Tag: SK Hynix

  • Samsung HBM4 Memory Begins Trial Production, Mass Production by 2025

    Samsung HBM4 Memory Begins Trial Production, Mass Production by 2025

    Samsung Electronics has completed the design for its upcoming High Bandwidth Memory (HBM4) logic chips and has begun trial production using a 4nm process. This is an important move that paves the way for mass production in the latter part of 2025, which is roughly six months earlier than the initial timeline set for 2026. This acceleration might help Samsung secure significant orders for future GPU platforms from Nvidia.

    Production Details

    Reports suggest that Samsung’s storage unit has finalized the logic chip designs, while their foundry unit is actively engaged in trial runs at the 4nm level. The HBM4 production takes place in a specialized facility known as D1c, which utilizes a cutting-edge 10nm DRAM process. Notably, Samsung has bypassed the traditional D1b development phase to expedite the process.

    Performance Enhancements

    Technical insights revealed at ISSCC 2024 indicate that HBM4 will provide a substantial increase in performance, achieving data transfer speeds of up to 2 TB/s—around 66 percent faster than the previous HBM3E. Additionally, it will feature a 2048-bit interface operating at 6.4 GT/s and a capacity increase up to 48 GB, which is 33 percent larger than its predecessor.

    Competitive Landscape

    On the other hand, SK Hynix, Samsung’s main competitor in the HBM market, is also reportedly accelerating its own HBM4 development to meet the same 2025 deadline. Analysts from Hanwha Investment & Securities predict that SK Hynix will maintain its market share lead and may be the first to deliver HBM4 samples to its clients.

    Beyond Nvidia, Samsung is tailoring HBM4 solutions for clients like Microsoft and Meta. This memory technology is crucial for Nvidia’s forthcoming “Rubin” GPU platform, expected in 2026, which will incorporate eight HBM4 chips and depend on TSMC’s 3nm process.

    Market Trends

    Samsung’s existing range of HBM products is experiencing significant growth. Sales in the third quarter of 2024 increased by over 70 percent compared to the previous month. HBM3E products, including both 8-layer and 12-layer versions, have entered mass manufacturing and are projected to comprise about half of Samsung’s total HBM sales by the end of 2024.

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  • SK Hynix Unveils Next-Gen UFS Storage Technology

    SK Hynix Unveils Next-Gen UFS Storage Technology

    According to a recent announcement from South Korean semiconductor manufacturer SK Hynix, the company has introduced a new line of storage products, showcased at the FMS 2024 Summit. This new development features USF 4.1 universal flash memory.

    New UFS 4.1 Flash Memories Unveiled

    SK Hynix presented two UFS 4.1 universal flash memories with capacities of 512GB and 1TB respectively. These are based on 321-layer stacked V9 1Tb TLC NAND flash memory. In addition to revealing the 1Tb capacity and 2.4Gbps rate TLC, the company also introduced the industry-leading 3.2Gbps V9 2Tb QLC and 3.6Gbps high-speed V9H 1Tb TLC particles for the first time.

    Anticipated Improvements in Data Transfer Rates

    While detailed specifications of the UFS 4.1 storage chips have not been officially released, it is rumored that UFS 4.1 storage offers a data transfer rate of 8 gigabits per second (GB/s), compared to the 4 GB/s offered by the UFS 4.0 storage chips.

    The latest UFS specification available is UFS 4.0, published in August 2022, which specifies a theoretical interface speed of up to 46.4Gbps per device. USF 4.1 is expected to further enhance the transfer rate.

    Previous Announcements and Future Expectations

    In May this year, the company also revealed its development of the ZUFS 4.0 (Zoned UFS). This NAND flash memory chip enhances data management efficiency and optimizes data transfer between the operating system and storage devices. Applications for this product include various electronic devices such as digital cameras and smartphones. It is also said to improve the performance of on-device AI applications.

    UFS 4.1 is anticipated to further boost the storage performance of smartphones and other electronic devices. According to a previous leak, these improvements might be experienced with the Galaxy S25 Ultra.

    SK Hynix Unveils Next-Gen UFS Storage Technology
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  • SK Hynix Unveils 300TB SSD Prototype to Address Future Data Growth

    SK Hynix Unveils 300TB SSD Prototype to Address Future Data Growth

    SK Hynix has made waves with the introduction of an innovative solid-state drive (SSD) boasting an impressive 300TB storage capacity. Unveiled during a press event in Seoul, South Korea, this prototype signals a significant advancement in data storage technology.

    Ramping Up Data Storage Solutions

    The announcement of the 300TB SSD aligns with SK Hynix's broader strategy to drive the progression of artificial intelligence (AI) across data centers and personal devices. Analysts predict a substantial surge in global data creation, with projections soaring from 15ZB (Zettabytes) in 2014 to a staggering 660ZB by 2030. This rapid growth underscores the crucial demand for high-capacity storage solutions such as 100TB hard disk drives (HDDs) and the groundbreaking 300TB SSDs.

    Although specific details about the 300TB SSD are currently undisclosed, the announcement itself hints at the future of data storage technologies. The upcoming years are likely to witness a notable increase in the requirement for both high-capacity drives and high-performance all-flash arrays, catering to diverse applications.

    Diversified Product Portfolio

    SK Hynix's innovation doesn't stop at the 300TB SSD. The company is also working on a comprehensive range of products tailored to support various aspects of AI, encompassing training and inference in data centers (HBM4, HBM4E, CXL pooled memory solutions, memory processing solutions), edge AI devices (LPDDR6, GDDR7, PIM), and on-device AI inference (LPDDR6, GDDR7, high-capacity DDR5).

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  • Samsung Keeps Aging Chip Manufacturing Equipment Amid US Concerns

    Samsung Keeps Aging Chip Manufacturing Equipment Amid US Concerns

    Samsung, a prominent global technology giant, boasts an extensive array of products that distinguish it from its competitors. Among its offerings are smartphones, tablets, headphones, televisions, and robot vacuum cleaners. Additionally, the South Korean company is involved in the production of screens, batteries, and semiconductor chips.

    Samsung's Diverse Product Range

    This broad spectrum of products enables Samsung to cater to a wide range of consumers and businesses similar to Apple. However, recent reports indicate that Samsung is holding onto outdated chip-making equipment, a move believed to be linked to concerns surrounding potential repercussions from US sanctions.

    Concerns Over US Sanctions Prompt Samsung's Decision

    Traditionally, tech firms prioritize sustainability and resource efficiency by upgrading their production lines with newer equipment and selling off older machinery. This practice not only facilitates factory updates but also maximizes the utilization of existing assets. Despite this norm, companies like Samsung and SK Hynix have opted to retain their old chip-making equipment amid apprehensions about encountering issues with the United States.

    The primary rationale behind this strategic shift is the fear that these components could inadvertently find their way to countries such as Russia and China, which are under US embargoes. While both companies exercise caution, there have been instances where their products have ended up in restricted markets, as evidenced by SK Hynix chips used in the Huawei Mate 60 series causing complications a few months back, prompting an official response from the company.

    Balancing Risk Amidst Changing Political Landscapes

    Although there are no explicit legal restrictions on products supplied to valid buyers, the approaching presidential election has induced a sense of caution among manufacturers who are increasingly averse to taking any chances. This scenario presents unique challenges as some manufacturers are compelled to invest significant sums in storing outdated equipment, while companies like Huawei face potential setbacks in the competitive landscape if they are unable to access cutting-edge technologies.

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