Dimensity 8300

Oppo Reno 13 Geekbench Listing Shows Same Chip as Reno 13 Pro

Oppo Reno 13 Geekbench Listing Shows Same Chip as Reno 13 Pro

On November 25, Oppo is set to unveil the Reno 13 and Reno 13 Pro smartphones in China. These new models will take the place of the Reno 12 and Reno 12 Pro, which were powered by the Dimensity 8250 and Dimensity 9200 Plus chipsets, respectively. Recently, the Reno 13 Pro was noticed in Geekbench’s database, […]

Oppo Reno 13 Geekbench Listing Shows Same Chip as Reno 13 Pro Read More »

Oppo Reno13 Series Launch Date and Color Options Revealed

Oppo Reno13 Series Launch Date and Color Options Revealed

Oppo has officially announced that their Reno13 smartphone series is aimed at customers who might be interested in the iPhone 16 or 16 Plus, particularly if those models had a third rear camera and a ring flash each. Collaboration with Pop Idols In addition, the series appeals to fans of K-pop, as Song Yuqi from (G)I-DLE

Oppo Reno13 Series Launch Date and Color Options Revealed Read More »

Oppo Reno 13 Series Launch Date Confirmed, Pro Chipset Leaked

Oppo Reno 13 Series Launch Date Confirmed, Pro Chipset Leaked

Oppo has announced that it will host its next product launch on November 25 in China. The Reno 13 series will take the place of the Reno 12 models, which were introduced back in May this year. Additionally, the Reno 13 Pro has been spotted in the Geekbench database, providing insights into its chipset and other

Oppo Reno 13 Series Launch Date Confirmed, Pro Chipset Leaked Read More »

Dimensity 8300 Revealed by MediaTek, Equipped with Cutting-edge Generative AI Abilities

Dimensity 8300 Revealed by MediaTek, Equipped with Cutting-edge Generative AI Abilities

MediaTek Announces Dimensity 8300: A Powerful Chip for Mid-Range Smartphones Taiwanese semiconductor company MediaTek has recently unveiled its latest offering, the Dimensity 8300 system-on-a-chip (SoC). Designed specifically for mid-range smartphones, this new chip boasts significant improvements in performance, efficiency, and AI capabilities. Enhanced Performance and Efficiency The Dimensity 8300 is built on a second-generation TSMC 4nm

Dimensity 8300 Revealed by MediaTek, Equipped with Cutting-edge Generative AI Abilities Read More »

New information reveals MediaTek's Dimensity 8300 specs featuring an advanced 4nm fabrication process

New information reveals MediaTek’s Dimensity 8300 specs featuring an advanced 4nm fabrication process

MediaTek Dimensity 8300: A Closer Look at the Specifications After the successful launch of Dimensity 9300, MediaTek is all set to unveil its latest smartphone chipset, the Dimensity 8300, on November 21. As the release date approaches, more details about the chipset have started to emerge. Renowned tipster Digital Chat Station has recently provided a comprehensive

New information reveals MediaTek’s Dimensity 8300 specs featuring an advanced 4nm fabrication process Read More »

Scroll to Top