Tag: Kirin 9100

  • Huawei Announces Launch Date for Mate 70 Series Smartphones

    Huawei Announces Launch Date for Mate 70 Series Smartphones

    Huawei has officially announced when it will launch its new flagship Mate 70 series. During an unexpected interview at the 2024 Guangzhou Auto Show, Richard Yu, the CEO of Huawei’s Consumer Business Group (CBG), stated that the new phones will be revealed on November 26th.

    Confirmation of Launch Date

    Interestingly, the social media accounts of Huawei Mobile have yet to post about this date. However, since it comes directly from the CEO, it’s hard to doubt his words.

    Expected Models in the Lineup

    We are looking forward to the release of at least four models in this series: the standard Mate 70, the Mate 70 Pro, the Mate 70 Pro+, and the premium Mate 70 RS Ultimate. All models will be the first to use HarmonyOS Next, Huawei’s own operating system that marks a significant shift from the Android Open Source Project (AOSP) foundation.

    Specifications and Hardware

    Details about the hardware remain a bit unclear. Reports indicate that these smartphones will be powered by a new HiSilicon Kirin chip, which is expected to be called the Kirin 9100. It’s thought that the chip will be produced by SMIC using a 6nm process node, potentially matching the performance of the Qualcomm Snapdragon 8+ Gen 1.

    The Mate 70 series is likely to keep the famous circular camera design, featuring four camera sensors set in a square layout. However, the camera module might be placed within a circular or elliptical island, creating a distinct visual appeal. A render of the device has appeared online, although we can’t confirm how accurate the leak is.

    Battery and Charging Features

    Following the trend of silicon-carbon batteries that provide higher capacities, Huawei might use similar technology in this series. Except for the basic model, the Mate 60 series came with 6,000mAh batteries that support 88W fast charging. It’s anticipated that the Mate 70 series could boast even bigger batteries while still featuring 88W charging capabilities. Additionally, the new lineup is expected to support 50W wireless charging and up to 20W reverse wireless charging.

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  • Kirin 9100 Specs: 6nm Chip with Cortex-X1 Core Launch Details

    Kirin 9100 Specs: 6nm Chip with Cortex-X1 Core Launch Details

    Rumors surrounding Huawei’s upcoming SoC are gaining traction as the Mate 70 series launch approaches. While some of these speculations are mere fabrications by Chinese users online, others provide a clearer insight. A Telegram user known as @spektykles has shared what appears to be the official specifications for the Kirin 9100.

    Specifications Breakdown

    The chip, codenamed HiSilicon Baltimore, features an 8-core CPU configuration consisting of 1x Cortex-X1 (2.67 GHz), 3x Cortex-A78 (2.32 GHz), and 4x Cortex-A55 (2.02 GHz). It’s limited to Arm v8 and previous CPU cores due to existing sanctions. For graphics processing, it incorporates a Maleoon 910, likely the same GPU used in last year’s Kirin 9010.

    Performance Insights

    In terms of performance, the Kirin 9100 is set to compete closely with the Snapdragon 8 Gen 2 for CPU tasks, while it will match the Snapdragon 8+ Gen 1 in GPU capabilities. The chip will be built on SMIC’s N+3 node (6 nm), not the previously suggested 5 nm. This change is expected to enhance power efficiency, placing it between the Snapdragon 8 Gen 3 and Gen 2. Although it’s premature to predict its benchmark results, an earlier leak indicated that it achieves around 1.1 million points in AnTuTu.

    Telegram User’s Contribution

    The information shared by @spektykles on Telegram adds to the growing anticipation around Huawei’s latest technology. The insights highlight both the technical specifications and the competitive landscape as the launch date nears.

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  • Huawei Mate 70 Lineup: Kirin 9100 vs Snapdragon 8 Gen 2 Performance

    Huawei Mate 70 Lineup: Kirin 9100 vs Snapdragon 8 Gen 2 Performance

    Huawei’s Mate 70 series is nearing its official reveal, with fresh leaks providing insights into its potential System on Chip (SoC) and pricing. One standout feature is the new Kirin 9100 chip, which is said to be priced between 1100-1300 RMB ($150-$180). This chip is anticipated to be crafted using either a 5nm or a 7nm process. However, it may still fall short of Qualcomm’s Snapdragon 8 Gen 3 when it comes to energy efficiency. Nevertheless, insiders believe that the Kirin will offer a smoother experience overall compared to the Snapdragon 8 Gen 2. In earlier reports, the Kirin SoC has achieved over a million points in AnTuTu benchmarks.

    Huawei’s Self-Reliance Strategy

    Huawei’s decision to manufacture the Kirin chip independently of TSMC or Samsung strongly indicates its determination to become self-sufficient. Leaked information suggests that the production costs for the Mate 70 series could be as much as 30% higher than those of Apple’s iPhone 16 series. Despite this, Huawei is likely to keep the final retail prices lower by reducing profit margins, it appears.

    Design Updates and Pricing

    Earlier leaks have hinted at significant design updates. In terms of pricing, the Mate 70 RS Ultimate is rumored to have a tag of 10,999 yuan ($1,541), while models like the Mate 70 Pro+ are expected to start at 8,999 yuan ($1,260). Additionally, the base storage is rumored to be 256GB, which is an upgrade from previous iterations.

    As the launch is anticipated around mid-next month, Huawei’s Mate 70 lineup—which includes the Mate 70, Mate 70 Pro, and Mate 70 Extraordinary Master—is aiming to compete with Apple and Qualcomm. While these insights are based on leaks, an official announcement should be forthcoming soon.

    Sources like Weibo (in Chinese) and Digital Chat Station have contributed to this information.

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  • Kirin 9100 Leak: Energy Efficiency Matches Snapdragon 8 Gen 2

    Kirin 9100 Leak: Energy Efficiency Matches Snapdragon 8 Gen 2

    Earlier this week, a leak from well-known tech tipster Digital Chat Station (DCS) hinted at the development of a new Kirin chip at Huawei. Today, DCS followed up on Weibo, China’s social media platform, unveiling some additional insights.

    The leak indicates that Huawei is likely to use a “domestically developed n+2/3 process” to produce its next Kirin chip, probably named the Kirin 9100. This suggests a 5nm node, with DCS explaining that it will utilize Deep Ultraviolet (DUV) lithography with multiple patterning for its production.

    Manufacturing Process

    Using this approach, Huawei will achieve transistor sizes similar to those produced at 5nm, but it won’t be the same as the leading-edge EUV (extreme ultraviolet) lithography utilized by TSMC and Samsung. Since DUV lithography requires multiple exposures to create the desired pattern on the chip, it can result in higher production costs and potentially lower chip yield compared to EUV, which can print more intricate designs with a single exposure.

    Efficiency and Performance

    Despite these challenges, DCS notes that the new chip will bring “quite obvious” improvements in energy efficiency over the previous Kirin chip. However, it may not completely match the efficiency of Qualcomm’s latest offerings. According to the tipster, the new Kirin chip is expected to be on par with the Snapdragon 8 Gen 2. If not, DCS asserts that it will still be more efficient than the Snapdragon 8+ Gen 1.

    It’s crucial to remember that these details are still leaks, and specific information such as the Kirin model number, core configuration, and the targeted release date remain unknown.

    Manufacturing Uncertainties

    Moreover, the leak does not specify which foundry will manufacture the chip. While DCS mentions that it will be domestically produced, since TSMC and Samsung are not options due to US restrictions, there is uncertainty about which Chinese foundry is capable of a 5nm DUV process. SMIC is a potential candidate, but it is under scrutiny from the US government regarding its ability to produce advanced chips.

    Kirin 9100 Leak: Energy Efficiency Matches Snapdragon 8 Gen 2
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  • Huawei to Use 7nm Kirin Chips in Upcoming Mate 70 Smartphone

    Huawei to Use 7nm Kirin Chips in Upcoming Mate 70 Smartphone

    Huawei’s upcoming Mate 70 flagship is likely to continue using the 7nm Kirin chips, possibly the Kirin 9100, which features improved transistor density thanks to SMIC’s N+3 technology. This decision is driven by the high costs and potential yield issues associated with SMIC’s efforts to produce 5nm chips using DUV technology. SMIC, China’s leading chipmaker, faces significant challenges due to US sanctions and Dutch export restrictions, which limit its access to advanced EUV technology and force it to rely on older DUV machines, putting it behind competitors like TSMC and Samsung Foundry.

    SMIC’s Efforts on 5nm Process Using DUV Lithography

    Despite these hurdles, rumors suggest that SMIC is actively working on a 5nm process using DUV lithography. While this approach shows promise in terms of energy efficiency, substantial cost reductions are needed to make it commercially viable for Huawei.

    Chipset Choices for the Mate 70

    The choice of chipset for the Mate 70 remains uncertain. Opting for the 7nm process offers a safer route, whereas moving to a DUV-based 5nm process presents opportunities for advancement but comes with considerable risks. The success of SMIC in refining its 5nm process will ultimately influence Huawei’s chip strategy for future flagship devices.

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  • Huawei Mate 70: 1″ Sensor & New Kirin Chip Unveiled

    Huawei Mate 70: 1″ Sensor & New Kirin Chip Unveiled

    The Huawei Mate 70 series is expected to debut at the end of 2024, featuring a new Kirin chipset. Rumors suggest substantial enhancements in the camera performance compared to the past three generations.

    Enhanced Imaging System

    Sources close to the development have indicated that the phone will boast significant upgrades in its camera hardware. Some versions will feature a 1″ camera sensor made by OmniVision, which notably surpasses the Sony IMX989 in certain aspects. Additionally, the 50MP OV50K sensor (sized at 1/1.3, from OmniVision) will be included, although its specific focal use remains unclear.

    A leak from the previous month suggested that the phone would incorporate a 3D spatial zoom feature, enhancing immersive video and audio experiences. The periscope camera is expected to have better lenses and a new variable aperture technology.

    New Kirin Chipset and OS

    Earlier reports revealed that the new Mate series device would be powered by a new Kirin chip with 5G capabilities, potentially the Kirin 9100, which is also expected to be unveiled later this year. The Mate 70 series will be the first to introduce Huawei’s self-developed operating system, HarmonyOS NEXT, to the market. The upcoming Kirin 9100 chip is rumored to perform between the Snapdragon 8 Gen 2 and Snapdragon 8 Gen 3.

    Recap of Huawei Mate 60 Specs

    For reference, the Huawei Mate 60 from last year featured a 6.69″ 1216 x 2688p (441 ppi density) LTPO OLED display and was powered by the Kirin 9000S chip. It included a 50 MP main sensor with f/1.4-f/4.0 variable aperture and OIS support, a 12MP 5x periscope telephoto (also with OIS), and a 12MP ultrawide lens. The 13MP selfie camera provided a wide field of view (18mm). The phone housed a 4750 mAh battery and supported 66W wired and 50W wireless charging.

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  • Kirin 9100 Set to Outperform Snapdragon 8 Gen 2, Claims Tipster

    Kirin 9100 Set to Outperform Snapdragon 8 Gen 2, Claims Tipster

    Huawei is anticipated to launch a new Kirin chipset, the Kirin 9100, later this year. This processor is speculated to power the forthcoming Mate 70 series, which will also be the first Huawei phone to come pre-installed with HarmonyOS NEXT.

    Potential Performance Leap

    There are speculations that the Kirin 9100 might represent a significant performance improvement for the Chinese tech giant. However, doubts remain due to Huawei and its chip manufacturer, SMIC, lacking the latest chip manufacturing technology as a result of the US trade ban.

    Kirin chips have so far struggled to compete with offerings from Qualcomm and MediaTek. However, the Kirin 9100 might be an exception. A new rumor indicates it could outperform Qualcomm’s flagship Snapdragon 8 Gen 2 chipset.

    Rumors and Speculations

    The information comes from an X tipster, jasonwill, who appears confident that the upcoming Kirin chip will exceed the performance of the Snapdragon 8 Gen 2. If Huawei’s next-gen Kirin SoC is indeed faster, this would represent a substantial improvement compared to the current-best Kirin 9010, which struggles to compete even with mid-range chips like the Snapdragon 7+ Gen 2.

    Additionally, the tipster suggests that the Kirin 9100’s performance could enhance the user experience, even if its on-paper specifications “may not match those of the 8gen3”.

    Software Optimization

    How could Huawei achieve this? The likely answer is software optimization. Huawei is expected to launch HarmonyOS NEXT alongside the Kirin 9100, completely distancing itself from Google’s Android platform.

    According to Huawei, HarmonyOS NEXT is three times more efficient in memory utilization compared to Android. This efficiency translates to smoother UI performance on Huawei devices, even those powered by older Kirin chipsets.

    Another factor contributing to the Kirin 9100’s performance is its manufacturing process. The chip is reportedly set to be mass-produced using SMIC’s 5nm node. While this technology isn’t the most advanced, it should still provide better performance and power efficiency compared to previous Kirin chipsets.

    While it’s exciting to anticipate Huawei’s upcoming chip matching the performance of its competitors, it’s prudent to remain skeptical as such a significant leap forward seems almost too good to be true for Huawei to achieve in one go.

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