Apple Silicon

TSMC Developing Advanced Chip Packaging for Apple M4

TSMC Developing Advanced Chip Packaging for Apple M4

TSMC recently won four high-profile customers for its latest SoIC packaging technology – AMD, Nvidia, Broadcom and Apple. As the semiconductor producer ramps up production capacity for CoWoS chip packaging technology. Apple Explores Advanced Packaging Solutions Apple is said to be exploring SoIC combined with Hybrid molding technology – which integrates thermoplastic carbon fiber board composite […]

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Apple MacBook Air M3: Faster SoC, WiFi 6E, Dual External Display Support

Apple MacBook Air M3: Faster SoC, WiFi 6E, Dual External Display Support

Apple introduced the latest MacBook Air featuring their newest silicon, maintaining the familiar design while enhancing performance compared to its predecessor. The updated models also include various minor enhancements. MacBook Air M3 Unveiled Apple has launched the MacBook Air M3 in 13 and 15-inch sizes, marking a departure from the previous M2 Air release pattern. These

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