Xiaomi is working on two foldable phones, namely the Xiaomi Mix Fold 4 and the Mix Flip, targeting the Chinese market. The Mix Fold 4 might debut next month (July) as it has already secured approval from China’s 3C certification platform. The Mix Flip is also expected to launch alongside the Mix Fold 4, having been spotted at the 3C certification last month. Recently, a leak from tipster Digital Chat Station has revealed critical information about the upcoming Mix Flip.
Xiaomi Mix Flip Design and Key Details
Xiaomi Mix Flip’s leaked schematic by DCS
According to DCS, the Xiaomi Mix Flip will boast a large-sized cover display, enabling screen rotation to cater to both left- and right-handed users. The device will be powered by the Snapdragon 8 Gen 3 chipset, currently the most powerful on the market. This chipset promises a performance boost of roughly 50 percent compared to other flip-style foldable phones, with significantly advanced AI capabilities.
Shown above is a schematic of the Mix Flip shared by DCS. Its cover display is notably large and could be around 4 inches, similar to the Honor Magic V Flip’s cover screen. It features dual rings, with the first ring housing an LED flash and a camera, and the second ring containing a second rear-facing camera. Additionally, it will be the only foldable phone with an external earpiece, enhancing its functional capabilities.
Photography and Additional Features
The Mix Flip will stand out in the foldable phone category due to its superior camera performance. Previous reports indicate that the device will feature a 50-megapixel main camera with OIS support and a 60-megapixel OmniVision OV60A telephoto camera with 2x optical zoom. Although details about its battery size remain unclear, it is expected to support 67W fast charging.
The release schedule for the Xiaomi Mix Flip has been advanced, so it will be available sooner than initially anticipated, still suggesting a July launch.
