In June, Huawei, Honor, Vivo, and Oppo are gearing up to compete in the upper mid-range smartphone market by introducing new devices. This upcoming battle will involve the Nova 13 series, the Honor 200 series, the Vivo S19 lineup, and the Reno 12 series. While earlier leaks in February hinted at the specifications of the Reno 12 and Reno 12 Pro, the details about the chipsets were missing. However, a recent leak on Weibo has now disclosed the chipsets for both devices along with other specifications.
Oppo Reno 12, Reno 12 Pro Key Specifications (Rumored)
The Reno 12 series is rumored to be powered by the Dimensity 8300 and Dimensity 9200 Plus chipsets. Previously, the Chinese variants of the Reno 11 and Reno 11 Pro used the Dimensity 8200 and Snapdragon 8+ Gen 1 chipsets. This leak indicates that the Reno 12 might feature the Dimensity 8300, while the Reno 12 Pro is likely to come with the Dimensity 9200 Plus.
The leak suggests that the Reno 12 will have a 1080p resolution screen, while the Pro variant may offer a 1.5K resolution display. Both phones are expected to feature screens with micro curvature on all four sides equally.
Design and Features
Reports also mention that the Reno 12 series will sport a plastic middle frame and a glass back. The back panel of both devices will house a 50-megapixel telephoto camera with 2x optical zoom for portrait shots. Additionally, both phones are rumored to support 80W fast charging.
Apart from the Reno 12 lineup, Oppo is reportedly working on the Snapdragon 8 Gen 3-powered Oppo Pad 3 and a new pair of earphones. The launch timeline for these devices aligns with the Reno 12 series, indicating that Oppo might unveil multiple products in China in June.
