The Honor Magic V3 is set to debut on July 12. Prior to the launch event, the company conducted a technology conference in its home country, showcasing its latest advancements and innovations in the slim and lightweight foldable phone category.
Industry’s First 10% Silicon Content Battery
During the conference, Honor announced the creation of the industry’s first battery with 10% silicon content. This advanced battery will power the soon-to-be-released Honor Magic V3. The new silicon anode battery is 4.4% thinner than its predecessor and contains over 10% silicon, marking a first in the industry. The energy density is 5.74% higher than the previous generation, which means the battery can store more energy in a given space or mass. Increased energy density allows the battery to take up less internal volume without sacrificing capacity, making the phone thinner.
Enhanced Performance
Honor also introduced the Honor E1 chip, designed to optimize power management and maximize energy efficiency to extend battery life. Leaks and rumors suggest that the Honor Magic V3 will feature a plain leather body and a significantly improved camera module. The device is expected to be both more capable and thinner than the Honor Magic V2, launched last July.
For reference, the Magic V2 is 9.9mm thick when closed and 4.7mm when opened. It includes a 50MP main camera, 20MP 2.5x telephoto lens, and a 50MP ultrawide camera on the back, powered by the Snapdragon 8 Gen 2 chipset. The second-generation silicon anode battery in the V2 has a capacity of 5000mAh and supports 66W fast charging.
The upcoming Honor Magic V3 is expected to feature the Snapdragon 8 Gen 3 chipset, while still maintaining the same 5000mAh battery capacity.
