Xiaomi is reportedly gearing up to step into the realm of clamshell-style foldable smartphones with its anticipated offering, the Mix Flip. Although specific details remain elusive, rumors suggest that the device has made an appearance on China’s 3C certification platform, indicating its imminent debut.
Mix Flip 3C Certification
While the certification itself does not definitively confirm the identity of the device as the Mix Flip, industry insiders have associated the model number 2405CPX3DC with the upcoming handset. Notably, the certification discloses that the phone will support rapid 67W charging.
Anticipated Features and Launch
The 3C listing does not divulge detailed specifications of the Mix Flip. Nevertheless, its presence on the certification site serves as a concrete indication that Xiaomi is actively developing its inaugural clamshell smartphone, suggesting a potential release in the near future.
According to information from Digital Chat Station, Xiaomi is speculated to unveil the Mix Flip in conjunction with the forthcoming Mix Fold 4 during the third quarter of 2024. Expected features include a 50MP primary camera furnished with optical image stabilization and an Omnivision OV60A ½.8” sensor for the 2x telephoto camera.
Further Details and Availability
The device is anticipated to support wireless charging and offer water resistance, a notable addition since none of Xiaomi’s previous foldable models have been certified for water protection. Powering the foldable is projected to be the Snapdragon 8 Gen 3 SoC.
Moreover, reports indicate that the Mix Flip will be accessible in multiple countries, with the exception of India. Stay tuned for updates on any fresh insights concerning this upcoming smartphone.
