Tag: Rapidus

  • Rapidus Plans to Mass-Produce 1.4 nm Chips by 2029

    Rapidus Plans to Mass-Produce 1.4 nm Chips by 2029

    Key Takeaways

    1. Rapidus aims to compete with TSMC and Intel in the sub-2 nm technology field, planning to mass-produce 1.4 nm chips by 2029.
    2. The project will require several trillion yen in investments, primarily funded by the Japanese government and private investors.
    3. Full-scale research and development for the 1.4 nm chips will start in 2026, in partnership with IBM.
    4. Rapidus has completed the design for its 2 nm chip but has not announced mass production capabilities or secured clients yet.
    5. If successful, Rapidus’s 1.4 nm technology will still be behind TSMC’s and Intel’s production timelines, potentially increasing competition in the semiconductor market.

    Rapidus, an unexpected newcomer in Japan’s semiconductor sector, is aiming to compete with TSMC and Intel in the sub-2 nm technology field. According to a report by Nikkei Asia, the company plans to begin mass production of 1.4 nm chips by 2029, just two years after it launches its first 2 nm chips into the market.

    Major Investments Ahead

    This ambitious project is expected to cost Rapidus several trillion yen, with most of the financing coming from the Japanese government and private investors. The full-scale research and development for the 1.4 nm chips is set to begin in 2026, in collaboration with IBM.

    Current Status of Production

    While Rapidus has successfully completed the design for its 2 nm chip, details regarding its mass production capabilities have not been disclosed. The company intends to utilize ten ASML EUV scanners, likely reserving five for the 2 nm chips and the others for future nodes. As of now, Rapidus has not secured any clients, but such information is rarely shared, especially for new entrants in the industry.

    If Rapidus manages to launch its 1.4 nm technology by 2029, it will still lag behind TSMC’s A14 node, which is projected to begin production in 2028. Additionally, Intel’s 14A node is anticipated to debut a year prior, coinciding with Samsung Foundry’s SF1.4. If everything unfolds as planned, OEMs could benefit from three more foundries, which would help to lessen their dependence on TSMC.

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  • Rapidus to Deploy 10 EUV Machines for 2nm Chip Production in Japan

    Rapidus to Deploy 10 EUV Machines for 2nm Chip Production in Japan

    Rapidus, a chip manufacturer from Japan, is gearing up to deploy 10 advanced extreme ultraviolet (EUV) lithography systems across its new production facilities. This initiative is expected to significantly enhance Japan’s position in the advanced chip manufacturing industry. CEO Atsuyoshi Koike revealed these intentions regarding the new IIM-1 and IIM-2 plants, as reported by Nikkan Kogyo Shimbun.

    First EUV Machine Arrives

    In December 2024, the very first EUV lithography machine landed at New Chitose Airport, marking a historic moment for Japan. As per the company’s schedule, Rapidus aims to begin trial production of 2nm chips at the IIM-1 facility as soon as April 2025, with plans to deliver sample chips to the semiconductor giant Broadcom by June.

    Production Capacity Insights

    Considering the production potential, projections indicate that if five EUV machines operate at full capacity, IIM-1 could handle between 17,000 and 20,000 wafers per month, given that about 20 EUV layers are involved in the manufacturing process. Rapidus intends to use ASML’s Twinscan NXE:3800E scanner, which has the capability to process up to 220 wafers each hour at a dose of 30mj/cm².

    Competing with Industry Giants

    With a bold target to achieve mass production of 2nm chips by 2027, Rapidus is entering a competitive arena filled with established players. For instance, TSMC is set to begin its own 2nm chip production in 2025 and has secured significant clients like Apple, NVIDIA, AMD, and Qualcomm.

    On the other side, Samsung is also taking steps to adapt some of its 3nm production lines for 2nm technology, conducting tests collaboratively with companies such as NVIDIA and Qualcomm.

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  • Japan Invests $65 Billion to Boost Semiconductor Industry

    Japan Invests $65 Billion to Boost Semiconductor Industry

    Japanese Prime Minister Shigeru Ishiba has unveiled an impressive plan worth 10 trillion yen (approximately $65 billion) aimed at rejuvenating Japan’s semiconductor and AI sectors. This substantial investment strategy is set to be introduced to parliament and intends to boost local chip production by the year 2030.

    Focus on Rapidus and AI Chips

    A key element of this initiative is the Rapidus project, which is Japan’s emerging chip manufacturing endeavor, alongside other firms focused on AI semiconductors. Rapidus commenced in 2022 with support from the government and eight leading companies, targeting mass production of 2-nanometer chips by 2027 in Hokkaido. To achieve this goal, they have formed partnerships with IBM and the Belgian research organization Imec.

    Economic Expectations

    The government anticipates a considerable economic effect, aspiring to generate around 160 trillion yen (close to $1 trillion) in financial benefits. They foresee approximately 50 trillion yen ($322 million) in total investment from both public and private sectors for semiconductor advancement over the next decade.

    Funding without Bonds

    Interestingly, Ishiba has noted that they won’t be utilizing deficit-covering bonds for financing this project. While he didn’t elaborate on the sources of funding, it’s evident that this marks a significant rise from Japan’s previous 2 trillion yen ($12.9 billion) investment in its semiconductor industry, highlighting the country’s commitment to regaining a prominent position in the global chip market.

    This initiative arrives as nations worldwide are working to strengthen their supply chains in response to recent market challenges and ongoing trade tensions between the U.S. and China. The entire economic package, which includes these semiconductor initiatives, is scheduled for cabinet approval on November 22. This is Japan’s most daring strategy in years to reclaim its status as a frontrunner in advanced chip manufacturing, reminiscent of its past dominance during the 1980s and 1990s.

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