Tag: Dimensity 8300

  • Oppo Reno 13 Geekbench Listing Shows Same Chip as Reno 13 Pro

    Oppo Reno 13 Geekbench Listing Shows Same Chip as Reno 13 Pro

    On November 25, Oppo is set to unveil the Reno 13 and Reno 13 Pro smartphones in China. These new models will take the place of the Reno 12 and Reno 12 Pro, which were powered by the Dimensity 8250 and Dimensity 9200 Plus chipsets, respectively. Recently, the Reno 13 Pro was noticed in Geekbench’s database, showcasing a Dimensity 8-series chipset. Now, the standard version has also shown up on the same benchmarking site, revealing its processor.

    Model Numbers and Global Editions

    Screenshots from Geekbench display the two upcoming Oppo devices with model numbers PKM110 and PKK110. These correspond to the Chinese variants of the Reno 13 and Reno 13 Pro. A report has suggested that the global versions carry model numbers CPH2689 and CPH2697, respectively. The Reno 13 Pro was listed in Geekbench last week, showing that it is powered by the Dimensity 8300 SoC, which is also the chipset for the Reno 13.

    Features and Specifications

    There are rumors suggesting that the Reno 13 series will introduce the new Dimensity 8350 SoC. This chip might share the same CPU and GPU as the D8300, but with some enhancements. Both the Reno 13 and Reno 13 Pro have been spotted on Geekbench with RAM options of 12 GB and 16 GB. They are also running on the latest Android 15 OS.

    Oppo has already announced that the Reno 13 and 13 Pro will come in configurations like 12GB+256GB, 12GB+512GB, 16GB+512GB, and 16GB+1TB. The standard model will have an additional 16GB+256GB option. The Reno 13 series will be available in colors like Midnight Black and Butterfly Purple. Furthermore, the standard and Pro models will feature unique shades such as Galaxy Blue and Starlight Pink, respectively.


    Image 1
  • Oppo Reno13 Series Launch Date and Color Options Revealed

    Oppo Reno13 Series Launch Date and Color Options Revealed

    Oppo has officially announced that their Reno13 smartphone series is aimed at customers who might be interested in the iPhone 16 or 16 Plus, particularly if those models had a third rear camera and a ring flash each.

    Collaboration with Pop Idols

    In addition, the series appeals to fans of K-pop, as Song Yuqi from (G)I-DLE has been chosen as the official representative for Oppo. The pop star is collaborating with the brand to promote its new devices, which will come in colors like Butterfly Purple, Galaxy Blue, and Midnight Black, along with a special Starlight Pink for the Pro version. These products are set to launch on November 25, 2024.

    Additional Product Launches

    The Reno13 smartphones will be unveiled together with the Pad 3, which will also feature similar color options. However, the Enco R3 Pro earbuds seem less exciting in their promotional materials, as they are only available in a simple white color.

    Specifications and Performance

    While the Reno13 and 13 Pro may not impress tech enthusiasts with their internal specs, a tipster known as @chunvn8888 has revealed that these devices will utilize the older Dimensity 8300 SoC for the international market.

    This revelation isn’t too shocking, considering that the previous Reno12 Pro, which can be found on Amazon.in, runs on a Dimensity 7300 chip.

    Source: Link,Link


    Image 1
    Image 1
    Image 1
    Image 1
    Image 1
    Image 1
  • Oppo Reno 13 Series Launch Date Confirmed, Pro Chipset Leaked

    Oppo Reno 13 Series Launch Date Confirmed, Pro Chipset Leaked

    Oppo has announced that it will host its next product launch on November 25 in China. The Reno 13 series will take the place of the Reno 12 models, which were introduced back in May this year. Additionally, the Reno 13 Pro has been spotted in the Geekbench database, providing insights into its chipset and other specifications.

    Upcoming Launch Details

    The event will feature several products, including the Pad 3 tablet and the Enco R3 Pro true wireless earbuds (TWS). While Oppo has already shared the design, color choices, and specifications for the Pad 3, details about the Reno 13 series remain unannounced.

    Reno 13 Series and Competitors

    The Reno 13 series is currently available for blind pre-orders through various online platforms in China. There are speculations that the Honor 300 series and the Vivo S20 lineup, which are also set to launch by the end of this month, will be rivals to the Reno 13 models.

    Geekbench Insights

    A new Oppo device with the model number PKK110 has surfaced in the Geekbench database. Reports indicate that the global version of the Reno 13 Pro is identified as CPH2697, suggesting that the PKK110 might be the variant intended for China.

    There are indications that the Reno 13 Pro could be the first phone to incorporate the upcoming Dimensity 8350 chipset. However, details from the Geekbench listing concerning CPU and GPU suggest it may be equipped with the Dimensity 8300. Thus, it is possible that the device could feature either the Dimensity 8300 or the new Dimensity 8350, with the latter potentially offering similar configurations to the 8300 but with added improvements.

    Specifications of Reno 13 Pro

    Further information from the Geekbench listing reveals that the Reno 13 Pro comes with 16 GB of RAM and runs on Android 15. A recent article detailed that the Pro version includes a 6.83-inch OLED display with a micro-quad-curved design, a 50-megapixel front-facing camera, and a triple rear camera setup featuring a 50-megapixel main sensor, an 8-megapixel lens, and another 50-megapixel telephoto lens. Additionally, it boasts 1 TB of storage, a 5,900mAh battery with either 80W or 100W charging options, support for wireless charging, a metal middle frame, eSIM capability, and an IP68/69 rated body.


    Image 1
    Image 1
    Image 1
    Image 1
    Image 1
    Image 1
  • Dimensity 8300 Revealed by MediaTek, Equipped with Cutting-edge Generative AI Abilities

    Dimensity 8300 Revealed by MediaTek, Equipped with Cutting-edge Generative AI Abilities

    MediaTek Announces Dimensity 8300: A Powerful Chip for Mid-Range Smartphones

    Taiwanese semiconductor company MediaTek has recently unveiled its latest offering, the Dimensity 8300 system-on-a-chip (SoC). Designed specifically for mid-range smartphones, this new chip boasts significant improvements in performance, efficiency, and AI capabilities.

    Enhanced Performance and Efficiency

    The Dimensity 8300 is built on a second-generation TSMC 4nm process, resulting in notable performance and efficiency enhancements compared to its predecessor. Its triple-tier CPU architecture includes one Cortex-A715 core clocked at 3.35GHz, three Cortex-A715 cores clocked at 3GHz, and four Cortex-A510 cores clocked at 2.2GHz. This configuration delivers a 20% performance boost and up to 30% better efficiency than the Dimensity 8200.

    Improved Graphics Capabilities

    MediaTek has also upgraded the graphics capabilities of the Dimensity 8300. It features the Mali-G615 MC6 GPU, which promises a 60% performance increase and a 55% efficiency gain. As a result, users can expect smooth and responsive gaming experiences on smartphones powered by this chipset.

    Enhanced Camera Features

    The Dimensity 8300 introduces several enhancements to the camera department. It supports 4K/60fps HDR video, offers more power-efficient video recording, and includes AI-Color functionality for improved image quality. These features contribute to an enhanced photography and videography experience for users.

    AI Capabilities and Other Features

    One notable feature of the Dimensity 8300 is the APU 780 AI silicon, which supports large language models (LLMs) with up to 10 billion parameters. This enables real-time language translation, text summarization, and even creative writing. Additionally, the chip supports AV1 decoding, Bluetooth 5.4, Wi-Fi 6E, and refresh rates of up to 120Hz at WQHD+ resolutions (or 180Hz at FHD+).

    The First Smartphone to Feature Dimensity 8300

    The Redmi K70e will be the first smartphone to be powered by the Dimensity 8300. It is expected to be launched later this month, showcasing the impressive capabilities of this new MediaTek chip.

    In conclusion, MediaTek’s Dimensity 8300 offers a compelling package for mid-range smartphones. With its improved performance, efficiency, and AI capabilities, this chipset is set to elevate the user experience on upcoming devices.

    Source: 1, 2

  • New information reveals MediaTek’s Dimensity 8300 specs featuring an advanced 4nm fabrication process

    New information reveals MediaTek’s Dimensity 8300 specs featuring an advanced 4nm fabrication process

    MediaTek Dimensity 8300: A Closer Look at the Specifications

    After the successful launch of Dimensity 9300, MediaTek is all set to unveil its latest smartphone chipset, the Dimensity 8300, on November 21. As the release date approaches, more details about the chipset have started to emerge. Renowned tipster Digital Chat Station has recently provided a comprehensive overview of the key specifications, giving us a sneak peek into what to expect from this upcoming chipset.

    Manufacturing Process and CPU Configuration

    One of the most significant aspects of the Dimensity 8300 is its manufacturing process. According to the tipster, the chipset will be built on TSMC's advanced 4nm manufacturing process. This indicates a significant leap in terms of efficiency and performance compared to its predecessors.

    Moving on to the CPU configuration, the Dimensity 8300 boasts a powerful setup. It features a single high-performance Cortex-A715 core, clocked at an impressive 3.35GHz. Additionally, there are three additional Cortex-A715 performance cores running at 3.32GHz, offering a seamless multitasking experience. To optimize power consumption, the chipset includes four power-efficient Cortex-A510 cores operating at 2.2GHz.

    Graphics and GPU

    When it comes to graphics, the Dimensity 8300 doesn't disappoint. The chipset is equipped with a Mali-G615 MC6 GPU, ensuring smooth and immersive visual experiences. Whether you're gaming, streaming videos, or simply browsing through your favorite apps, the Dimensity 8300 promises to deliver exceptional graphics performance.

    With these specifications, the Dimensity 8300 is expected to offer a significant boost in overall performance and efficiency compared to its predecessors. MediaTek continues to push the boundaries of smartphone chipsets, providing users with cutting-edge technology that enhances their mobile experience.

    As we eagerly await the official release of the Dimensity 8300 on November 21, it's clear that MediaTek has once again raised the bar for smartphone chipsets. Stay tuned for more updates and detailed analysis of the Dimensity 8300 as it enters the market.