Tag: EUV Lithography

  • Micron DDR5 Modules Reach 9200MT/s with EUV Lithography

    Micron DDR5 Modules Reach 9200MT/s with EUV Lithography

    Key Takeaways

    1. Micron Technology is the first memory manufacturer to produce DDR5 modules using sixth-generation 10nm-class DRAM with EUV lithography, improving speed and efficiency.
    2. The new 16 GB DDR5 modules can reach speeds up to 9200MT/s, a 15% performance increase, along with over a 20% reduction in power consumption.
    3. Micron’s advancements will benefit various sectors, including data centers, mobile devices, and automotive systems, enhancing performance and energy efficiency.
    4. Major collaborations with AMD and Intel are underway, focusing on validating Micron’s new DDR5 products for improved server and AI performance.
    5. Micron’s 1γ DRAM chips are currently manufactured in Japan, with plans to expand EUV lithography production in Japan and Taiwan.

    Micron Technology has recently achieved a significant milestone by becoming the first memory manufacturer to send out sample versions of DDR5 modules created using its latest sixth-generation 10nm-class DRAM node, referred to as 1γ (1-gamma). This marks the first instance where Micron employs EUV (extreme ultraviolet) lithography in its production process. This advancement leads to notable improvements in speed, energy efficiency, and production yields.

    Enhanced Performance

    With this innovative technique, Micron’s 16 GB DDR5 integrated circuits can hit speeds of up to 9200MT/s. This represents a commendable 15 percent increase in performance compared to the earlier 1β (1-beta) generation, all the while achieving over a 20 percent reduction in power usage. Moreover, the new production method enhances bit density by more than 30 percent, which might help lower costs as the manufacturing process becomes more established.

    Advancing AI Technology

    Scott DeBoer, who serves as Micron’s executive vice president and chief technology & products officer, stated, “Micron’s know-how in creating unique DRAM technologies, together with our strategic application of EUV lithography, has led to a strong lineup of advanced 1γ-based memory products ready to advance the AI ecosystem.”

    Micron aims to utilize the 1γ node for a wide array of future memory solutions, such as:

    – Data center applications: This will provide up to a 15 percent boost in performance while enhancing energy efficiency to manage power use and heat.
    – Mobile devices: LPDDR5X versions will facilitate state-of-the-art AI features directly on smartphones or tablets.
    – Automotive systems: LPDDR5X running at speeds of up to 9600MT/s will enhance capacity, improve product longevity, and offer better performance.

    Collaborations with Major Players

    Both AMD and Intel have commenced validation of Micron’s new DDR5 offerings. Amit Goel, Corporate VP of Server Platform Solutions Engineering at AMD, emphasized how this partnership fits with the company’s initiatives to continuously refine its EPYC processors and consumer-focused hardware. On the other hand, Dr. Dimitrios Ziakas from Intel pointed out the benefits of improved energy efficiency and higher density, which will positively impact server settings and AI-focused PCs.

    Currently, Micron manufactures these 1γ DRAM chips at its plants in Japan, where the organization installed its first EUV lithography system in 2024. As production scales up, Micron intends to deploy more EUV machinery at its facilities in both Japan and Taiwan.

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    Micron DDR5 Modules Reach 9200MT/s with EUV Lithography

     

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  • ASML CEO: Chinese Chipmakers 10-15 Years Behind Global Leaders

    ASML CEO: Chinese Chipmakers 10-15 Years Behind Global Leaders

    ASML’s chief executive officer, Christophe Fouquet, recently stated that Chinese semiconductor firms such as Huawei and SMIC are still around 10 to 15 years behind leading companies including Intel, TSMC, and Samsung. This assertion comes amid increasing scrutiny of ASML’s relationships with Chinese clients, largely due to rising geopolitical tensions.

    Challenges with EUV Technology

    Fouquet pointed out that a major problem for Chinese manufacturers is their lack of access to cutting-edge extreme ultraviolet (EUV) lithography machines. These machines are essential for keeping pace with the global industry leaders. ASML’s EUV machines, which cost about 400 million euros each, are crucial for producing advanced semiconductors. In fact, transporting the necessary components alone requires seven cargo planes.

    ASML’s Financial Performance

    In spite of these hurdles, the Dutch lithography giant reported impressive figures for the third quarter of 2024, with net sales reaching 7.5 billion euros and profits of 2.1 billion euros. However, new orders dropped to 2.6 billion euros, which is less than half of the 5.6 billion euros seen in the previous quarter. Nevertheless, China continues to represent a significant portion of ASML’s revenue, contributing 47 percent to the company’s Q3 2024 sales.

    Future Sales Predictions

    UBS analysts are forecasting that ASML might experience nearly a 25 percent decrease in its Chinese sales in the coming year, with as much as 45 percent of its total revenue from China at risk if more restrictions are implemented. While the U.S. is urging ASML to halt servicing existing equipment in China, the Netherlands has not yet followed suit with these demands.

    To provide some context, ASML and its partners have invested over twenty years in refining the commercial EUV ecosystem. Although Huawei and its partners are working on developing their own EUV systems, experts believe it could take just as long to establish a comparable ecosystem, even if they gain access to some older technologies that have already been developed.

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  • Corning Extreme ULE Glass: Unmatched Thermal Stability

    Corning Extreme ULE Glass: Unmatched Thermal Stability

    Corning has introduced a brand new ultra-low expansion (ULE) material designed to meet the demands of the upcoming low-NA and high-NA EUV lithography systems. This innovative Extreme ULE glass is expected to become the preferred choice for the next-generation photomasks and lithography mirrors in future fabrication tools.

    Exceptional Features

    The standout characteristic of Extreme ULE is its remarkably low thermal expansion, which ensures outstanding stability for photomask applications. Additionally, its flatness helps combat the annoying issue of "photomask waviness," reducing unwanted variations during chip production. Thanks to these qualities, advanced pellicles and photoresists can be employed to boost yields and enhance performance.

    Handling Heat

    EUV lithography systems utilize a plasma source to produce extremely intense EUV light, generating significant heat in the process. However, most of this heat remains contained within the source chamber, away from the photomask. The EUV light is directed towards the photomask using sophisticated lithography mirrors, which can be quite sensitive to temperature changes.

    Photomask Composition

    Photomasks are constructed from multilayer reflective materials that are highly efficient at reflecting EUV radiation. While they excel at reflecting light, they still absorb a small portion of the EUV energy, resulting in a slight increase in thermal load on the photomask.

    As EUV tools enhance their capabilities and process a greater number of wafers per hour (WPH), they introduce more powerful light sources. This leads to pellicles, photomasks, and photoresists being exposed to elevated levels of EUV radiation and heat. Corning’s Extreme ULE glass, an evolution of the traditional ULE family, offers remarkable thermal stability and uniformity—exactly what next-gen high-NA and upcoming low-NA EUV tools require.

    Future Innovations

    "As the needs of integrated chip manufacturing increase with the growth of artificial intelligence, the innovation in glass is crucial," stated Claude Echahamian, Vice President & General Manager, Corning Advanced Optics. "Extreme ULE Glass will enhance Corning’s essential role in the ongoing journey of Moore’s Law by facilitating higher-powered EUV manufacturing and improved yields."

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