Tag: Core Ultra 400

  • Intel to Introduce Higher Cache SKUs in Nova Lake Lineup

    Intel to Introduce Higher Cache SKUs in Nova Lake Lineup

    Key Takeaways

    1. Intel’s new Nova Lake Core Ultra 400 series processors will have many cores but will not support hyperthreading.
    2. At least two models in the Nova Lake series are expected to feature larger cache memory, similar to AMD’s X3D lineup.
    3. The processors may include configurations with eight P-cores and either 16 or 12 E-cores, along with four LP-E cores.
    4. Both processors are likely to have a thermal design power (TDP) of 125W, which may place them in the Core Ultra 5 range.
    5. Intel is rumored to be working on introducing 3D stacked cache technology to its mainstream consumer products, although these details remain unconfirmed.

    Intel is developing its new Nova Lake Core Ultra 400 series processors, which are anticipated to feature a high number of cores but will not include hyperthreading. Recently, Intel has been missing high cache options like AMD’s X3D lineup, but this may change soon. A recent leak suggests that at least two models in the Nova Lake series will offer larger cache memory.

    Details from the Leak

    The information was shared by Haze on X on June 16, indicating that the Nova Lake series includes two specific models equipped with bLLC, or ‘big Last Line Cache.’ This means there will be at least two types in the lineup that offer more cache memory, comparable to AMD’s X3D CPUs. One of these processors is reported to have an eight P-core and 16 E-core setup, while the other is predicted to come with an eight P-core and 12 E-core arrangement.

    Processor Specifications

    Both processors are expected to include four LP-E cores and a thermal design power (TDP) of 125W. Currently, the exact amount of bLLC or L3 cache in these CPUs remains uncertain. However, given the 125W TDP, they might belong to the Core Ultra 5 range. Recent leaks indicate that the Nova Lake series will incorporate the following models and core counts:

    AMD began shipping its X3D chips with the Ryzen 5000 series, which quickly became popular among gamers. The Ryzen 7 7800X3D established itself as one of the top gaming CPUs available. With its rumored bLLC processors, Intel appears to be working towards introducing 3D stacked cache to mainstream consumer products. Nevertheless, it’s important to highlight that these are merely rumors since Intel has not released any official announcements yet.

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  • Intel Nova Lake Core Count and TDP Details Leaked

    Intel Nova Lake Core Count and TDP Details Leaked

    Key Takeaways

    1. Intel’s Core Ultra 400 Nova Lake processors will focus on increasing core count to enhance multicore performance, with hyperthreading largely removed.
    2. The Core Ultra 9 processor is expected to feature a high core count and improved performance with new Coyote Cove P-cores and Arctic Wolf E-cores.
    3. Anticipated IPC (Instructions Per Cycle) increase of 20-40% compared to the previous Arrow Lake generation.
    4. Nova Lake processors are projected for release in 2026, with potential X3D-like models incorporating additional L3 cache.
    5. The Nova Lake CPU tile is likely to be manufactured using TSMC’s N2 node instead of Intel’s own advanced 18A/18AP process.

    Earlier predictions suggested that Intel would significantly boost the core count in its Core Ultra 400 Nova Lake processors. With hyperthreading largely removed, increasing the number of cores is the main way to enhance multicore performance in the new chips. A reliable leaker, @g01d3nm4ng0, has now disclosed the core counts for each CPU model.

    Tentative CPU Names

    The CPU names mentioned above are provisional and may be altered by the time they launch. However, the Core Ultra 9 processor is expected to stand out due to its massive core count. Moreover, its new Coyote Cove P-cores and Arctic Wolf E-cores are anticipated to deliver an IPC increase of around 20-40% compared to Arrow Lake. Additionally, the integrated GPU will combine elements from Celestial and Druid designs.

    A Long Wait Ahead

    Regardless, it’ll take some time before we get definitive details, as Nova Lake is not expected to be available until 2026. Still, the anticipation might be justified since Intel could introduce X3D-like models by pairing a CPU tile with additional L3 cache through Foveros 3D packaging technology. Lastly, it is widely believed that the Nova Lake CPU tile will be produced using TSMC’s N2 node rather than Intel’s advanced 18A/18AP process.

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