Key Takeaways
1. The Galaxy Z Flip FE may launch with the Exynos 2400e chip instead of the previously speculated Exynos 2500.
2. The Exynos 2400e is similar to the Exynos 2400 but features a prime Cortex-X4 core with a lower clock speed.
3. Samsung might use IPoP packaging for the chip, which is cost-effective but could affect heat dissipation.
4. Production issues with Samsung’s 3nm process have led to the use of Snapdragon 8 Elite in base models of the S25 series.
5. The Galaxy Z Flip FE aims to be Samsung’s most affordable foldable device, targeting users seeking budget-friendly flip-style functionality.
Samsung’s upcoming Galaxy Z Flip FE, which is eagerly awaited as a budget-friendly foldable device, might not feature the cutting-edge Exynos 2500 chip as was previously speculated. Recent information indicates that it could actually launch with the Exynos 2400e—a slightly lesser version of the Exynos 2400 found in the Galaxy S24 and S24 Plus.
A Suitable Choice for the FE Model
Based on analysis of the code from trusted sources, this device (codenamed “B7R”) is expected to come equipped with the “S5e9945” processor, which aligns with the Exynos 2400/2400e. The Exynos 2400e, used in the Galaxy S24 FE, has a prime Cortex-X4 core that runs at a lower clock speed, but remains similar to the regular 2400. Reports also suggest that Samsung might implement IPoP (Integrated Package on Package) packaging for this chip, which is more affordable but may have subpar heat dissipation—this could be a crucial factor in reducing costs.
Samsung Galaxy Z Flip 6 Updates
Interestingly, this latest information goes against earlier leaks that hinted Samsung might postpone the Flip FE’s release to include the newer Exynos 2500. However, production hurdles with Samsung’s 3nm process node have forced the company to utilize the pricey Snapdragon 8 Elite even for the base models of the S25 series. Some prior reports mentioned that the Exynos 2500 did not meet the performance expectations set by Samsung MX for the S25 lineup.
It appears that Samsung Foundry has not yet resolved the yield rate issues or other production obstacles. Google has also moved the production of its upcoming Tensor G5 from Samsung to TSMC, while also managing the design process independently.
Expectations for the Galaxy Z Flip FE
Returning to the Galaxy Z Flip FE, it is anticipated to be Samsung’s most affordable foldable option. In fact, Samsung is aiming to attract users who desire the flip-style functionality without spending a fortune. Although the Exynos 2400e isn’t the most advanced chip on the market, it should still provide a fairly decent user experience—assuming Samsung prioritizes heat management or optimizes energy usage.
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