Tag: flagship processors

  • MediaTek Dimensity 9500 Chip Launch Expected Before Snapdragon 8 Elite 2

    MediaTek Dimensity 9500 Chip Launch Expected Before Snapdragon 8 Elite 2

    Key Takeaways

    1. MediaTek’s Dimensity 9500 is expected to launch before Qualcomm’s Snapdragon 8 Elite 2.
    2. The Snapdragon Summit is scheduled for September 23, 2025, where the Snapdragon 8 Elite 2 will be announced.
    3. The Dimensity 9500 is anticipated to enhance performance and AI capabilities.
    4. The launch of these chipsets will lead to new flagship Android smartphones featuring advanced specifications.
    5. Previous models like Oppo Find X8 and Vivo X200 utilized the Dimensity 9400, while upcoming models will likely feature the new Dimensity 9500.

    MediaTek seems to be ahead of Qualcomm this year, especially with the next-gen flagship processors. The anticipated Dimensity 9500 SoC might be released before the expected Snapdragon 8 Elite 2. This new chipset is expected to enhance performance, AI capabilities, and much more. Here’s everything we know so far.

    Dimensity 9500 Release Expected Before Snapdragon 8 Elite 2

    Last year, both the MediaTek Dimensity 9400 and Qualcomm Snapdragon 8 Elite were launched in October. However, the Dimensity chip was introduced just a few days prior to its Snapdragon counterpart. A recent leak suggests that the upcoming Dimensity 9500 will maintain this trend of being announced first. Qualcomm has already stated that the Snapdragon Summit is set for September 23, 2025, where they are expected to formally introduce the Snapdragon 8 Elite 2.

    Anticipated Features of the MediaTek Dimensity 9500

    Although there is no official launch date for the Dimensity 9500 yet, known leaker Digital Chat Station has indicated that it will likely come out before the Snapdragon processor. It could potentially be unveiled as early as September 2025. With these new chips being launched, we can also expect a wave of flagship Android smartphones to be released, showcasing advanced specifications and performance.

    To remind you, the Oppo Find X8 and Vivo X200 series utilized the Dimensity 9400, which means we can look forward to the Find X9 and X300 series featuring the Dimensity 9500. Similarly, the Galaxy S25 series, OnePlus 13, among others, used the Snapdragon 8 Elite, and they are expected to upgrade to the Snapdragon 8 Elite 2 for their next models. It’s important to note that this information is still unverified, so it’s wise to take it with a grain of salt for the time being.

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  • Anticipated Launch of Snapdragon 7 Gen 3 and Dimensity 8300 within the Next 14 Days

    Anticipated Launch of Snapdragon 7 Gen 3 and Dimensity 8300 within the Next 14 Days

    Qualcomm and MediaTek are set to release their latest flagship processors, the Snapdragon 8 Gen 3 and Dimensity 9300. However, recent leaks suggest that both companies are also preparing to announce sub-flagship chipsets, namely the Snapdragon 7 Gen 3 and Dimensity 8300.

    Snapdragon 7 Gen 3 and Dimensity 8300 Launch Timeframe

    According to tipster WHY LAB, both chipsets will be launched within the next two weeks. The Snapdragon 7 Gen 3 chip is expected to debut first, followed by the Dimensity 8300 chip.

    Snapdragon 7 Gen 3 Chipset

    It is speculated that the Honor 100, which is scheduled to be unveiled in China on November 23, will be the first phone to feature the Snapdragon 7 Gen 3 chip. Other smartphones, such as the Vivo S18, Vivo V30, and OnePlus Ace 3 (global name: OnePlus Nord 4), are also expected to be powered by this chipset.

    The Snapdragon 7 Gen 3 is equipped with a high-performance core running at 2.63GHz, three performance cores operating at 2.40GHz, and four efficiency cores clocked at 1.80GHz. Additionally, it features an Adreno 720 GPU.

    Dimensity 8300 Chipset

    On the other hand, the Dimensity 8300 chipset is likely to be featured in the upcoming Redmi K70e. The K70 series, which includes the K70 and K70 Pro, is expected to be launched in China by the end of this month.

    The Dimensity 8300 is speculated to include one Cortex-X3 super-large core clocked at 2.8GHz, accompanied by three Cortex-A715 performance cores running at 2.4GHz, and four Cortex-A510 efficiency cores operating at 1.6GHz. In terms of graphics, it integrates a G520 MC6 GPU with a frequency of 850MHz.

    Manufacturing and Performance

    Both the Snapdragon 7 Gen 3 and Dimensity 8300 chipsets are said to be manufactured on TSMC's 4nm process. This means that these chips will offer top-notch performance and better power efficiency on sub-flagship phones.

    In conclusion, Qualcomm and MediaTek are gearing up to launch their sub-flagship chipsets, the Snapdragon 7 Gen 3 and Dimensity 8300. These chipsets are expected to bring improved performance and power efficiency to upcoming smartphones from various brands.

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