powerhouse, possesses a substantial collection of standard-essential patents (SEPs) vital for wireless communication, owning around 20% of the global 5G patents. Presently, Huawei imposes patent fees on terminal device makers, which are the companies that design, put together, and sell complete devices. For smartphones, some of these manufacturers include Oppo, Xiaomi, and Samsung.

    Huawei’s legal action aims to shift this fee model to focus on component suppliers like MediaTek instead of the device manufacturers. In contrast, MediaTek has found these licensing fees—calculated based on terminal device prices—to be too steep, contributing to the ongoing conflict between them.

    Potential Industry Impact

    Should Huawei’s plan succeed, it may revolutionize the patent licensing framework within the tech sector. Smartphone producers such as Apple, Samsung, Xiaomi, Oppo, and Vivo could experience decreased licensing expenses, as the financial responsibility would transfer to chip suppliers like MediaTek and Qualcomm. In theory, this adjustment could also allow device makers to reduce the prices of their products.

    Clearly, both companies are gearing up for what could be a protracted and intricate legal battle. While the outcome remains uncertain, we’ll keep you informed as the situation unfolds.

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