MediaTek has introduced its latest Helio G100 chipset, following the release of the Tecno Camon 30S Pro, the first smartphone to incorporate this platform. The new chipset builds upon the Helio G99, featuring several enhancements aimed at boosting camera performance and connectivity.
Specifications and Features
The Helio G100 comes with an octa-core CPU, which includes two 2.2 GHz Cortex-A76 cores and six 2.0 GHz Cortex-A55 cores. It supports LPDDR4X RAM and UFS 2.2 storage, both of which remain popular choices for budget devices. The maximum supported display resolution stays at 2,520 x 1,080 pixels, similar to the Helio G99.
A significant upgrade in the Helio G100 is its support for 200 MP main cameras, a considerable advancement from the Helio G99. This enhancement positions the new chipset as a robust option for devices emphasizing high-resolution photography. It can also manage 16 + 16 MP dual camera setups and 32 MP video capture at 30 frames per second.
Improved Connectivity: The “Elevator Mode”
The Helio G100 introduces the “Elevator Mode,” designed to quickly re-establish cellular connection after exiting areas with no coverage, such as tunnels or elevators. This feature benefits users who frequently move through regions with sporadic connectivity, ensuring faster network reconnection.
The chipset supports dual 4G SIM cards with both VoLTE (Voice over LTE) and ViLTE (Video over LTE) capabilities, addressing the growing demand for improved voice and video calling quality over LTE networks.
Market Position and Availability
The Helio G99 was favored in mid-range smartphones within LTE markets due to its cost-efficiency compared to Dimensity chipsets. The Helio G100 retains this competitive pricing while offering enhanced features, making it an appealing option for both manufacturers and consumers.
MediaTek has commenced supplying the Helio G100 to its customers, and we can anticipate seeing new smartphones equipped with this chipset in the upcoming weeks and months.
