Tag: Dimensity 9300+ Chipset

  • iQOO Z9 Turbo+ Launch Date Leaked: Dimensity 9300+, 6400mAh

    iQOO Z9 Turbo+ Launch Date Leaked: Dimensity 9300+, 6400mAh

    Recently, iQOO hinted at the upcoming release of a new smartphone, the iQOO Z9 Turbo+, in China. Although the company has showcased its design, details about the specifications and launch date remain undisclosed. However, some insights from Chinese insiders provide an idea of what to anticipate with this device.

    Key Specifications of the iQOO Z9 Turbo+ (Speculated)

    According to leaks, the iQOO Z9 Turbo+ is expected to be a step-up from the Z9 Turbo, which was launched earlier this year. The Z9 Turbo came with a Snapdragon 8s Gen 3 processor and a 6,000mAh battery. In contrast, the Z9 Turbo+ is rumored to house a Dimensity 9300+ chipset and a larger 6,400mAh battery. Like its predecessor, the Plus version is anticipated to include 80W fast charging support.

    Despite the increase in battery capacity, the iQOO Z9 Turbo+ will reportedly maintain the sleek dimensions of its predecessor, with a thickness of 7.9mm. The weight is expected to slightly rise from 195 grams to 199 grams. The new Plus variant will replace the independent Turbo graphics chip and single-frequency GPS found in the Z9 Turbo with iQOO’s proprietary Q1 gaming chip and dual-frequency GPS support. Other specifications of the Z9 Turbo+ might largely mirror those of the Z9 Turbo. Reports suggest it will be unveiled on September 24.iQOO Z9 Turbo+ will reportedly maintain

    Display and Camera Features

    The Z9 Turbo+ is expected to sport a 6.78-inch flat OLED display offering a 1.5K resolution, a 144Hz refresh rate, and an in-screen fingerprint sensor. It will likely operate on OriginOS 4, built on Android 14.

    For photography, the Turbo+ may include a 16-megapixel front camera. Its rear camera setup is speculated to feature a 50-megapixel main sensor and an 8-megapixel ultra-wide lens. The device might be priced at approximately 2,000 Yuan (~$282) in China.


    iQOO Z9 Turbo+ Launch Date Leaked: Dimensity 9300+, 6400mAh
  • Vivo X100s Now Available for Under $480

    Vivo X100s Now Available for Under $480

    vivo launched the vivo X100s in May this year featuring the Dimensity 9300+ chipset, starting at 3,999 Yuan (~US$ 560) for the 12GB + 256GB model. The phone is now available on JD.com, priced at 3491 yuan. Additionally, members can benefit from an instant discount of 8.73 yuan, and receive a 50 yuan red envelope after placing an order. This brings the final discounted price to 3432 yuan, approximately US$478.

    Build and Design

    The vivo X100s is crafted with a glass back and an aluminum frame, measuring just 7.8 mm in thickness and weighing 203g. Notably, it is among the first phones to achieve an IP69 rating for dust and water resistance.

    Display and Performance

    The phone features a 6.78-inch 2800×1260 flat OLED panel, supporting a variable refresh rate of 1-120Hz. The display boasts a peak brightness of 3000 nits, 2160Hz high-frequency PWM dimming, and custom eye protection based on Dimensity chip hardware. It also includes an under-display optical fingerprint scanner.

    Powered by the 4nm Dimensity 9300+ chip, the vivo X100s scores around 2.3 million on the AnTuTu benchmark. The device is equipped with a 5100mAh battery and supports 100W fast wired charging. It operates on OriginOS 4 in China, which is based on Android 14.

    Camera and Connectivity

    The camera setup includes a 50 MP 1/1.49″ main sensor (f/1.6), a 50 MP ultrawide (15mm), and a 64 MP 70mm periscope telephoto (f/2.6) with 3x optical zoom. The cameras utilize Zeiss optics with Zeiss T* lens coating. For selfies, there is a 32 MP centered hole-punch camera.

    In terms of wireless connectivity, the phone supports WiFi 7 and Bluetooth 5.4. The base model comes with 12GB RAM and 256GB storage, while options go up to 16GB RAM and 1TB storage.

  • Redmi K70 Ultra: Slimmest Bottom Bezel in Brand’s History

    Redmi K70 Ultra: Slimmest Bottom Bezel in Brand’s History

    Redmi officially unveiled the K70 Ultra yesterday, slated for release this month. The latest images showcase the phone in the new “Ice Glass” color option, revealing several design updates. Additionally, the company has disclosed some key display features in a separate teaser.

    Narrower Bezel Design

    The Redmi K70 Ultra sports a 1.5K next-generation display panel, featuring a 1.7mm ultra-narrow bezel on the top and sides, making it slimmer than its predecessor. The bottom bezel is slightly thicker at 1.9mm, though it is the narrowest in the brand’s history. You can observe the differences in the images shared by the company.

    Flat Display Advantages

    The device retains a flat display design similar to the previous model. Wang Teng, general manager of the Redmi brand, discussed the benefits of this flat design, noting that it eliminates blind spots and prevents accidental touches when using buttons. He also highlighted that the flat design enhances the gaming experience.

    Advanced Display Technology

    The phone features a C8+ display panel developed in collaboration with Xiaomi and TCL Huaxing. This panel offers 3840 Hz high-frequency PWM dimming when the brightness is below 60 nits and DC dimming above that level. These features make the display eye-friendly, especially in low-light conditions.

    Performance and Cooling

    Powered by the Dimensity 9300+ chipset, the K70 Ultra includes a newly designed 3D ICE cooling system, enabling the phone to achieve 120fps in games like Genshin Impact. Alongside the Dimensity chipset, the device also incorporates an independent graphics D1 chip.


    Redmi K70 Ultra: Slimmest Bottom Bezel in Brand’s History
  • Redmi K70 Ultra Features Unique Cooling for Optimal Performance

    Redmi K70 Ultra Features Unique Cooling for Optimal Performance

    Xiaomi’s Vice President of Marketing and General Manager of the Redmi brand, Wang Teng, has started unveiling more details about the newly announced Redmi K70 Ultra.

    Teng stated that, in terms of comprehensive performance, the K70 Ultra is the top Android device. According to official data, the phone achieves an AnTuTu score of 2,382,780 points. Furthermore, he claimed that the phone’s actual gaming performance exceeds expectations.

    Collaboration with MediaTek

    Redmi has reportedly worked closely with MediaTek to optimize the chipset for their new device. This collaboration is touted as the “deepest” in the industry and is expected to result in a “stronger” Dimensity 9300+. However, we will need to test the device ourselves to confirm its performance.

    Enhanced Cooling System

    Wang Teng also revealed that the K70 Ultra will feature a new generation of 3D ice cooling technology, incorporating an innovative concave-convex platform design. The convex surface is positioned closer to the processor, reducing the SoC core temperature by up to 3°C compared to the Redmi K60 Ultra. Additionally, the concave surface of the heatsink is designed to be further from the screen, reportedly resulting in a lower screen temperature during heavy workloads.

    With the Dimensity 9300+ chipset and new cooling system, the phone reportedly supports 120fps gameplay for Genshin Impact and can handle two games simultaneously. These features are claimed to provide the strongest gaming performance in its category.

    Additional Features

    Referring to previous information, the phone is also equipped with a D1 independent graphics chip to enhance performance and optimize resource usage. It sports a 1.5K display with a 144Hz refresh rate and a 5,500mAh battery that supports 120W fast charging. Externally, the phone features a metal middle frame and a glass back cover. The camera module has a slightly different design, which you can view from the provided link.


  • Redmi K70 Ultra: C8+ Screen with High-Frequency PWM & DC Dimming

    Redmi K70 Ultra: C8+ Screen with High-Frequency PWM & DC Dimming

    The Redmi K60 Ultra made its debut in August last year, and its successor is anticipated to launch this month. Recently, tipster Digital Chat Station revealed that the upcoming phone will feature 3840Hz high-frequency PWM dimming below 60 nits brightness and DC dimming above that level. According to the IEEE Std1789-2015 international standard, screen flicker frequencies above 3125Hz are considered safe for the human eye, making this display eye-friendly.

    Advanced Display Technology

    The display will incorporate C8+ luminous materials, co-developed by Xiaomi and Huaxing. This innovation enhances display efficiency and significantly extends the panel’s lifespan by over 100%. The Redmi K70 Ultra will be the first device to feature this advanced display panel, which reduces eye strain and delivers vibrant colors. The screen will have a 1.5K resolution and a flat design.

    Powerful Performance

    A recent Geekbench listing indicates that the phone will be powered by the Dimensity 9300+ chipset. This chipset includes a Cortex-X4 performance core clocked up to 3.4GHz, three Cortex-X4 cores at 2.85GHz, and four Cortex-A720 cores at 2.0GHz. It utilizes TSMC’s 3rd generation 4nm fabrication process and features an 18MB L3 + SLC cache. The device is expected to come with UFS 4.0 fast storage and could offer configurations up to 24GB of RAM and 1TB of storage.

    Enhanced AI and Graphics

    The phone will support on-device generative AI models such as “Tongyi Qianwen”, “Baichuan”, and “Wenxin Yiyan”, providing various multimodal generative AI capabilities. Additionally, it will include a discrete graphics chip for super-resolution and super-frame functionalities in gaming.

    Robust Design and Specifications

    The device will boast an IP68 rating for dust and water resistance, similar to its predecessor. For reference, the K60 Ultra is equipped with the Dimensity 9200+ (4 nm) chipset and offers configurations like 256GB with 12GB or 16GB RAM, 512GB with 16GB RAM, and 1TB with 16GB or 24GB RAM. It features a 50MP main camera with OIS, an 8MP ultrawide, a 2MP macro camera, and a 20MP front-facing camera.