Tag: AMD Zen 5

  • PS6 Leak: Zen 5 CPU, UDNA GPU, and 8K Gaming Features Revealed

    PS6 Leak: Zen 5 CPU, UDNA GPU, and 8K Gaming Features Revealed

    Leaked information indicates that the development of Sony’s PlayStation 6 (PS6) is progressing faster than expected. A leaker known as Kepler_L2 on NeoGAF forums revealed that the design for the console’s system-on-chip (SoC) is completed, and it’s currently in the pre-silicon validation stage. The first tapeout, referred to as A0, is planned for later this year. In simple terms, Sony has wrapped up the design of its main processing chip and is now putting it through thorough virtual testing. They aim to start producing the initial batch of these chips soon to evaluate their performance in real-world scenarios.

    Hardware Details

    According to the leak, the PS6 will feature a custom APU from AMD, which is being made by TSMC. This chip will integrate a Zen 5 CPU and an UDNA GPU, both leveraging state-of-the-art production processes. Intel lost the chance to create the PS6 processor, with AMD winning the contract in 2022. The Zen 5 CPU is rumored to come with 8 cores and 16 threads, promising a notable boost in performance compared to the Zen 2 CPU used in the PS5.

    The UDNA GPU, previously known as RDNA 5, will be built using TSMC’s N3E process. It is speculated to offer advanced features like X3D cache technology, similar to the AMD Ryzen 7 9800X3D desktop chip, which will enhance performance for gaming and other computational tasks.

    Enhanced Gaming Experience

    With the PS6, gamers can expect an upgraded gaming experience, supporting 4K at 120FPS and 8K at 60FPS, driven by the Zen 5 CPU and UDNA GPU. The PS5 made a huge leap in performance compared to the PS4, increasing computing power from 1.84 teraflops to 10.3 teraflops. While the exact performance boost for the PS6 is still uncertain, and native 4K resolution is not assured, the console is likely to use AI-driven upscaling technologies to achieve high-quality visuals. Major improvements are expected for Sony’s PlayStation Spectral Super Resolution (PSSR) and AMD’s upcoming FidelityFX Super Resolution 5 (FSR 5).

  • ECS Unveils AMD Krackan APU Laptop Ahead of CES 2025

    ECS Unveils AMD Krackan APU Laptop Ahead of CES 2025

    AMD has confirmed that mid-range Zen 5 APUs are set to launch in early 2025, with reports indicating their debut will occur at the CES 2025 event. Although AMD hasn’t provided much information about these new APUs, ECS has revealed details about one of the two Krackan processors.

    New Processor Insights

    ECS made a somewhat early announcement regarding a new laptop, stating that it is powered by an APU featuring an 8-core CPU equipped with Zen 5c cores. This processor is likely one of the two speculated Ryzen AI models, either the AI 350 or AI 340. Unfortunately, the company did not disclose the number of Compute Units (CUs) present in the RDNA 3.5 integrated GPU (iGPU) of this APU.

    Positioning in the Market

    Previous reports suggest that the Krackan APUs will be positioned below the Strix Point options. To clarify, the entry-level Ryzen AI 9 365 from that series comes with a 10-core CPU and includes the RDNA 3.5 Radeon 880M iGPU featuring 12 CUs. While ECS hasn’t provided specifics on the iGPU of the Krackan APU in its new laptop, it did mention an XDNA 2 Neural Processing Unit (NPU) capable of delivering 40 TOPs of performance. This indicates that the NPU is also experiencing a reduction in capability.

    Laptop Features and Specifications

    Regarding the laptop, known as the UP42KP, ECS has revealed that it will come with a 14-inch display, USB4 ports, and support for fast WiFi 6 connectivity. The Thermal Design Power (TDP) range is set between 15W and 54W, aligning with typical specifications for mid-range laptops. Additionally, ECS states that the UP42KP boasts a slim profile, measuring a mere 16.9 mm in thickness. More details, including pricing, will be disclosed at the CES 2025 launch event.

    Source: Link


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  • AMD Chipset Driver Confirms Ryzen AI Max 300 for Strix Halo

    AMD Chipset Driver Confirms Ryzen AI Max 300 for Strix Halo

    The Strix Point series from AMD has made its debut with two Zen 5 APUs, both categorized under the Ryzen AI 300 series. Recently, AMD introduced the AI Pro 300 series aimed at business customers, and now they have revealed the naming conventions for the upcoming Strix Halo series.

    Naming Confirmation

    As earlier speculated, Strix Halo APUs will be part of the Ryzen AI Max 300 series. This was confirmed through the latest AMD chipset driver (V6.10.02.1849). Although AMD has yet to provide more details, recent leaks indicate that the new series will launch with three APUs.

    Top-of-the-Line Specs

    The premier model in this lineup is expected to be the Ryzen AI Max+ 395, boasting 16 Zen 5 CPU cores and an RDNA 3.5 integrated graphics processor (iGPU) with 40 compute units (CUs). In comparison, the higher-end Radeon 890M found in the existing Strix Point series has 16 CUs and can run most games smoothly at 1080p with medium to high settings.

    With its 40 CUs, the upcoming RDNA 3.5 iGPU in the Strix Halo could deliver an even superior gaming experience. It may even rival the performance of dedicated GPUs found in upper mid-range gaming laptops, like the Alienware m16 R2, currently priced at $1,451.99 on Best Buy.

    Additional Models

    In addition to the AI Max+ 395, the Ryzen AI Max 300 series is believed to include two other APUs. One of these is the AI Max 390, which is said to have 12 Zen 5 cores and the same iGPU as the flagship model. The entry-level option is rumored to be the AI Max 385, featuring an 8-core CPU and a 32 CUs iGPU, which doubles the GPU cores compared to the Radeon 890M.

    AMD has not officially confirmed these specifications, nor have they provided a launch timeline. However, earlier reports suggest that the Strix Point series might officially launch at CES 2025.

    HXL on X via: Wccftech


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