Tag: Kirin 9000S

  • China Achieves 5nm Chip Tech Without EUV: SMIC Defies Sanctions

    China Achieves 5nm Chip Tech Without EUV: SMIC Defies Sanctions

    Key Takeaways

    1. SMIC has successfully produced 5nm chips using older DUV equipment instead of EUV lithography.
    2. The technique employed is called Self-Aligned Quadruple Patterning (SAQP), which simulates EUV accuracy.
    3. This achievement challenges the belief that EUV is essential for producing advanced chips below 7nm.
    4. The production process is more time-consuming, error-prone, and costly but has resulted in functional 5nm-class chips.
    5. The new chips are already integrated into devices like the Huawei Mate 60, outperforming competitors with features like satellite call capabilities.

    In a significant development that could transform the worldwide semiconductor market, China’s Semiconductor Manufacturing International Corporation (SMIC) has seemingly succeeded in producing 5nm chips without relying on extreme ultraviolet (EUV) lithography.

    Innovative Techniques Used

    Instead, SMIC has employed older deep ultraviolet (DUV) equipment, combined with a complex technique called Self-Aligned Quadruple Patterning (SAQP). This achievement, highlighted in several tweets by semiconductor expert William Huo on X, represents not just a technological advance but also a bold message in the realm of geopolitics.

    Overcoming Challenges

    Traditionally, the industry has believed that EUV lithography, which is only available from the Dutch firm ASML, was essential for producing chips at 5nm and lower. With the limitations on EUV access imposed by the U.S. and its partners, many experts thought that China would be unable to progress beyond the 7nm level. However, SMIC has managed to forge ahead, using intensive DUV methods to extract every possible nanometer from their older equipment.

    Results of the Breakthrough

    According to Huo, this process involved layering several lithography and etching steps, particularly utilizing SAQP to simulate the accuracy of EUV. Although this technique is more time-consuming, prone to mistakes, and costly, it proves effective. The outcome? A functioning 5nm-class chip, which is reportedly already integrated into devices such as the Kirin 9000S-powered Huawei Mate 60, that notably outperformed the iPhone 15 by providing satellite call capabilities first.

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  • Huawei’s November 26 Event: Second-Gen MatePad Pro 13.2 Tablet

    Huawei’s November 26 Event: Second-Gen MatePad Pro 13.2 Tablet

    Huawei is preparing for a significant product release on November 26, 2024. This event is likely to showcase a variety of high-end devices, such as the much-awaited Mate 70 series, the Mate X6 foldable smartphone, and the fourth generation of Freebuds Pro earbuds.

    Huawei MatePad Pro 13.2

    According to the well-known leaker Digital Chat Station, the event will also introduce the MatePad Pro 13.2, which is expected to be a next-gen model featuring a 2.8K 3:2 OLED display. The first version of the 13.2-inch MatePad Pro was released in China back in September 2023 and came equipped with Huawei’s Kirin 9000s processor. The new model might have an enhanced SoC, possibly the Kirin 9010 or the new Kirin 9100 chip. The Kirin 9100 has been recently disclosed to be built on a 6nm technology and includes a Cortex-X1 core running at 2.67 GHz. Although detailed specs for the new tablet are still under wraps, the older model gives us some insight into what can be anticipated.

    Huawei MatePad Pro 13.2 specifications

    The Huawei MatePad Pro 13.2 features a 13.2-inch OLED display with super-slim 3.4mm bezels, achieving a remarkable 94% screen-to-body ratio. The display has a resolution of 2880 x 1920 pixels, a refresh rate of 144Hz, a 3:2 aspect ratio, and HDR capabilities. It weighs in at 580g and is only 5.5mm thick.

    Inside, the MatePad Pro 13.2 is driven by the Kirin 9000s chipset and is supported by a 10,100mAh battery that features 88W fast charging. It can come with up to 16GB of LPDDR4x RAM and offers 1TB of UFS 3.1 storage. The tablet operates on HarmonyOS 4.0 and includes a total of six speakers.

    Advanced Features

    This device incorporates Huawei’s StarLight technology and is compatible with the Huawei M-Pencil (3rd generation) stylus, providing an impressive 10,000 levels of pressure sensitivity for accurate writing and drawing. Camera specifications feature a 16MP front camera paired with a 3D ToF sensor, alongside a dual rear camera setup that includes a 13MP main sensor and an 8MP ultra-wide sensor.

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  • Huawei Unveils Processor Details for Popular Smartphone Lineups

    Huawei Unveils Processor Details for Popular Smartphone Lineups

    In a surprising development, Huawei has lifted its embargo on chipset information for its latest phones. This change allows consumers to finally discover the processors powering the Mate 60, Mate X5, and Pura 70 series devices.

    Previously, Huawei had kept the specific chipsets used in these phones under wraps. However, tipster “Adak is a wolf” announced on Weibo that Huawei’s frontline sales staff are now permitted to share processor details.

    Huawei Lifts Chip Embargo, Now Discloses Processor Details

    A visit by Chinese media outlet IT Home to a Huawei flagship store confirmed that the Mate 60 and Mate X5 series are equipped with Kirin 9000S series processors, while the Pura 70 Pro/Ultra features the Kirin 9010 chip.

    Interestingly, Huawei’s recently launched international products, such as the MatePad SE 11", MatePad Pro 13.2", and Nova Y62/Plus phones, already reveal their processor models on the official website.

    The previous secrecy was likely due to ongoing US sanctions, which scrutinize Huawei’s advanced chip manufacturing capabilities. Keeping chip details under wraps might have been a strategy to reduce pressure.

    Shift in Sales Strategy

    This new transparency signals a shift in Huawei’s sales strategy, potentially resulting in clearer communication in future product releases. While specific processor models are now disclosed, the details remain limited. In-store staff can only provide basic information about the chipset family and generation. Furthermore, the phone settings themselves will not display the specific processor model.

    Future Prospects

    Huawei is currently developing its next flagship model, which is expected to compete with the forthcoming iPhone 16 series. The Mate 70 series, anticipated in Q4 2024, will feature an upgraded Kirin chipset with AI-based capabilities, enhanced imaging, and support for satellite communication. This series will run on the HarmonyOS Next operating system and maintain 1.5K resolution displays.

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  • Huawei Developing Energy-Efficient Taishan Cores for Kirin Chips

    Huawei Developing Energy-Efficient Taishan Cores for Kirin Chips

    A recent leak indicates that Huawei is developing next-generation Taishan cores, which are expected to deliver substantial enhancements in performance and energy efficiency compared to the existing Kirin 9000s cores. This advancement could significantly elevate the capabilities of future Kirin processors.

    Tipster Jasonwhoill on X (formerly Twitter) has revealed that Huawei is currently testing new Taishan cores that outshine the performance of the Kirin 9000s processor. These cores, which are akin to Apple’s small cores in design, are said to achieve remarkably low power consumption.

    Performance Benchmarks

    The leak states that the new cores achieved a score of 350 points in single-core Geekbench 5 testing, in contrast to the Kirin 9000s cores, which scored 200 points. Presently, the Kirin 9000s employs Cortex-A510 low-energy cores, the first ARMv9 ‘LITTLE’ CPU cores, which were also featured in Qualcomm’s Snapdragon 8 Gen 1 chip in 2022.

    Potential Rival to Apple’s M3

    There is also speculation that Huawei is working on a Kirin PC chip with the Taishan V130 architecture, potentially positioning it as a competitor to Apple’s M3.

    An earlier report suggested that a new CPU architecture might be incorporated into the upcoming Mate 70 series, potentially featuring a robust 5nm chipset, indicating a significant step forward in Huawei’s smartphone technology.

    Unconfirmed Developments

    However, Huawei has not validated any of these claims, so it is prudent to approach this information with skepticism.

    Discussions are ongoing regarding a new Kirin chipset and its CPU architecture, with some claims suggesting it could exceed the performance of the Kirin 9000s. These rumors, however, conflict with Huawei’s previous statements.

    Constraints and Challenges

    The company has focused on enhancing existing 7nm chips rather than developing entirely new technologies. Additionally, US sanctions restrict Huawei’s access to advanced chip-making equipment, impeding its ability to compete at the cutting edge of technology.

    For now, the situation surrounding these rumors is uncertain. Hopefully, more details will surface in the coming days to clarify this evolving narrative.

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  • Huawei P70 Report: Kirin 9000S Chipset Rumors

    Huawei P70 Report: Kirin 9000S Chipset Rumors

    Huawei P70 Series: Possible Curved Display and Camera Module Revamp Leaks

    Speculations surrounding the upcoming Huawei P70 series have begun surfacing, providing insights into what the Chinese technology powerhouse might introduce in its premium smartphone lineup. Although official details and specifications are yet to be confirmed, leaks from credible sources are starting to unveil what consumers might anticipate from this highly awaited series.

    Intriguing Curved Display Prospects

    A recent disclosure by Weibo informant Smart Pikachu hints at the inclusion of curved displays in the Huawei P70 series. However, diverging from the trend of most current flagship smartphones offering 2K resolutions, the P70 series might veer towards a slightly lower 1.5K resolution. While this decision may pique curiosity, the implications on the overall visual quality of the device remain uncertain.

    Potential Kirin 9000S Processor for the Base Model

    Another revelation from Smart Pikachu suggests that the entry-level variant of the Huawei P70 series could be driven by the Kirin 9000S chip, a processor seen in the Mate 60 series. The Kirin 9000S boasts an octa-core configuration, comprising one high-performance core, three performance cores, and four efficiency cores. Additionally, it comes integrated with a Mali-G710 MC10 GPU, promising seamless and effective performance.

    Overhauled Camera Module Design

    Digital Chat Station, a respected source, recently unveiled a mock-up of the Huawei P70’s rear panel, showcasing a significant transformation in the camera module design from its predecessor, the Huawei P60. The module now exhibits a substantial, rounded rectangular form, accommodating a triple-camera configuration. The lenses are aligned in a triangular layout, with the prominent branding of XMAGE adorning the module.

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  • Unveiling the Mystery: Kirin 9000S Chipset’s True Origin and Specifications

    Unveiling the Mystery: Kirin 9000S Chipset’s True Origin and Specifications

    In a recent twist of events, the enigmatic Kirin 9000S chipset, which powers the Huawei Mate 60 Pro, has sparked a whirlpool of discussions among tech enthusiasts and experts. Initially, it was believed that the Kirin 9000S was manufactured by China’s largest foundry, SMIC, utilizing its 7nm node technology. However, new revelations suggest a different narrative, hinting at the Kirin 9000S being a rebranded version of the 5nm Kirin 9000 chipset from 2020, produced by TSMC.

    The Revelation

    A tipster, known as @RGcloudS on Twitter, shed light on this perplexing scenario. Through a series of investigative tweets, he presented evidence suggesting that the Kirin 9000S chipset is essentially the Kirin 9000 chipset, originally manufactured by TSMC three years ago, and not by SMIC as previously believed. A screenshot shared by the tipster lists the Kirin 9000S as a 5nm chip. Further, a date stamp on one of the Kirin 9000S chipsets from the Mate 60 Pro teardown reveals that it was manufactured during the 35th week of 2020, reinforcing the claim that the Kirin 9000S is indeed a rebranded Kirin 9000.

    Implications for Huawei and SMIC

    The initial belief that SMIC was behind the Kirin 9000S’s production had raised eyebrows, especially among U.S. lawmakers and officials who had been advocating for tighter sanctions against Huawei. The backdrop to this is the expanded export rules by the U.S. in 2020, aimed at preventing foundries using U.S. technology from shipping cutting-edge silicon to Huawei without a license. The Mate 60 Pro, powered by the Kirin 9000S, stood as an exception to the trend where previous Huawei flagship series had to rely on Qualcomm Snapdragon chipsets tweaked for 4G connectivity due to these restrictions.

    The revelation that the Kirin 9000S is potentially a rebranded Kirin 9000 made by TSMC brings a new dimension to the narrative, casting doubts over the previously held beliefs regarding SMIC’s capability in producing such an advanced chipset without access to extreme ultraviolet lithography (EUV) machine, a crucial technology for etching extremely thin circuitry patterns on silicon wafers.

    The Road Ahead

    With the new findings, there’s a brewing discussion among analysts regarding how Huawei managed to work around the U.S. sanctions. The stockpile of Kirin 9000 chipsets could explain Huawei’s ability to offer 5G connectivity in its Mate 60 Pro model for the first time since 2020. This revelation might also prompt a re-evaluation of the sanctions and export control measures in place, potentially impacting the global semiconductor landscape and the ongoing tech cold war between the U.S. and China.

    In conclusion, the Kirin 9000S saga unfolds a complex narrative intertwining technology, geopolitics, and corporate strategy. As the tech community delves deeper into this matter, one can anticipate more discussions and analyses shedding light on the intricacies of global tech supply chains and the relentless pursuit for semiconductor supremacy.

    Source: PhoneArena

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