Tag: LPDDR5X

  • Dram Prices to Drop 13% in Q1 2025 as PC Memory Declines

    Dram Prices to Drop 13% in Q1 2025 as PC Memory Declines

    TrendForce has released a new analysis showing that DRAM prices are set to drop significantly in the first quarter of 2025. Standard DRAM products are projected to fall between 8% to 13%. When high-bandwidth memory (HBM) products are included, the overall decline in the market appears milder, ranging from 0% to 5%.

    PC DRAM Faces Major Decline

    PC DRAM will be impacted the most, with forecasts suggesting an 8-13% reduction in prices. This decline is mainly due to aggressive inventory reductions that started in late 2024, lower demand in end markets, increased DDR4 production from Chinese manufacturers, and an oversupply of inexpensive chips in the spot market.

    Server DRAM and Seasonal Trends

    Prices for server DRAM are expected to decrease by 5-10%, largely because of weak seasonal demand. Additionally, many manufacturers have transferred a significant portion of their DDR4 production to DDR5, and some HBM capacity has also switched, which increases the supply on the market.

    Mobile and Graphics Market Adjustments

    On the mobile front, smartphone manufacturers are remaining cautious with their purchasing strategies, despite inventory levels stabilizing. Contract prices for LPDDR4X and LPDDR5X are predicted to fall around 8-13% and 3-8%, respectively.

    In terms of graphics DRAM, a price drop of 5-10% is anticipated, mainly due to sluggish demand. Even with some stockpiling of GDDR7 for future GPUs, prices are not being maintained. Consumer DRAM is also experiencing significant cuts, with DDR3 expected to decrease by 3-8% and DDR4 likely to see a more substantial drop of 10-15%.

    Source: Link


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  • Dimensity 9400 Core Configuration Leaks Before Launch

    Dimensity 9400 Core Configuration Leaks Before Launch

    Just a few days ahead of its official unveiling, crucial information about the MediaTek Dimensity 9400’s core setup has been shared by reliable tech source Digital Chat Station (DCS). This leak uncovers the CPU and GPU configurations of the soon-to-be-released chipset.

    Dimensity 9400 Specs

    DCS reports that the Dimensity 9400 will include a single prime core, specifically the Cortex-X925, operating at 3.62 GHz. This marks a significant increase from the previous generation’s Cortex-X4 core, which had a speed of 3.25 GHz. Furthermore, the leak indicates that the three Cortex-X4 cores will continue to function at the same 2.80 GHz clock speed as seen in the Dimensity 9300.

    Potential Core Confusion

    There is a small discrepancy concerning the low-power cores. While earlier information suggested the use of newer Cortex-A725 cores, DCS indicates that the Dimensity 9400 may actually continue with the Cortex-A720 cores from the prior model. This could be an error on DCS’s part, as it’s expected that newer processors would utilize the latest CPUs. Regardless, if this information is correct, the core clock speed should remain at 2.0 GHz. On the graphics side, the leak reveals an Immortalis-G925 MC12 GPU clocked at 1.612 GHz.

    Manufacturing Advances

    In addition, past reports indicate that the Dimensity 9400 will move from TSMC’s 4nm node to the second generation 3nm N3E node. This updated manufacturing technique is anticipated to bring enhancements in both performance and efficiency. As a flagship SoC for 2024/2025, it’s also expected to excel at handling AI workloads.

    The MediaTek Dimensity 9400 has also been confirmed to incorporate Samsung’s LPDDR5X memory, a first in the industry. This memory type is the fastest globally, achieving data transfer speeds of up to 10.7Gbps, and is said to enhance on-device AI capabilities, especially for tasks like voice-to-text conversion.

    In light of these leaked specifications, here’s a comparison between the Dimensity 9400 and the Dimensity 9300:

    Features/PerformanceDimensity 9300Dimensity 9400 (Rumored)
    CPU Architecture1x Cortex-X4 core @ 3.25GHz
    3x Cortex-X4 @ 2.85GHz
    4x Cortex-A720 @ 2.0GHz
    1x Cortex-X925 core @ 3.62GHz
    3x Cortex-X4 @ 2.85GHz
    4x Cortex-A725 / A720 @ 2.0GHz
    GPUImmortalis-G720Immortalis-G925 MC12
    Manufacturing ProcessTSMC’s third-generation 4nm processTSMC’s second-generation 3nm process
    MemoryLPDDR5T memory running at 9600 MbpsLPDDR5X memory running at 10.7Gbps

    (Source)


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  • Micron to Launch LPDDR5X-Based LPCAMM2 Memory by Mid-2024

    Micron to Launch LPDDR5X-Based LPCAMM2 Memory by Mid-2024

    Micron Technology, Inc. has recently unveiled the LPCAMM2, which is the industry's first standard low-power compression attached memory module. This new memory module is expected to bring enhanced performance, energy efficiency, space savings, and modularity, and will be available in capacities ranging from 16GB to 64GB.

    LPCAMM2 Speed and Production Schedule

    The LPCAMM2 memory module is designed to achieve speeds of up to 9600Mbps, which is significantly higher than the 5600Mbps offered by current DDR5 SODIMMs. Micron plans to start production of the LPCAMM2 by the first half of 2024, positioning it as the first disruptive form factor for client PCs since the introduction of SODIMMs in 1997.

    Improved Performance and Power Efficiency

    Micron's LPCAMM2 integrates LPDDR5X DRAM, which provides up to 71% better performance and up to 61% lower power consumption for essential workloads like web browsing and video conferencing. Additionally, it offers a remarkable 64% space savings compared to SODIMM offerings. With the growing prevalence of generative artificial intelligence (GAI) on client PCs, the LPCAMM2 is designed to meet the performance demands of AI workloads while maintaining low power consumption.

    Transformative Nature and Benefits

    Praveen Vaidyanathan, Vice President and General Manager of Micron's Compute Products Group, highlights the transformative nature of the LPCAMM2. He states that this new memory module will deliver best-in-class performance per watt in a flexible, modular form factor. It is expected to enhance the capabilities of AI-enabled laptops and allow for memory capacity upgrades as technology and user needs evolve.

    Collaboration and Departure from Current Form Factors

    The development of the LPCAMM2 involved collaboration with key client PC OEMs and ecosystem enablers. This memory solution represents a significant departure from current memory module form factors. It offers higher performance with LPDDR5X, achieving speeds of up to 9600Mbps. Additionally, it reduces system standby power by 80% for improved battery life and provides benefits in digital content creation and productivity workloads.

    Modularity and Serviceability

    The LPCAMM2 boasts modularity, enabling critical serviceability functionality for enterprise IT users and administrators. It features a single PCB for all module capacities, providing supply chain flexibility for OEM and ODM customers. Compared to SODIMMs, LPCAMM2 simplifies motherboard routing complexity.

    Crucial LPCAMM2 Retail Products

    Crucial, a brand owned by Micron, will make LPCAMM2 retail products available. This means that laptop users, including gamers and content creators, will be able to upgrade their system memory configuration. This marks an industry first for low-power memory. The Crucial LPCAMM2 products are expected to be available in the first half of 2024.