Key Takeaways
1. Samsung is set to launch the Galaxy Z Flip 7 FE, a more affordable foldable device, which is already in production and has been certified in China.
2. The device is likely to be powered by the Exynos 2400 chip, featuring a specific core configuration and an Xclipse 940 GPU, although there is uncertainty about the final chipset choice.
3. The Galaxy Z Flip 7 FE will have 8GB of RAM and run on Android 16, expected to be unveiled at Google’s I/O Developer Conference.
4. Benchmark scores show a single-core score of 1,930 and a multi-core score of 6,276, indicating strong performance but still leaving some doubts about the chipset.
5. Reports suggest the possibility of different chipset options, including an Exynos 2400e or Exynos 2500, and the device will support fast charging at 25W.
Samsung is likely to introduce a more affordable version in its foldable series known as the Galaxy Z Flip 7 FE. This new device is said to have started production and has also shown up in the 3C certification database in China, which basically confirms it is real. Recently, it has been through a benchmark test with the model number SM-F761N.
Hardware Insights
The benchmark listing reveals many specifications about the hardware, but it doesn’t clarify the ongoing confusion regarding the chipset Samsung is using. According to the Geekbench entry, the motherboard for the Flip 7 FE is identified by the codename s5e9945, and the configuration suggests it is likely equipped with the Exynos 2400 chip. The chip features a single prime core running at 3.21GHz, two performance cores at 2.90GHz, three additional cores at 2.59GHz, and four efficiency cores clocked at 1.96GHz. The graphics are managed by an Xclipse 940 GPU, indicating that it probably is the Exynos 2400.
Performance Details
In the testing, the device has 8GB of RAM and is operating on Android 16, which is expected to be revealed during Google’s I/O Developer Conference later this month. The benchmark results show a single-core score of 1,930 and a multi-core score of 6,276. However, there remains some doubt about the final chipset selection for the FE. While Geekbench currently implies it will use the Exynos 2400, prior reports have mentioned the possibility of an Exynos 2400e or even a yet-to-be-released Exynos 2500.
Confusion in Chipset Choices
Compounding this uncertainty, a different report from earlier today suggests that the 7 FE may not utilize an Exynos chip at all. As always with leaks, there’s a chance they might not be accurate. Therefore, it’s wise to approach this information with skepticism. Besides the benchmark results, the 3C certification also indicates that the device will support fast charging at 25W.
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