Hisense is gradually building anticipation for its upcoming A10 e-ink smartphone, revealing a new set of core specifications that solidify its position as a distinctly modular device. The company, which first teased the handset in June 2026, has now confirmed that it will support a magnetically attached secondary display on the rear, adding a practical twist to the reading-focused form factor.
Display and Design Fundamentals
The front of the Hisense A10 is built around a 6.13-inch e-ink display. Early promotional images indicate that the bezel design will closely mirror the look of the recently released Hibreak Dual 2, suggesting a familiar design language for users of the brand’s dual-screen devices. The magnetic connector on the back, however, extends beyond display expansion.
Processing Platform and Connectivity
Powering the device is a relatively uncommon Qualcomm QCM6690 chipset, also marketed under the commercial designation Dragonwing Q-6690. This is the same processor found inside the Boox Note X6, an e-ink tablet that launched in May 2026. According to performance estimates provided by Boox, the QCM6690 can achieve an AnTuTu benchmark score of approximately 690,000, placing its performance in a range comparable to SoCs like the Unisoc T9100. This silicon choice strongly points to a competitively priced final product. Hisense additionally confirmed that the A10 will ship with Android 16 and will include both NFC and an infrared remote control function.
Magnetic Charging and Market Timing
Hisense has clarified that the magnetic interface on the rear of the device is not a single-purpose port. Beyond anchoring a detachable secondary LCD screen, the array enables magnetic wireless charging. Exact availability and pricing remain unannounced. However, recent reports indicate that the Hisense A10 is scheduled to launch in the Chinese market sometime in August 2026.
Sources: www.ithome.com, weibo.com