Honor is set to launch its new flagship series, the Honor Magic 7, on October 30th. Recent leaks have surfaced, shedding light on the details of these upcoming devices. A trusted source, Digital Chat Station, indicates that the lineup will include two models: the regular Magic 7 and the premium Magic 7 Pro.
Powerful Chipset
Both models will be equipped with Qualcomm’s newly released Snapdragon 8 Elite chipset, which is expected to enhance CPU, GPU, and AI performance. This makes them some of the first devices to utilize this advanced SoC.
Magic 7/Magic 7 Pro Features
The leaks suggest that the Honor Magic 7 Pro will have advanced features, including a periscope telephoto lens for impressive zoom capabilities. In contrast, the standard Magic 7 is said to come with an optical telephoto lens. Another noteworthy upgrade in both models is the implementation of an ultrasonic fingerprint sensor, which surpasses the optical sensors found in the previous Magic 6 series. Furthermore, the Pro version is anticipated to feature 3D face unlock technology, similar to Apple’s Face ID, for improved security.
Both devices are expected to offer strong fast-charging options, with both models supporting 100W wired charging. For reference, the Magic 6 and Magic 6 Pro come with 66W and 80W charging, respectively.
Display and Communication
Previous reports hinted that the Magic 7 Pro might boast a 2K OLED display with a high refresh rate, while the standard Magic 7 could sport a 1.5K display. Additionally, the Pro model is rumored to feature satellite communication capabilities, potentially giving it an edge over its rivals.
Enhanced Performance
The Magic 7 series will run on the Snapdragon 8 Elite, Qualcomm's latest flagship processor. This chipset promises an overall performance boost, especially in graphics and AI functions. It's crafted to manage demanding apps effortlessly, ensuring a seamless user experience. Honor’s collaboration with Qualcomm means that the Magic 7 series will likely stand out due to its state-of-the-art hardware, which may provide quicker processing speeds, improved power efficiency, and better-optimized AI processing.
