Tag: Apple Silicon

  • Apple M4 Extreme SoC with 64-Core CPU and 160-Core GPU Canceled

    Apple M4 Extreme SoC with 64-Core CPU and 160-Core GPU Canceled

    Apple has recently unveiled the M4 series of SoCs, showcasing impressive capabilities. It has been four years since Apple introduced its Silicon, and the M-series ARM chips are now more advanced in terms of both power and efficiency. Currently, the ‘Ultra’ variant of the M SoCs stands out as the most powerful option, featuring two ‘Max’ dies. Although there are rumors about an M4 Ultra being in the works, those who hope for an even more powerful M4 Extreme may need to adjust their hopes.

    Delay on the M4 Extreme

    A report from The Information, highlighted by MacRumors, reveals that Apple has been looking into a high-performance ‘M4 Extreme’ SoC, which would combine the power of two M4 Ultra chips or four M4 Max chips. However, these plans have reportedly been put on hold by Apple. The report suggests that this decision was made to focus on creating a server chip based on Apple Silicon. Those familiar with the evolution of Apple Silicon might recall that a similar situation occurred with the rumored M2 Extreme, which likely contributed to the Mac Pro’s struggle to maintain its status as a leading workstation.

    The Potential Power of the M4 Extreme

    Should the M4 Extreme ever become a reality, it could feature an astonishing 64-core CPU and an integrated GPU boasting 160 cores. The die size would be extraordinarily large, and the number of transistors might surpass even that of server-grade equipment. With the M4 Extreme now seeming unlikely, it is uncertain if Apple will revisit this concept in the future. Nonetheless, a Mac Pro equipped with an M4 Extreme would undoubtedly be seen as a premier product, although developing and marketing it may not be practical. Ultimately, only time will tell what Apple decides.

    Source: Link

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  • TSMC Developing Advanced Chip Packaging for Apple M4

    TSMC Developing Advanced Chip Packaging for Apple M4

    TSMC recently won four high-profile customers for its latest SoIC packaging technology – AMD, Nvidia, Broadcom and Apple. As the semiconductor producer ramps up production capacity for CoWoS chip packaging technology.

    Apple Explores Advanced Packaging Solutions

    Apple is said to be exploring SoIC combined with Hybrid molding technology – which integrates thermoplastic carbon fiber board composite molding – for mass production by 2025. They currently are engaged in limited trial production phase but plan to ramp up mass production as early as 2019. They anticipate using this cutting-edge packaging approach with their forthcoming AI chip or M4 chip from Apple.

    TSMC’s SoIC technology represents an innovative high-density 3D chip stacking method for accommodating chips with different sizes through Chip-on-Wafer packaging. First introduced in 2018, SoIC will soon become one of the key elements at an advanced packaging facility planned in Chiayi, Taiwan which will feature both CoWoS plants as well as its SoIC facility.

    AMD Adopts SoIC Technology

    AMD was the pioneering client to embrace SoIC technology with CoWoS for data center AI accelerator chips; their Instinct MI300 AI Accelerators utilized these methods.

    Mark Gurman reports that Apple has officially begun development on an M4 chip destined to appear in their next-gen MacBook Pro laptops. TrendForce suggests Apple could switch over to 2nm process nodes with this chip design.

    Historical patterns for Apple Silicon releases suggest roughly one and a half year intervals between each version, such as November 2020 for M1, June 2022 for M2 and late October for M3. Therefore it seems plausible that they would reveal M4 by first half of next year.

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  • Apple MacBook Air M3: Faster SoC, WiFi 6E, Dual External Display Support

    Apple MacBook Air M3: Faster SoC, WiFi 6E, Dual External Display Support

    Apple introduced the latest MacBook Air featuring their newest silicon, maintaining the familiar design while enhancing performance compared to its predecessor. The updated models also include various minor enhancements.

    MacBook Air M3 Unveiled

    Apple has launched the MacBook Air M3 in 13 and 15-inch sizes, marking a departure from the previous M2 Air release pattern. These new models retain the flat-edged chassis and display notch design elements.

    Enhanced Display Connectivity

    The MacBook Air M3 13 and 15-inch versions now support connectivity to two external displays simultaneously, a step up from the previous models which could only connect to one external display with the laptop lid closed.

    Powerful Performance and Features

    Powered by the M3 processor, the new MacBook Air boasts an 8-core CPU, up to a 10-core GPU, and a faster 16-core Neural Engine. Apple claims it to be the "world's best consumer laptop for AI," delivering a 60% performance increase over the M1 model and 13 times faster than the fastest Intel-based MacBooks. The Air M3 also promises an immersive gaming experience with hardware-accelerated mesh shading and ray tracing.

    In addition to the chipset upgrade, the MacBook Air M3 includes WiFi-6E for faster speeds, voice isolation, wide spectrum microphone modes, and improved audio and video call clarity. It features a 1080p Facetime camera, three microphones, and support for Spatial Audio and Dolby Atmos.

    The MacBook Air M3 is available in midnight, starlight, space gray, and silver color options. The midnight variant now includes an anodization seal to reduce fingerprint visibility, a common issue with the previous M2 Air model.

    Pricing and Availability

    The Apple MacBook Air M3 starts at $1,099 for the 13-inch model, while the 15-inch version begins at $1,299. In India, prices start at Rs 1,14,900 and Rs 1,34,900 for the respective models. Pre-orders are open now, and shipping is set to begin on March 8.

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