Honor Magic 7 Pro Design Details Unveiled Before Launch

Honor Magic 7 Pro Design Details Unveiled Before Launch

Honor is set to unveil its flagship Magic 7 series on October 30th. Ahead of the big day, close-up photos shared by Weibo insider Digital Chat Station (DCS) have showcased important design features.

Camera and Display Features

The images reveal a triple-camera arrangement on the back, featuring a periscope telephoto lens, along with a front screen that boasts micro-quad-curved glass and evenly sized bezels. Notably, there’s a pill-shaped cutout for dual front cameras, which likely enables 3D facial recognition. The brand has already announced the inclusion of AI in its camera system to enhance photography quality.

Details on the Magic 7 Series

The leaked visuals indicate that both the standard Magic 7 and the Magic 7 Pro possess an octagonal camera module at the back, bordered in either silver or gray, while one image suggests a gold border. This arrangement features three camera sensors and an LED flash, with the Honor logo subtly positioned at the bottom of the rear side.

Rumors point to storage options of 512GB and 1TB for the Magic 7, available in colors like Gold, White, Black, Blue, and Gray. The Pro model could offer configurations of 256GB, 512GB, and 1TB, with a more subdued color range. It is also expected that the standard model will have a 1.5K OLED display, while the Pro will have a 2K OLED screen, supported by impressive battery capabilities, including a 5800mAh battery and 100W wired plus 66W wireless charging for the Pro variant.

Additional Features and Performance

The whole series is anticipated to come with an ultrasonic fingerprint scanner, IP68/IP69-rated water and dust resistance, and even satellite connectivity for the Pro model. Honor has already introduced its Android 15-based MagicOS 9.0 custom interface that will be included with the Magic 7 series.

Internally, the Magic 7 series will be powered by the Snapdragon 8 Elite chipset, recognized for its enhanced performance and energy efficiency. With an all-big-cores architecture, this chip offers a 45% improvement in CPU performance, a more efficient NPU, and a 44% increase in efficiency compared to the previous model, ensuring smoother multitasking and enhanced AI functionality. This chipset is designed to compete closely with rival processors like the Dimensity 9400, improving the overall performance of the Magic 7 series.

In conclusion, the Magic 7 series is set to deliver a blend of innovative technology, advanced AI capabilities, and a sophisticated design.


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