Tag: Dimensity 9300

  • MediaTek Dimensity 9400 vs 9300: Key Differences Explained

    MediaTek Dimensity 9400 vs 9300: Key Differences Explained

    MediaTek has just introduced its new Dimensity 9400 chipset, and it comes with some impressive enhancements in processing power, energy efficiency, and AI features. The chipmaker is making bold promises with this flagship chipset.

    A New Era in Flagship Chips

    The Dimensity 9400 competes directly with Qualcomm’s Snapdragon 8 Elite and Apple’s A18 Pro (check out our comparison between Dimensity 9400 and Snapdragon 8 Elite). But how does this latest iteration compare to its predecessor, the Dimensity 9300? And is it worth upgrading to the Dimensity 9400? Let’s take a closer look to find out.

    Specifications Comparison

    Feature Dimensity 9400 Dimensity 9300
    Announced October 2024 November 2023
    Model number MT6991 MT6989
    Process node 3nm 4nm
    Manufacturer TSMC TSMC
    CPU 1 x Cortex-X925 — 3.63GHz
    3 x Cortex-X4 — 3.3GHz
    4 x Cortex-A720 — 2.4GHz
    1 x Cortex-X4 — 3.25GHz
    3 x Cortex-X4 — 2.85GHz
    4 x Cortex-A720 — 2GHz
    GPU Arm Immortalis-G925 MC12
    MediaTek Adaptive Gaming Technology 3.0
    Global illumination
    MediaTek Frame Rate Converter
    HyperEngine’s Super Resolution
    Ray tracing support
    Arm Immortalis-G720 MC12
    MediaTek HyperEngine gaming technologies
    Global illumination
    Ray tracing support
    NPU MediaTek NPU 890 MediaTek APU 790
    Camera MediaTek Imagiq 1090 ISP
    Up to 320MP single camera
    Up to 8K/60fps video recording
    Gen-AI Super Resolution
    Gen-AI Super Zoom
    MediaTek Imagiq 990 ISP
    Up to 320MP single camera
    Up to 8K/30fps video recording
    Memory LPDDR5X at 10667Mbps
    Up to 24GB support
    LPDDR5T at 9600Mbps
    Up to 24GB support
    Storage UFS 4.0 + MCQ UFS 4.0 + MCQ
    Connectivity Downlink: 7.3Gbps
    Wi-Fi 7
    Bluetooth 5.4 standard
    Downlink: 7Gbps
    Wi-Fi 7
    Bluetooth 5.4 standard

    Benchmark Scores

    [Geekbench 6]
    Geekbench is a well-known tool for evaluating CPU performance. The Dimensity 9300 scored 2,210 points in single-core and 7,478 in multi-core tests. In contrast, the Dimensity 9400 achieved a remarkable 2,876 single-core points and 8,987 multi-core points, showing clear improvements in raw CPU performance.

    Dimensity 9400 Dimensity 9300
    Single core 2,876 2,210
    Multi core 8,987 7,478

    [AnTuTu 10]
    AnTuTu assesses various device capabilities, and the Dimensity 9400 obtained over 3 million points, while the Dimensity 9300 fell short of 2 million, signifying a 59% increase for the new MediaTek chip.

    Dimensity 9400 Dimensity 9300
    AnTuTu score 3,007,853 1,881,325
    CPU 652,381 477,734
    GPU 1,322,761 705,755
    Memory 521,453 371,291
    UX 511,258 326,545

    CPU Enhancements

    Like the Dimensity 9300, the 9400 features powerful CPU cores, but it utilizes TSMC’s 3nm process, boosting both performance and energy efficiency. The new chip includes a Cortex-X928 running at up to 3.63GHz, three Cortex-X4 cores at 3.3GHz, and four Cortex-A720 cores at 2.4GHz. The Dimensity 9300, on the other hand, maxes out at a Cortex-X4 core with 3.25GHz, three Cortex-X4 cores at 2.85GHz, and four Cortex-A720 cores running at 2GHz.

    The addition of a high-performance Cortex-X925 CPU core in the Dimensity 9400 allows for improved single-core performance by 35% and multi-core performance by 28%. With TSMC’s advanced 3nm technology, this chip offers greater performance per milliwatt, boasting a 40% increase in power efficiency compared to its predecessor. Additionally, it features double the L2 cache and 50% more cache than the Dimensity 9300, contributing to this performance leap.

    GPU Improvements

    Equipped with a new 12-core Immortalis G925 GPU leveraging Arm’s fifth-generation architecture, the Dimensity 9400 delivers a 41% increase in peak performance while also being 44% more power efficient than the previous model. The enhancement in ray tracing performance is notable, with a 40% uplift. Gaming experiences are smoother as well, thanks to upgraded MediaTek HyperEngine gaming technologies like MediaTek Adaptive Gaming Technology 3.0 and MediaTek Frame Rate Converter.

    Camera Upgrades

    The camera features are significantly enhanced too. The new Imagiq 1090 ISP in the Dimensity 9400 allows for HDR video capture across the zoom range, a first among flagship chips. It also introduces Gen-AI Super Resolution and Gen-AI Super Zoom, which refine blocky images into sharp ones and achieve up to 100X magnification with clarity, respectively. Both chips can support 320MP resolutions, but the Dimensity 9400 can record at 8K/60fps, while the Dimensity 9300 tops out at 8K/30fps.

    AI and Connectivity Advancements

    AI improvements are a highlight of the Dimensity 9400. It incorporates an 8th-generation NPU that enhances on-device AI functions. This chip enables high-quality on-device video generation and LoRA training, claiming to deliver 100% faster diffusion generation and 80% quicker LLM prompt performance, with 35% better power efficiency compared to the Dimensity 9300.

    Connectivity also sees upgrades, with a 50% increase in power efficiency for Wi-Fi and Bluetooth. The new 5G modem allows direct Bluetooth connections between smartphones up to 1.5km apart, and with MediaTek Xtra Range 3.0, the chip can extend Wi-Fi coverage by 30 meters. Additionally, it can cut Wi-Fi hotspot power usage by half, and memory speeds have risen to 10667Mbps from 9600Mbps.

    Final Thoughts

    The MediaTek Dimensity 9400 is a significant leap in CPU and GPU capabilities, making it one of the top flagship smartphone chips available. It not only competes with Apple and Qualcomm but also enhances nearly every aspect, including AI, camera capabilities, and connectivity. This chip is already featured in devices like the Vivo X200 and Find X8 series, with more flagship models expected to follow suit.


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  • Redmi K70 Ultra to Feature Independent Display Chip

    Redmi K70 Ultra to Feature Independent Display Chip

    Redmi is set to expand its K70 series by introducing the K70 Ultra, according to recent leaks.

    A Weibo tipster known as Smart Pikachu has disclosed several key specifications of the upcoming Redmi K70 Ultra. The forthcoming model will feature a robust 5500mAh battery, which is a 500mAh increase over its predecessor, the Redmi K60 Ultra. Despite the larger battery, the charging capacity remains the same at 120W.

    Display and Performance

    The front display is expected to boast a 1.5K resolution. Additionally, it will incorporate an independent dual-core chip, possibly similar to the X7 display chip used in the K60 Ultra, which enables a native frame rate of 144 fps in compatible games.

    The leak aligns with information from another Weibo source, Digital Chat Station, stating that the phone will be powered by MediaTek’s latest Dimensity 9300+ chipset. Currently, the newly released Vivo X100s Pro is the only device equipped with this chip.

    Design and Build

    There is also mention of a customized “deep joint design architecture,” suggesting a tailored version of the Dimensity 9300+ specifically for the Redmi K70 Ultra. The phone will feature a robust metal middle frame and a textured glass back panel. It will also offer dust and water resistance to protect against accidental damage and environmental factors.

    Redmi K70 Ultra to Feature Independent Display Chip

    Launch Timeline

    The Redmi K70 Ultra is anticipated to be launched in June or July this year. Additionally, a modified version of the same device branded as Xiaomi 14T Pro is expected to be released later this year for the global market.

    Stay tuned for more updates as the launch date approaches.

  • MediaTek unveils Dimensity 9300+ supporting Google Gemini Nano, Meta Llama

    MediaTek unveils Dimensity 9300+ supporting Google Gemini Nano, Meta Llama

    MediaTek recently unveiled the Dimensity 9300+, a cutting-edge chipset tailored for top-tier smartphones. This new chip, although slightly enhanced in specifications compared to its predecessor, the Dimensity 9300, primarily emphasizes advancements in on-device AI processing and extended support for large language models (LLMs).

    Enhanced AI Capabilities and LLM Compatibility

    The Dimensity 9300+ is engineered to support various LLMs, such as Google’s Gemini Nano and Meta’s Llama 2 and 3. MediaTek highlights the chip’s broad LLM compatibility and its on-device LoRA Fusion technology, which is expected to cultivate a diverse range of generative AI applications.

    Industry-Leading Performance

    MediaTek asserts that the Dimensity 9300+ is the first in the industry to achieve rapid operation speeds for specific LLMs. Notably, it boasts a speed of 22 tokens per second for Meta’s Llama 2 7B model.

    Power Efficiency and Connectivity Enhancements

    Apart from AI advancements, the Dimensity 9300+ promises notable enhancements in power efficiency, reportedly reducing power consumption by 20% in certain gaming scenarios. The chipset also integrates a “star speed engine” to optimize network connectivity and facilitates dual network concurrency.

    Technical Specifications
    Constructed using a 4nm process, the Dimensity 9300+ houses an octa-core CPU, featuring one high-performance Arm Cortex-X4 core clocked at 3.4 GHz, three additional Cortex-X4 cores clocked at 2.85 GHz, and four Cortex-A720 cores running at 2.0 GHz.

    The chipset incorporates MediaTek’s innovative NeuroPilot technology to elevate AI processing capabilities. The APU 790 AI engine enables the execution of LLMs with diverse parameter sizes, ranging from 1 billion to 33 billion, with double the speed of competing solutions for 7 billion parameter LLMs.

    For gaming enthusiasts, the Dimensity 9300+ integrates a second-generation hardware raytracing engine alongside an Arm Immortalis-G720 GPU. Additionally, it incorporates MediaTek’s Imagiq 990 ISP for enhanced camera functionality and MiraVision 990 for improved visual content processing.

    In terms of connectivity, the Dimensity 9300+ features a 5G R16 modem supporting Sub-6GHz networks and downlink speeds of up to 7Gbps.

    Availability

    The Dimensity 9300+ will make its debut on the Vivo X100S, becoming the first device to integrate this advanced chipset. Furthermore, the iQOO Neo9S Pro, set for release this month, will also be equipped with the Dimensity 9300+.


    MediaTek unveils Dimensity 9300+ supporting Google Gemini Nano, Meta Llama
  • Redmi K70 Ultra to Showcase Dimensity 9300+ Flagship

    Redmi K70 Ultra to Showcase Dimensity 9300+ Flagship

    Xiaomi recently unveiled the Snapdragon 8s Gen 3-powered Redmi Turbo 3, an affordable flagship-killing phone in China, but their sub-brand, Xiaomi sub is now developing another performance device known as Redmi K70 Ultra which may feature a MediaTek chipset instead.

    Details Of Redmi K70 Ultra

    Ti Yan has provided invaluable details about the Redmi K70 Ultra on Weibo, with important specifications expected for its power source – an enhanced Dimensity 9300+ chipset announced back in November 2023, expected to debut first on Vivo’s X100s Pro models scheduled to hit China markets later in May.

    Features and Specifications

    Redmi K70 Ultra is expected to feature a 50-megapixel primary camera and additional sensors like ultrawide and macro lenses, in addition to an OLED screen with 1.5K resolution and dedicated graphics chip, providing impressive visual performance suitable for gaming enthusiasts. In addition, 120W fast charging should also be supported alongside up to 24GB RAM storage and 5,500mAh batteries – plus you could buy additional covers!

    Global Markets And Xiaomi 14T Pro

    Xiaomi’s Redmi K70 Ultra will target Chinese markets, while their 14T Pro could offer additional features not found on Redmi K70 Ultra.


    Redmi K70 Ultra to Showcase Dimensity 9300+ Flagship
  • Vivo V2324HA Certification and Geekbench Leak: Possible X100s Pro

    Vivo V2324HA Certification and Geekbench Leak: Possible X100s Pro

    A new Vivo smartphone, bearing the model number V2324HA, has recently surfaced on China's Radio Certification database and the Geekbench benchmarking platform. It is being speculated that this device could possibly be the Vivo X100S Pro smartphone.

    Device Speculation

    While the existence of this device has been verified by both Radio Certification and Geekbench, the official name of the smartphone remains unknown at this point. More information is awaited before any definitive conclusions can be drawn.

    Processor Details

    China's Radio Certification database does not provide specific details about the smartphone. However, the Geekbench listings shed light on the processor configuration of the device. The chip comprises a 3.4GHz Cortex-X4 core, three 2.85GHz Cortex-X4 cores, and four 2.0GHz Cortex-A720 cores. Additionally, the GPU is identified as an Immortalis-G720 MC12, operating at 1300 MHz.

    Upcoming Launch

    Although the CPU architecture of the SoC core appears similar to that of the Dimensity 9300, there is a distinction in the primary core's clock speed. This variation, with a clock speed of 3.25GHz for the Dimensity 9300, hints that this could potentially be an enhanced iteration of the Dimensity 9300. According to insights from Weibo tipster WhyLab, the processor in question might be the Dimensity 9300+, slated for an April release. Consequently, the Vivo X100S Pro could potentially make its debut towards the end of April or early May, possibly alongside the Vivo X100 Ultra smartphone.

    Expected Features

    Previous reports have suggested certain specifications for the smartphone. It is anticipated to support 100W wired fast charging and operate on a 5,000mAh battery. Speculations also hint at features like a short-focus optical in-display fingerprint scanner, a metal frame, and a glass rear panel. Beyond these particulars, further details about the smartphone are currently scarce. Stay tuned for any updates on this evolving story.

  • Xiaomi 14T Pro: Dimensity 9300 Specs Leak Online, Potential Launch

    Xiaomi 14T Pro: Dimensity 9300 Specs Leak Online, Potential Launch

    Guess what? There’s thrilling news circulating about the Xiaomi 14T Pro – key features have been revealed prematurely! Despite the recent introduction of the 13T Pro, Xiaomi is already gearing up for the 14T series. Interestingly, speculation suggests that the 14T Pro might just be a revamped version of the Redmi K70 Ultra.

    Xiaomi 14T Pro on the Horizon

    Let's delve into the leaked specifications surrounding the Xiaomi 14T Pro. Compared to the Xiaomi 12T series, the 13T series fell short in certain aspects, lacking the vibrant display and rapid charging capabilities that were appreciated in the former. While the camera received praise, other features left much to be desired. However, with the impending 14T series, Xiaomi seems poised for significant unveilings, anticipated around August and September.

    Insightful Revelations

    GSMChina has recently disclosed intriguing information. Notably, the Xiaomi 14T Pro has surfaced on the IMEI database with model numbers “2407FPN8EG” for the global edition and “2407FPN8ER” for the Japanese variant. This suggests a widespread release, including Japan. Moreover, a distinct model number, “2407FRK8EC,” is linked to the Chinese version, aligning with the Redmi K70 Ultra. Although minor feature differentiations may exist, both models are expected to share substantial similarities.

    Unveiling Codenames

    Dubbed as “rothko,” the Xiaomi 14T Pro shares its codename with the Redmi K70 Ultra, further cementing the potential connection between the two devices. Xiaomi's tradition of naming Redmi K series devices after painters continues, drawing inspiration from Mark Rothko, a renowned American artist celebrated for his "color field painting" and "late pictorial abstraction."

    Anticipating Innovations

    While detailed specifics regarding the Xiaomi 14T Pro are yet to be fully disclosed, it is anticipated to feature a robust MediaTek processor, potentially the Dimensity 9300 SOC. Expect enhancements in the camera department and various other areas. The official introduction of the Redmi K70 Ultra is slated for August, with the subsequent unveiling of the 14T series set to follow shortly thereafter. Exciting developments lie ahead!

  • Tipster reveals that MediaTek Dimensity 9300 will power Vivo Pad 3

    Tipster reveals that MediaTek Dimensity 9300 will power Vivo Pad 3

    Vivo is gearing up for a major launch cycle that will see the introduction of a range of new products, including foldable phones and flagship devices. Among these products is the Vivo Pad 3 tablet, and according to a tipster, one of its key specifications has been hinted at.

    Vivo Pad 3 might come with a Dimensity 9300

    According to the tipster, known as Digital Chat Station, the upcoming Vivo Pad 3 will be equipped with the MediaTek Dimensity 9300 SoC. This chipset is typically found in high-end flagship devices, indicating that the tablet will be a top-of-the-line product. The Dimensity 9300 is the same chipset that powers the recently released Vivo X100 and X100 Pro smartphones.

    The Vivo X100 series is Vivo’s latest flagship lineup, and it seems that the Pad 3 will share the same powerful chipset as these smartphones. However, no further details about the Vivo Pad 3 have been revealed by the tipster.

    Interestingly, Vivo is expected to announce the Vivo X100 Ultra model in April 2024. This will be the top-end model of the X100 series and is rumored to be powered by the Snapdragon 8 Gen 3 SoC. There is a possibility that the Vivo Pad 3 could be announced alongside this device. However, it remains uncertain whether Vivo will unveil the tablet at the same event as the X100 Ultra, X Fold 3, and X Flip 2. We will have to wait for more updates from Vivo to find out.

    Stay tuned for more information on the Vivo Pad 3 and other upcoming Vivo releases.

    Source: 1, 2, 3

  • Potential Redmi K70 series phone reportedly seen during Dimensity 9300 unveiling

    Potential Redmi K70 series phone reportedly seen during Dimensity 9300 unveiling

    Redmi K70 Series: Rumors and Speculations

    Alleged Redmi K70 series phone’s front design revealed

    At MediaTek’s Dimensity 9300 launch event, the sight of Zeng Xuezhong, the Senior Vice President of Xiaomi Group and the President of the Mobile Phone Department, holding a mysterious smartphone caught the attention of many. It is speculated that the mysterious phone in his hand could be a Redmi K70-series smartphone.

    Potential Redmi K70 series phone reportedly seen during Dimensity 9300 unveiling

    In terms of design, the alleged Redmi K70 series phone can be seen sporting a punch-hole display. The screen is flat with narrow bezels and offers a high screen-to-body ratio. Unfortunately, the rear design of the phone has not been disclosed.

    Xiaomi’s Collaboration with MediaTek

    During the MediaTek event, Xuezhong expressed Xiaomi’s commitment to deepening its collaboration with MediaTek and celebrated the launch of the MediaTek Dimensity 9300 processor. However, none of the leaks have claimed that there will be a Redmi K70 series phone with a D9300 chip.

    According to reports, the Redmi K70 will have the Snapdragon 8 Gen 2 chipset, whereas the Redmi K70 Pro will have the more powerful Snapdragon 8 Gen 3 SoC. It is speculated that the lineup will include a third model named the Redmi K70e, which may feature a MediaTek chip.

    Reportedly, MediaTek is working on the Dimensity 8300 chipset, a successor to the Dimensity 8200 that powered Redmi K60e last year. The upcoming Redmi K70e could likely be equipped with the Dimensity 8300. Hence, there is a possibility that the device teased by Xuezhong could be the K70e.

    Expected Release and Features

    A recent Weibo post by tipster Digital Chat Station hinted that the Redmi K70 series will debut this month. He also said that the K70 lineup stands out primarily due to its exceptional design and screen quality. He is of the view that the K70 series has no competitors in its category. Notably, the primary competing products are slated for release in the coming year.

    As for pricing and specifications, they have not been officially confirmed yet. However, based on the rumors and leaks, the Redmi K70 series is expected to offer powerful processors, high-quality displays, and innovative design elements. Fans of the Redmi brand are eagerly waiting for the official announcement from Xiaomi to get more details about the highly anticipated K70 series.

  • Find X-series phone from Oppo set to include Dimensity 9300, possibility of Find X7 showcasing it

    Find X-series phone from Oppo set to include Dimensity 9300, possibility of Find X7 showcasing it

    MediaTek has recently unveiled its latest flagship chipset, the Dimensity 9300. The Vivo X100 and X100 Pro, set to launch on November 13, will be the first smartphones to feature this new chip. Oppo has also confirmed that its next Find-series phone will be equipped with the Dimensity 9300 chip. It is highly likely that the Find X7 phone, expected to debut in the first quarter of 2024, will come with this new flagship chip.

    OPPO Find X7 Likely to Feature Dimensity 9300

    The Find X7 series will replace the Find X6 and Find X6 Pro, which were equipped with the Dimensity 9200 and Snapdragon 8 Gen 2 chipsets, respectively. Reports suggest that the X7 lineup will consist of two models, the Find X7 and Find X7 Pro.

    Recently, an upcoming Oppo phone with the model number PHZ110 was spotted in the Geekbench benchmarking platform’s database. The listing revealed that the device is equipped with the Dimensity 9300 chip, 16 GB of RAM, and Android 14. In the Geekbench 6 single-core and multi-core tests, the device scored 2139 and 7110 points, respectively. Speculations suggest that the PHZ110 will be launched as the Oppo Find X7.

    On the other hand, the Find X7 Pro is expected to feature the Snapdragon 8 Gen 3 chipset. A recent report revealed that the Pro model will come with a 1-inch LYT-900 camera sensor, which will also be seen on the Vivo X100 Pro+ and Xiaomi 14 Ultra premium flagship phones expected to launch next year.

    An August report claimed that the Find X7 Pro is designed to address the shortcomings of the Find X6 Pro. It is also said to come with incremental upgrades, including an enhanced design. The X7 Pro is expected to feature a 2K-resolution display, a 32-megapixel front camera, and a 50-megapixel (LYT-900) + 50-megapixel (LYT-700 ultra-wide) + 50-megapixel (LYT-700) periscope telephoto camera. Other specifications may include 16 GB of LPDDR5x RAM, 1 TB of UFS 4.0 storage, and a large battery with 100W wired and 50W wireless charging support.

  • Impressive Benchmark Results Unveiled for MediaTek Dimensity 9300

    Impressive Benchmark Results Unveiled for MediaTek Dimensity 9300




    MediaTek Dimensity 9300: A Beast of a Mobile Chip

    MediaTek Dimensity 9300: An Impressive Benchmark Performer

    MediaTek’s new flagship mobile chip, the Dimensity 9300, is officially out, and it’s a beast! Official benchmark results show that it scores over 2.2 million points on AnTuTu, which is incredibly impressive. Let’s take a closer look at the Dimensity 9300’s specific test scores in this story.

    Benchmark Scores: Over 2.2 Million Points in AnTuTu

    In the AnTuTu V10 benchmark, the Dimensity 9300 scored 2.207 million points, making it the first Android chipset to score over 2.2 million points. This outperforms Xiaomi 14 with Snapdragon 8 Gen 3 SoC, which currently ranks first in AnTuTu’s October performance list, and the A17 Pro of the Apple iPhone 15 Pro series, by a full 600,000 points.

    Powerful Architecture and Impressive GPU Performance

    The Dimensity 9300 is unique in that it features four powerhouse Arm Cortex-X4 cores and four high-performance Cortex-A720 cores, but no efficiency cores. This gives it a significant performance advantage over other Android chipsets, which typically use a combination of performance and efficiency cores. This means that the Dimensity 9300 is all about performance, and it shows in the benchmarks.

    In the GeekBench 6 test, the SoC scored 2265 points in the single-core test and nearly 8000 points in the multi-core test, which is about 4% and 12% ahead of the Snapdragon 8 Gen 3, respectively.

    The Dimensity 9300 also features the latest Arm Immortalis-G720 GPU in a 12-core configuration, which outperformed all major competing models in the benchmark test. Specifically, it scored 4880 points in the BaseMark ray tracing benchmark, 5638 points in the 3DMark Wild Life EXTREME benchmark, 347fps in the GFX 1080P Manhattan 3.1 off-screen test, and 103fps in the GFX 1440P Aztec vulkan off-screen test.

    Thanks to its all-performance core architecture and new-generation GPU, the Dimensity 9300 has a significant performance advantage over its competitors. MediaTek also claims that the Dimensity 9300 is up to 33% more efficient than the Dimensity 9200 at the same performance level while offering a 40% improvement in peak performance.

    Upcoming Flagship Smartphones Equipped with Dimensity 9300

    Vivo and Oppo have both confirmed that their upcoming flagship smartphones will be equipped with the new Dimensity 9300 chip. It will be interesting to see how the Dimensity 9300 performs in real-world devices, and how it compares to other flagship chips.