Tag: Dimensity 9300

  • Redmi K70 Ultra to Showcase Dimensity 9300+ Flagship

    Redmi K70 Ultra to Showcase Dimensity 9300+ Flagship

    Xiaomi recently unveiled the Snapdragon 8s Gen 3-powered Redmi Turbo 3, an affordable flagship-killing phone in China, but their sub-brand, Xiaomi sub is now developing another performance device known as Redmi K70 Ultra which may feature a MediaTek chipset instead.

    Details Of Redmi K70 Ultra

    Ti Yan has provided invaluable details about the Redmi K70 Ultra on Weibo, with important specifications expected for its power source – an enhanced Dimensity 9300+ chipset announced back in November 2023, expected to debut first on Vivo’s X100s Pro models scheduled to hit China markets later in May.

    Features and Specifications

    Redmi K70 Ultra is expected to feature a 50-megapixel primary camera and additional sensors like ultrawide and macro lenses, in addition to an OLED screen with 1.5K resolution and dedicated graphics chip, providing impressive visual performance suitable for gaming enthusiasts. In addition, 120W fast charging should also be supported alongside up to 24GB RAM storage and 5,500mAh batteries – plus you could buy additional covers!

    Global Markets And Xiaomi 14T Pro

    Xiaomi’s Redmi K70 Ultra will target Chinese markets, while their 14T Pro could offer additional features not found on Redmi K70 Ultra.

    Redmi K70 Ultra to Showcase Dimensity 9300+ Flagship
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  • Vivo V2324HA Certification and Geekbench Leak: Possible X100s Pro

    Vivo V2324HA Certification and Geekbench Leak: Possible X100s Pro

    A new Vivo smartphone, bearing the model number V2324HA, has recently surfaced on China's Radio Certification database and the Geekbench benchmarking platform. It is being speculated that this device could possibly be the Vivo X100S Pro smartphone.

    Device Speculation

    While the existence of this device has been verified by both Radio Certification and Geekbench, the official name of the smartphone remains unknown at this point. More information is awaited before any definitive conclusions can be drawn.

    Processor Details

    China's Radio Certification database does not provide specific details about the smartphone. However, the Geekbench listings shed light on the processor configuration of the device. The chip comprises a 3.4GHz Cortex-X4 core, three 2.85GHz Cortex-X4 cores, and four 2.0GHz Cortex-A720 cores. Additionally, the GPU is identified as an Immortalis-G720 MC12, operating at 1300 MHz.

    Upcoming Launch

    Although the CPU architecture of the SoC core appears similar to that of the Dimensity 9300, there is a distinction in the primary core's clock speed. This variation, with a clock speed of 3.25GHz for the Dimensity 9300, hints that this could potentially be an enhanced iteration of the Dimensity 9300. According to insights from Weibo tipster WhyLab, the processor in question might be the Dimensity 9300+, slated for an April release. Consequently, the Vivo X100S Pro could potentially make its debut towards the end of April or early May, possibly alongside the Vivo X100 Ultra smartphone.

    Expected Features

    Previous reports have suggested certain specifications for the smartphone. It is anticipated to support 100W wired fast charging and operate on a 5,000mAh battery. Speculations also hint at features like a short-focus optical in-display fingerprint scanner, a metal frame, and a glass rear panel. Beyond these particulars, further details about the smartphone are currently scarce. Stay tuned for any updates on this evolving story.

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  • Xiaomi 14T Pro: Dimensity 9300 Specs Leak Online, Potential Launch

    Xiaomi 14T Pro: Dimensity 9300 Specs Leak Online, Potential Launch

    Guess what? There’s thrilling news circulating about the Xiaomi 14T Pro – key features have been revealed prematurely! Despite the recent introduction of the 13T Pro, Xiaomi is already gearing up for the 14T series. Interestingly, speculation suggests that the 14T Pro might just be a revamped version of the Redmi K70 Ultra.

    Xiaomi 14T Pro on the Horizon

    Let's delve into the leaked specifications surrounding the Xiaomi 14T Pro. Compared to the Xiaomi 12T series, the 13T series fell short in certain aspects, lacking the vibrant display and rapid charging capabilities that were appreciated in the former. While the camera received praise, other features left much to be desired. However, with the impending 14T series, Xiaomi seems poised for significant unveilings, anticipated around August and September.

    Insightful Revelations

    GSMChina has recently disclosed intriguing information. Notably, the Xiaomi 14T Pro has surfaced on the IMEI database with model numbers “2407FPN8EG” for the global edition and “2407FPN8ER” for the Japanese variant. This suggests a widespread release, including Japan. Moreover, a distinct model number, “2407FRK8EC,” is linked to the Chinese version, aligning with the Redmi K70 Ultra. Although minor feature differentiations may exist, both models are expected to share substantial similarities.

    Unveiling Codenames

    Dubbed as “rothko,” the Xiaomi 14T Pro shares its codename with the Redmi K70 Ultra, further cementing the potential connection between the two devices. Xiaomi's tradition of naming Redmi K series devices after painters continues, drawing inspiration from Mark Rothko, a renowned American artist celebrated for his "color field painting" and "late pictorial abstraction."

    Anticipating Innovations

    While detailed specifics regarding the Xiaomi 14T Pro are yet to be fully disclosed, it is anticipated to feature a robust MediaTek processor, potentially the Dimensity 9300 SOC. Expect enhancements in the camera department and various other areas. The official introduction of the Redmi K70 Ultra is slated for August, with the subsequent unveiling of the 14T series set to follow shortly thereafter. Exciting developments lie ahead!

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  • Tipster reveals that MediaTek Dimensity 9300 will power Vivo Pad 3

    Tipster reveals that MediaTek Dimensity 9300 will power Vivo Pad 3

    Vivo is gearing up for a major launch cycle that will see the introduction of a range of new products, including foldable phones and flagship devices. Among these products is the Vivo Pad 3 tablet, and according to a tipster, one of its key specifications has been hinted at.

    Vivo Pad 3 might come with a Dimensity 9300

    According to the tipster, known as Digital Chat Station, the upcoming Vivo Pad 3 will be equipped with the MediaTek Dimensity 9300 SoC. This chipset is typically found in high-end flagship devices, indicating that the tablet will be a top-of-the-line product. The Dimensity 9300 is the same chipset that powers the recently released Vivo X100 and X100 Pro smartphones.

    The Vivo X100 series is Vivo’s latest flagship lineup, and it seems that the Pad 3 will share the same powerful chipset as these smartphones. However, no further details about the Vivo Pad 3 have been revealed by the tipster.

    Interestingly, Vivo is expected to announce the Vivo X100 Ultra model in April 2024. This will be the top-end model of the X100 series and is rumored to be powered by the Snapdragon 8 Gen 3 SoC. There is a possibility that the Vivo Pad 3 could be announced alongside this device. However, it remains uncertain whether Vivo will unveil the tablet at the same event as the X100 Ultra, X Fold 3, and X Flip 2. We will have to wait for more updates from Vivo to find out.

    Stay tuned for more information on the Vivo Pad 3 and other upcoming Vivo releases.

    Source: 1, 2, 3

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  • Potential Redmi K70 series phone reportedly seen during Dimensity 9300 unveiling

    Potential Redmi K70 series phone reportedly seen during Dimensity 9300 unveiling

    Redmi K70 Series: Rumors and Speculations

    Alleged Redmi K70 series phone’s front design revealed

    At MediaTek’s Dimensity 9300 launch event, the sight of Zeng Xuezhong, the Senior Vice President of Xiaomi Group and the President of the Mobile Phone Department, holding a mysterious smartphone caught the attention of many. It is speculated that the mysterious phone in his hand could be a Redmi K70-series smartphone.

    Potential Redmi K70 series phone reportedly seen during Dimensity 9300 unveiling

    In terms of design, the alleged Redmi K70 series phone can be seen sporting a punch-hole display. The screen is flat with narrow bezels and offers a high screen-to-body ratio. Unfortunately, the rear design of the phone has not been disclosed.

    Xiaomi’s Collaboration with MediaTek

    During the MediaTek event, Xuezhong expressed Xiaomi’s commitment to deepening its collaboration with MediaTek and celebrated the launch of the MediaTek Dimensity 9300 processor. However, none of the leaks have claimed that there will be a Redmi K70 series phone with a D9300 chip.

    According to reports, the Redmi K70 will have the Snapdragon 8 Gen 2 chipset, whereas the Redmi K70 Pro will have the more powerful Snapdragon 8 Gen 3 SoC. It is speculated that the lineup will include a third model named the Redmi K70e, which may feature a MediaTek chip.

    Reportedly, MediaTek is working on the Dimensity 8300 chipset, a successor to the Dimensity 8200 that powered Redmi K60e last year. The upcoming Redmi K70e could likely be equipped with the Dimensity 8300. Hence, there is a possibility that the device teased by Xuezhong could be the K70e.

    Expected Release and Features

    A recent Weibo post by tipster Digital Chat Station hinted that the Redmi K70 series will debut this month. He also said that the K70 lineup stands out primarily due to its exceptional design and screen quality. He is of the view that the K70 series has no competitors in its category. Notably, the primary competing products are slated for release in the coming year.

    As for pricing and specifications, they have not been officially confirmed yet. However, based on the rumors and leaks, the Redmi K70 series is expected to offer powerful processors, high-quality displays, and innovative design elements. Fans of the Redmi brand are eagerly waiting for the official announcement from Xiaomi to get more details about the highly anticipated K70 series.

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  • Find X-series phone from Oppo set to include Dimensity 9300, possibility of Find X7 showcasing it

    Find X-series phone from Oppo set to include Dimensity 9300, possibility of Find X7 showcasing it

    MediaTek has recently unveiled its latest flagship chipset, the Dimensity 9300. The Vivo X100 and X100 Pro, set to launch on November 13, will be the first smartphones to feature this new chip. Oppo has also confirmed that its next Find-series phone will be equipped with the Dimensity 9300 chip. It is highly likely that the Find X7 phone, expected to debut in the first quarter of 2024, will come with this new flagship chip.

    OPPO Find X7 Likely to Feature Dimensity 9300

    The Find X7 series will replace the Find X6 and Find X6 Pro, which were equipped with the Dimensity 9200 and Snapdragon 8 Gen 2 chipsets, respectively. Reports suggest that the X7 lineup will consist of two models, the Find X7 and Find X7 Pro.

    Recently, an upcoming Oppo phone with the model number PHZ110 was spotted in the Geekbench benchmarking platform’s database. The listing revealed that the device is equipped with the Dimensity 9300 chip, 16 GB of RAM, and Android 14. In the Geekbench 6 single-core and multi-core tests, the device scored 2139 and 7110 points, respectively. Speculations suggest that the PHZ110 will be launched as the Oppo Find X7.

    On the other hand, the Find X7 Pro is expected to feature the Snapdragon 8 Gen 3 chipset. A recent report revealed that the Pro model will come with a 1-inch LYT-900 camera sensor, which will also be seen on the Vivo X100 Pro+ and Xiaomi 14 Ultra premium flagship phones expected to launch next year.

    An August report claimed that the Find X7 Pro is designed to address the shortcomings of the Find X6 Pro. It is also said to come with incremental upgrades, including an enhanced design. The X7 Pro is expected to feature a 2K-resolution display, a 32-megapixel front camera, and a 50-megapixel (LYT-900) + 50-megapixel (LYT-700 ultra-wide) + 50-megapixel (LYT-700) periscope telephoto camera. Other specifications may include 16 GB of LPDDR5x RAM, 1 TB of UFS 4.0 storage, and a large battery with 100W wired and 50W wireless charging support.

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  • Impressive Benchmark Results Unveiled for MediaTek Dimensity 9300

    Impressive Benchmark Results Unveiled for MediaTek Dimensity 9300




    MediaTek Dimensity 9300: A Beast of a Mobile Chip