Tag: high-NA EUV

  • Samsung Acquires 2nm Chip Tool from ASML: Impact on Exynos 2600?

    Samsung Acquires 2nm Chip Tool from ASML: Impact on Exynos 2600?

    Key Takeaways

    1. Samsung has acquired the first TWINSCAN EXE:5000 High-NA EUV machine from ASML, crucial for producing the 2nm Exynos 2600 chip.
    2. The launch of the Exynos 2500 chip has faced delays due to performance issues and low yield rates from the 3nm process node.
    3. The new High-NA EUV machine could help improve yield rates, allowing for the use of the Exynos 2600 in future Galaxy flagship models.
    4. Samsung’s investment in this technology may reduce reliance on Qualcomm chips and lower manufacturing costs.
    5. Upcoming Galaxy S25 models are expected to resemble their predecessors, with notable differences only in the Ultra model’s design.

    The recent buzz revolves around Samsung’s purchase of High-NA EUV machinery from ASML, which is the only company that makes such equipment. Earlier this month, the first TWINSCAN EXE:5000 High-NA EUV machine was delivered to Samsung’s Hwaseong Campus in South Korea. This machine is said to be essential for producing the 2nm Exynos 2600 chip.

    Potential Impact on Exynos 2600

    Samsung faced challenges in launching the Exynos 2500 chip on time, which was expected to power the base and plus variants of the Galaxy S25 series. There have been whispers about this chip being used in upcoming foldable devices, but nothing is confirmed at this moment.

    The delay is largely linked to the performance issues of the Exynos 2500, which reportedly does not align with the standards that Samsung’s mobile division has established for flagship and foldable models. A significant factor causing the hold-up with the Exynos 2500 was the yield rate of the 3nm process node, which measures the proportion of functional chips produced compared to the total made.

    Improvements on the Horizon

    With the arrival of the advanced High-NA EUV machine, Samsung Foundry may be able to resolve these yield problems. This could pave the way for utilizing the Exynos 2600 in future Galaxy flagship models, particularly the base and plus versions, similar to previous launches. Considering the enhancements seen with the Exynos 2200 and Exynos 2400, it appears Samsung Foundry is making progress.

    While this investment requires some upfront costs, lowering manufacturing expenses (due to reduced reliance on Qualcomm chips) might motivate the company to channel resources into redesigning and upgrading their hardware. After all, the Galaxy S25 and S25 Plus are essentially similar to their predecessors, with the Ultra model only standing out in hardware by its rounded edges and flat middle frame.

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    Samsung Acquires 2nm Chip Tool from ASML: Impact on Exynos 2600?
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  • TSMC Invests $350M in High NA EUV for 1.4nm Chip Tech

    TSMC Invests $350M in High NA EUV for 1.4nm Chip Tech

    Taiwan Semiconductor Manufacturing Corporation (TSMC) is planning to buy ASML’s newest High NA EUV lithography system by the end of 2024. This is a big step for the semiconductor field. The machine, called the Twinscan EXE:5000, costs around $350 million and is filled with state-of-the-art tech for chip production.

    Advanced Technology Features

    This high-tech system has an incredible 8nm resolution and operates with a 13.5nm EUV light wavelength. It allows chipmakers to create smaller chips and fit in up to 2.9 times more transistors than what was possible before. TSMC aims to implement this technology in its upcoming 1.4nm (A14) manufacturing process, intending to start mass production by 2027.

    Industry Adoption

    Intel has already taken the leap by being the first to use High NA EUV, having set up two machines at its facility in Oregon earlier in 2024. Samsung is expected to follow suit, likely by early 2025. Currently, Intel, Samsung, and TSMC are the only confirmed companies with access to ASML’s advanced technology, primarily due to international trade regulations that prevent Chinese companies from obtaining it.

    Challenges Ahead

    Although ASML has claimed to receive 10-20 orders for these machines, bringing them into operation isn’t as easy as it sounds. Their large size means that manufacturers may have to significantly upgrade their existing facilities or even construct new ones. Additionally, these machines have a smaller imaging field compared to current NA EUV systems, which requires a redesign of chip architectures.

    TSMC’s decision to invest in High NA EUV highlights its dedication to leading in advanced chip manufacturing, especially as the demand for AI chips keeps rising. Even though it might take a few years before mass production with this technology truly begins, it represents a move towards the future of semiconductor manufacturing.

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  • TSMC to Receive $380M ASML High-NA EUV Lithography Machines

    TSMC to Receive $380M ASML High-NA EUV Lithography Machines

    ASML (Advanced Semiconductor Materials Lithography) is a Dutch company that specializes in the design and manufacturing of lithography machines for the semiconductor sector. These machines play a crucial role in the chip-making process.

    Access to ASML’s state-of-the-art lithography technology has significantly contributed to TSMC’s (Taiwan Semiconductor Manufacturing Company) success as a leading contract chip manufacturer, serving major industry players like NVIDIA and Qualcomm.

    High-NA Lithography Technology

    ASML’s latest announcement reveals that it will ship its most advanced lithography machine, valued at US$ 380 million (~2.753 billion yuan), to TSMC within this year. ASML’s Chief Financial Officer, Roger Dassen, disclosed during a recent conference call that both TSMC and Intel, their two biggest clients, will receive the high numerical aperture (high-NA) extreme ultraviolet (EUV) lithography technology by 2024.

    ASML has already delivered the world’s first commercial high-NA EUV lithography machine to Intel, with the initial unit being sent to an Oregon factory in late December. The exact timing for TSMC to receive this advanced tool remains unspecified.

    The high-NA lithography technology is anticipated to shrink transistor sizes by 66%. This reduction enables chip manufacturers to pack more transistors into the same silicon area, enhancing power efficiency and sustained performance.

    Technical Advancements

    The high-NA EUV system achieves a numerical aperture of 0.55, improving accuracy and allowing for more intricate silicon patterning compared to previous EUV systems with a 0.33 numerical aperture lens. The new machine is also 30% larger than its predecessors, which already required three Boeing 747s for transportation.

    Regarding TSMC, the development of their 2nm nodes is reportedly on track. The company plans to start developing the N3X and N2 processes in Q2 2025, with mass production of N2P and A16 slated for Q2 2026. The 2nm process will incorporate Gate-all-around FETs (GAAFET).

    TSMC predicts that its 2nm process will offer a 10% to 15% performance boost and reduce power consumption by 25% to 30%.

    TSMC to Receive 0M ASML High-NA EUV Lithography Machines
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