Tag: AMD Zen 6

  • TSMC 2nm Wafers Expected to See 10% Price Increase

    TSMC 2nm Wafers Expected to See 10% Price Increase

    Key Takeaways

    1. TSMC’s N2 node is in high demand from major companies like AMD, Nvidia, Apple, and Qualcomm, leading to higher pricing for wafers.
    2. Wafer prices are expected to rise further due to construction costs of fabs, economic uncertainty, and TSMC’s need to recover significant investments.
    3. The cost of TSMC’s 2 nm wafers is projected to increase by 10%, potentially reaching around $33,000 for a 300 mm wafer.
    4. Smaller OEMs might shift to older nodes (N3, N4) or consider Samsung Foundry’s 2 nm options due to rising TSMC prices.
    5. Intel’s innovative 18A and 14A nodes are becoming competitive alternatives, featuring technologies not available from TSMC and Samsung Foundry for several years.


    With the increasing demand from companies like AMD, Nvidia, Apple, Qualcomm, and even Intel, which has its own fabrication plants, TSMC’s N2 node is becoming one of the most wanted in recent times. This high demand allows the Taiwanese semiconductor manufacturer to set higher prices.

    Rising Wafer Prices

    A new report from Ctee suggests that wafer prices might rise even further in the upcoming weeks. Insiders believe this is due to the increasing expenses of constructing fabs in countries like the United States, the overall uncertainty in the global economy, and the need to recover some of the $38-42 billion that TSMC intends to invest this year for capital projects.

    Cost of TSMC’s 2 nm Wafers

    A wafer at TSMC’s 2 nm node is expected to be 10% pricier than previously. Last year, the estimated cost was around $30,000 for a 300 mm wafer, which means the new price could reach about $33,000. The report mentions that Nvidia’s CEO, Jensen Huang, finds TSMC’s advanced nodes to be “very worth it.”

    Nvidia plans to use the N2 node for its upcoming Rubin Next architecture. It will also be utilized in AMD’s Zen 6 processors, Apple’s A21 and M5 chips, MediaTek’s Dimensity SoC, and potentially even in the CPU tile of Intel’s Nova Lake desktop series.

    Smaller OEMs and Alternatives

    This situation might lead many smaller OEMs to consider older options like the N3 and N4 nodes. Alternatively, they may explore Samsung Foundry’s 2 nm offerings (SF2/SF2P), which Qualcomm is reportedly looking into. If TSMC’s wafer prices continue to escalate, Samsung Foundry could have a genuine opportunity for a resurgence, assuming they can stabilize their yields.

    Intel’s 18A and 14A nodes are also becoming strong contenders due to their innovative technology like backside power delivery, which TSMC and Samsung Foundry won’t have access to for a few more years.

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  • AMD Zen 6 Desktop CPUs Could Reach 6.0 GHz Boost Speed

    AMD Zen 6 Desktop CPUs Could Reach 6.0 GHz Boost Speed

    Key Takeaways

    1. Zen 6 will increase core count per CCD to 12 and L3 cache to 48 MB.
    2. The CCD is expected to be manufactured using TSMC’s advanced N2X node, starting mass production in 2026.
    3. AMD is skipping two manufacturing nodes, moving from N4 to N2X, which could lead to a 10% IPC boost.
    4. AMD aims for Zen 6 to reach clock speeds of 6.0 GHz, matching Intel’s Raptor Lake processors.
    5. Zen 6 may support stacking multiple 3D V-cache tiles, but this technology might not be available for gaming models until Zen 7.


    Leaker Moore’s Law is Dead has shared more intriguing info on AMD’s Zen 6, particularly about the Medusa Ridge desktop components. Tom previously mentioned that Zen 6 would boost the core count per CCD to 12 and increase the L3 cache to 48 MB. The latest leak dives into clock speeds, the manufacturing process, and suggests the presence of a 128-bit memory controller.

    Manufacturing Details

    The CCD for Olympic Ridge, previously called Medusa Ridge, is said to be produced using TSMC’s advanced N2X node. This N2X is reportedly a high-performance upgrade of the N2P variant. While TSMC’s roadmap doesn’t clarify the differences between the two, it does confirm that mass production will begin in 2026, aligning with AMD’s plans to launch Zen 6 desktop versions. Conversely, the I/O die might be fabricated using TSMC’s N3P or N6 nodes.

    Performance Expectations

    Zen 6 marks a significant leap, moving from TSMC’s N4 (used for Zen 5) directly to N2X, skipping two nodes. AMD is fully embracing the latest technology after usually lagging behind by a node or two. This could lead to improved performance, with rumors indicating a 10% IPC boost. However, the cost of N2 wafers is quite high, and consumers will likely feel the impact of these increased expenses.

    Tom notes that AMD aims to push Zen 6 to reach the impressive 6.0 GHz threshold, a feat already accomplished by Intel with its Raptor Lake processors. Moreover, Zen 6 is expected to support stacking multiple 3D V-cache tiles. While some server-grade models might feature this technology, it probably won’t reach gaming models until Zen 7 is released.

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  • Ryzen 9 11950X: 24 Zen 6 Cores Expected in 2026 Launch

    Ryzen 9 11950X: 24 Zen 6 Cores Expected in 2026 Launch

    A recent leak from Moore’s Law is Dead reveals some thrilling updates regarding AMD’s Zen 6 architecture. Unlike earlier versions which had distinct codenames, Zen 6 will come under the unified name Medusa. The laptop models will be known as Medusa Point/Medusa Ridge, while desktops will feature Medusa Ridge, and the successor to Strix Halo will be named Medusa Halo.

    Shared Technology Across Product Lines

    All three product lines are set to utilize the same 12-core Zen 6 CCD. It’s uncertain whether Zen 6c cores will be part of some variations, but if they are, they would probably be found on a different CCD. In addition, the high-end Ryzen 9 11950X (or a similar variant) will boost its core number from 16 to 24 by incorporating two of the aforementioned CCDs. Intel is also aiming to significantly increase its core count with Nova Lake, and AMD is eager to keep pace.

    Advanced Manufacturing Processes

    Things are looking even better. This time around, AMD plans to leverage TSMC’s advanced 2 nm (N2) node, a step up from previous generations that were typically a node or two behind. However, Zen 6 will also feature some parts built on the N3 node. A previous leak indicated that there will be an UDNA (formerly known as RDNA 5) iGPU included. Lastly, there have been whispers about Medusa Point SKUs incorporating 3D V-cache, though Tom has yet to confirm this information.