Tag: TSMC 3nm Process

  • Samsung’s 3nm Process Faces Power Efficiency and Yield Challenges

    Samsung’s 3nm Process Faces Power Efficiency and Yield Challenges

    According to some previous rumors, Samsung has achieved success with its 3nm process nodes and the development of its 2nm process nodes is also progressing smoothly.

    However, a recent report from Businesskorea indicates that Samsung Foundry’s 3nm process remains significantly inferior to TSMC’s, both in yield rate and power efficiency. For those unfamiliar, higher yield rates mean more functional chips per wafer, lowering the cost per chip and increasing profitability.

    Industry Preferences

    As a result, it is expected that most fabless manufacturers including NVIDIA, AMD, Intel, Qualcomm, MediaTek, and Apple will continue to rely on TSMC for their 3nm chips. It has also been reported that Google will switch to TSMC for its 2025 flagship chipset Tensor G5. Notably, the Tensor G4, which will power the upcoming Pixel 9 series, will still be manufactured by Samsung Foundry and will be based on an updated 4nm process.

    Production Challenges

    Samsung talked about the mass production of their 3nm chips 3 years ago. Back in June 2022, Samsung Foundry was the first in the industry to apply the 3nm gate-all-around (GAA) process to mass production. However, due to the limitations, the company is still struggling to secure customers for the end product. The first generation 3nm process node (SF3E) has performed below the company’s expectations when it comes to performance and power efficiency. It has reportedly been adopted by some niche scenarios like chips for cryptocurrency mining. However, a widespread adoption will still require more improvements in power efficiency and yield rates.

    Yield Rate Issues

    The relatively lower yield rates and power efficiency of Samsung Foundry’s process nodes have long been problematic and are considered the main reasons for the performance gap between Snapdragon (those that are fabricated by TSMC) and Exynos-powered Galaxy devices.

    According to a previous report, Qualcomm is considering a dual-sourcing strategy by partnering with Samsung Foundry alongside TSMC. While this is aimed at securing the company’s business by not relying on a single manufacturer, the company’s CEO mentioned “the current focus must be on the foundry production at TSMC.”

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  • TSMC Faces No Immediate Competition from Huawei in Chipmaking

    TSMC Faces No Immediate Competition from Huawei in Chipmaking

    TSMC, the world’s leading chip manufacturer, minimized concerns about Huawei’s recent progress in chip development during its shareholder meeting. Highlighting a technological disparity and US export limitations, TSMC executives expressed confidence in retaining their market leadership.

    Chairman Mark Liu responded to a shareholder’s question about Huawei and other rivals, stating, “TSMC considers every competitor very carefully. We will always have competitors. But it has nothing to do with Huawei or not.” He downplayed the threat from Huawei, implying that both Huawei and China are significantly behind.

    TSMC's Confidence

    TSMC President Wei Zhejia also asserted that “it’s impossible” for Huawei to match their chip fabrication technology. This confidence stems from TSMC’s entrenched position at the cutting edge of the semiconductor industry.

    Huawei faces significant hurdles due to US government restrictions that limit its access to advanced chipmaking equipment, impeding its ability to compete at the highest level. Consequently, while TSMC plans to initiate 2nm chip production by next year, Huawei is still dealing with 7nm processors, with speculations that their 5nm SoC might launch soon.

    Huawei's Struggles

    Blacklisted by the US in 2019, Huawei has attempted a resurgence with the Mate 60 Pro and its new Kirin 5G processors. However, their 7nm technology places them at a disadvantage in terms of performance and efficiency compared to the latest chips from other manufacturers.

    While Huawei’s strides towards self-reliance are commendable, the technological gap and the constraints imposed by US sanctions remain significant obstacles. The question is whether any competitor, including Huawei, can bridge the gap and challenge TSMC’s dominance and strict export controls. Only time will reveal if a new contender can unseat the current leader in the chipmaking arena.

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  • TSMC to Receive $380M ASML High-NA EUV Lithography Machines

    TSMC to Receive $380M ASML High-NA EUV Lithography Machines

    ASML (Advanced Semiconductor Materials Lithography) is a Dutch company that specializes in the design and manufacturing of lithography machines for the semiconductor sector. These machines play a crucial role in the chip-making process.

    Access to ASML’s state-of-the-art lithography technology has significantly contributed to TSMC’s (Taiwan Semiconductor Manufacturing Company) success as a leading contract chip manufacturer, serving major industry players like NVIDIA and Qualcomm.

    High-NA Lithography Technology

    ASML’s latest announcement reveals that it will ship its most advanced lithography machine, valued at US$ 380 million (~2.753 billion yuan), to TSMC within this year. ASML’s Chief Financial Officer, Roger Dassen, disclosed during a recent conference call that both TSMC and Intel, their two biggest clients, will receive the high numerical aperture (high-NA) extreme ultraviolet (EUV) lithography technology by 2024.

    ASML has already delivered the world’s first commercial high-NA EUV lithography machine to Intel, with the initial unit being sent to an Oregon factory in late December. The exact timing for TSMC to receive this advanced tool remains unspecified.

    The high-NA lithography technology is anticipated to shrink transistor sizes by 66%. This reduction enables chip manufacturers to pack more transistors into the same silicon area, enhancing power efficiency and sustained performance.

    Technical Advancements

    The high-NA EUV system achieves a numerical aperture of 0.55, improving accuracy and allowing for more intricate silicon patterning compared to previous EUV systems with a 0.33 numerical aperture lens. The new machine is also 30% larger than its predecessors, which already required three Boeing 747s for transportation.

    Regarding TSMC, the development of their 2nm nodes is reportedly on track. The company plans to start developing the N3X and N2 processes in Q2 2025, with mass production of N2P and A16 slated for Q2 2026. The 2nm process will incorporate Gate-all-around FETs (GAAFET).

    TSMC predicts that its 2nm process will offer a 10% to 15% performance boost and reduce power consumption by 25% to 30%.

    TSMC to Receive 0M ASML High-NA EUV Lithography Machines
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  • Snapdragon 8 Gen 4: 4.2GHz Cores, 10K Multi-Core Benchmark Leak

    Snapdragon 8 Gen 4: 4.2GHz Cores, 10K Multi-Core Benchmark Leak

    Qualcomm’s next high-end mobile processor, the Snapdragon 8 Gen 4, is set to bring a significant shift to its SoC lineup with the introduction of custom Oryon CPU cores.

    Recently, a tip from Digital Chat Station hinted at a substantial performance enhancement that could challenge MediaTek’s Dimensity 9400. According to the tipster, the Snapdragon 8 Gen 4’s high-performance core will clock in at an impressive 4.2GHz. Just three years ago, the Snapdragon 888+ was notable for hitting 3GHz, and now we’re looking at over 4GHz for a smartphone processor.

    Benchmarks and Performance

    The tipster also mentioned that a lab prototype of the Snapdragon 8 Gen 4 achieved remarkable benchmark scores, likely on Geekbench, with 3,000 points in single-core and 10,000 points in multi-core tests. This represents a 35.5% and 33.9% improvement in single-core and multi-core performance, respectively, compared to the Snapdragon 8 Gen 3.

    Below are the average Geekbench scores for recent smartphone SoCs:

    ProcessorSingle-CoreMulti-Core
    Apple A17 Pro29997903
    Dimensity 930022647857
    Snapdragon 8 Gen 322137466
    Apple A1626717271
    Snapdragon 8 Gen 220365697
    Dimensity 920019055119

    Manufacturing and Pricing

    In response to a user inquiry, the tipster confirmed that the Snapdragon 8 Gen 4 will be produced using TSMC’s 3nm technology. This is expected to enhance both performance and efficiency. However, the upgrade will come at a higher cost. A recent report indicated that devices featuring the new SoC will be priced around 4,500 yuan.

    To provide some context, the Xiaomi 14 debuted at a starting price of 3,999 yuan ($550), which suggests an approximate price increase of 500 yuan ($70) for models with the Snapdragon 8 Gen 4. Additionally, it’s speculated that the Xiaomi 15 will be the first smartphone to incorporate the Snapdragon 8 Gen 4 SoC.

    Snapdragon 8 Gen 4: 4.2GHz Cores, 10K Multi-Core Benchmark Leak
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  • Leaked: Google Sources Tensor G5 Chips from TSMC

    Leaked: Google Sources Tensor G5 Chips from TSMC

    We’ve been hearing rumors that Google will itself design the Tensor G5 chip for the Pixel 10 and 10 Pro. Unlike previous Tensor chips, which have relied on Samsung’s expertise and Foundry since its debut, G5 is said to make a switch to TSMC for its fabrication process.

    Now, the publication Android Authority has got its hands on the shipping manifest for a sample Tensor G5 chip imported into India, confirming that Google is switching to TSMC.

    Chip Details and Codename

    The document reveals several details about the chip, including Google’s part number (G313-09488-00), the product categories (Integrated Circuit, System on a Chip), and that it is a new product.

    It also confirms that TSMC is the manufacturer of the SoC. The speculation that this is the Tensor G5 SoC is supported by the component’s codename, LGA, which stands for “Laguna Beach,” believed to be the codename for the fifth-generation Tensor chipset.

    Packaging Technology and Memory Options

    Another sign that TSMC is making the Tensor G5 can be seen on the document where InFO POP is listed as the packaging technology used on the chipset. InFO POP technology is exclusive to TSMC.

    Additionally, the document confirms the chip passed a system-level test (SLT) simulating basic functionalities. It also mentions 16GB of POP (package-on-package) RAM, potentially hinting at similar memory options for the upcoming Pixel 10 series.

    Potential Upgrade Consideration

    Considering this leak, if you’re planning to upgrade to a Pixel phone this year (Pixel 9 series), you might want to wait for the Pixel 10 in 2025. The Pixel 10 is likely to feature a more powerful and customized chip designed by Google, offering optimized performance for the Pixel 10 line.

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  • Snapdragon 8 Gen 4 Price Hike May Raise Flagship Phone Costs

    Snapdragon 8 Gen 4 Price Hike May Raise Flagship Phone Costs

    Qualcomm is gearing up for a significant shift with the forthcoming Snapdragon 8 Gen 4, slated for an official reveal in October. This new SoC will incorporate in-house CPU designs featuring custom Oryon cores. However, this move towards greater autonomy may come with a price for smartphone producers.

    Advanced Technology and Higher Costs

    Much like Apple’s M-series chips, the Snapdragon 8 Gen 4 is speculated to use TSMC’s cutting-edge 3nm process (N3E). This will mark Qualcomm’s first utilization of 3nm technology for its SoCs, promising enhanced performance and efficiency. However, this advancement will result in increased production expenses.

    According to Weibo tipster Digital Chat Station, the wafer price for the Snapdragon 8 Gen 4 has escalated, which will directly influence the final cost of the SoC.

    Impact on Market Pricing

    This price surge isn't entirely unexpected. Qualcomm had previously hinted at a higher price point for the Snapdragon 8 Gen 4 due to the integration of Oryon cores.

    The increased cost could trigger a domino effect in the smartphone market. With a more expensive chip, manufacturers might need to strategically evaluate their devices’ overall configurations to maintain competitive pricing.

    For instance, the Redmi K70 Pro from last year, powered by the Snapdragon 8 Gen 3, was among the most affordable flagship models. However, with a pricier Snapdragon 8 Gen 4, achieving a similar price point for its successor could be challenging for companies like Xiaomi.

    Manufacturer Dilemmas

    It's important to note that even the Snapdragon 8 Gen 3 wasn't cheap for manufacturers, reportedly costing around $200 per unit. An additional price increase for the Gen 4 could place phone makers in a tough spot, compelling them to either reduce their profit margins or potentially hike the end price for consumers.

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