Qualcomm is quietly readying a new entry-level processor that significantly upgrades areas like graphics, memory, and connectivity, according to an internal document. The unreleased chip, designated SM4875 and codenamed “Poros,” appears set to build on the Snapdragon 4 Gen 5 platform introduced earlier this year. A data sheet marked as confidential and dated March 2026 details a platform that keeps certain core aspects intact while modernizing much of the surrounding silicon.
Consistent CPU Foundation, Modernized Memory
The SM4875 retains the same Kryo CPU blueprint as its predecessor. It pairs two Kryo Gold performance cores, derived from the Cortex-A78, each with 256 KB of L2 cache, alongside six Kryo Silver efficiency cores, based on the Cortex-A55, each with 64 KB of L2 cache. A shared 1 MB L3 cache serves the entire cluster, and the chip remains on TSMC’s 4 nm process node. What changes is the memory subsystem: the platform moves beyond LPDDR4X-only support to offer dual-channel LPDDR5 running at 3,200 MHz, while keeping LPDDR4X available as a lower-cost path for device makers.
Graphics and Connectivity Overhaul
Where the upgrades become evident is in graphics and connectivity. The GPU jumps from the Adreno 4-series to the Adreno 6-series, promising another meaningful performance step after the Snapdragon 4 Gen 5 already delivered a 77 percent generational gain. Wireless connectivity becomes more flexible and is now OEM-configurable. The data sheet lists four companion WLAN modules spanning two generations. The WCN3998-2 (Wi-Fi 5, 2×2 MU-MIMO, Bluetooth 5.2) and WCN3988 (Wi-Fi 5, 1×1, Bluetooth 5.1) connect over SLIMbus, the same interface used by the Snapdragon 4 Gen 5. Two newer options, the WCN6750 (Wi-Fi 6, 2×2, Bluetooth 5.2) and WCN6450 (Wi-Fi 6, 1×1, Bluetooth 6.0), instead communicate over a dedicated single-lane PCIe Gen 3 interface that appears designed specifically for these modules rather than for storage or general expansion. Bluetooth 6.0 is exclusive to the WCN6450 path, meaning it is not a system-wide feature. While none of the four configurations support Wi-Fi 7—a capability offered by the Snapdragon 6 Gen 5—the jump from the Snapdragon 4 Gen 5’s Wi-Fi 5-only limitation represents a substantial improvement.
Security, Packaging, and Market Timing
Security hardware receives a refresh as well, with additions that include hardware-based ECC image authentication, Widevine L1 support, and an updated Trust Management Engine for root-of-trust functions. To accommodate the new I/O, which includes the PCIe lane and a higher general-purpose input/output count, the chip adopts a larger PSP917 package measuring 11.1 by 12.0 mm, compared with the PSP808 package of the current SM4850.
Qualcomm has not publicly acknowledged the SM4875, and official pricing and launch timing remain undisclosed. Based on the document’s date, the processor is expected to reach the market sometime next year. As with any pre-release engineering material, final retail silicon could differ from these specifications.