Tag: 3D V-cache

Key Takeaways

1. AMD’s Zen 7 CPU architecture is expected to focus on enhancing efficiency, IPC (Instructions Per Cycle), and frequency, rather than significantly increasing core count compared to Zen 6.

2. The introduction of a 3D Core is a key feature of Zen 7, utilizing advanced TSMC process nodes (1.4 nm for core chiplets and 4 nm for V-Cache chiplets).

3. Zen 7 is anticipated to achieve a 15-25% IPC improvement over Zen 6, with each core featuring 2 MB of on-die L2 cache and 7 MB of L3 cache, extending the 3D V-Cache concept.

4. AMD’s Epyc Zen 7 server processors may include 33-core chiplets, potentially allowing for total core counts of up to 264, with backward compatibility to Zen 6 IODs.

5. The projected timeline for Zen 7 includes a “Tape Out” in October 2026, with a full launch expected by late 2027 or early 2028.

By all accounts, it seems we still have over a year to wait before AMD reveals its next-generation Zen 6 CPU architecture. However, this hasn’t deterred Moore’s Law Is Dead from providing some insights about Zen 7, the successor to Zen 6. Recently, we reported that AMD has significant ambitions for Zen 7, including the launch of a 3D Core.

Insights on Zen 7

Moore’s Law Is Dead has shared more details about Zen 7 and AMD’s innovative 3D Cores. The source suggests that while Zen 7 may not significantly increase the core count compared to Zen 6, AMD plans to enhance efficiency, IPC, and frequency across all core types. Currently, AMD is said to be developing a single Zen 7 CPU architecture and dividing it into five distinct variants.

Exciting Developments

While MLID outlines some of AMD’s architectural and design objectives for Zen 7, the most intriguing aspect is the rumored 3D Core. Based on internal documents allegedly seen by MLID and confirmed through an AMD insider, AMD is reportedly choosing the advanced TSMC 1.4 nm process node for Zen 7 core chiplets and a 4 nm process for V-Cache chiplets. Even though this approach may raise costs, AMD appears committed to using the latest TSMC process node for its CPU cores.

Performance Expectations

With this cutting-edge process, Zen 7 is expected to achieve a 15-25% IPC improvement over Zen 6. This increase in IPC may be influenced by the cache modifications that AMD plans to implement in Zen 7 CPUs. The leaker indicates that Zen 7 processors will come with 2 MB of on-die L2 cache per core and 7 MB of L3 cache per core, utilizing V-Cache chiplets. This effectively means that AMD is extending the 3D V-Cache concept it first introduced with the Ryzen 7 5800X3D, giving each Zen 7 CPU core its own V-Cache, thus coining the term “3D Core.”

If AMD successfully launches a 3D Core, it’s easy to imagine that Zen 7 CPUs could deliver outstanding gaming performance, especially since the leading gaming CPUs available today are AMD models featuring a dedicated L3 “3D V-Cache” component.

Server Chip Developments

Furthermore, MLID asserts that AMD’s Epyc Zen 7 server processors will incorporate 33-core chiplets, potentially leading to a total core count of up to 264. Additionally, it seems that the Zen 7 Epyc core chiplets will be backward compatible with Zen 6 IODs, which AMD plans to unveil next year.

MLID mentions that AMD’s current goal for the “Tape Out” of Zen 7 is set for October 2026. Team Red is reportedly aiming for a full launch by the end of 2027 or the beginning of 2028.

Finally, the fact that Zen 7 is more than two years away suggests that the information provided by MLID should be taken with caution. We will likely hear official confirmations about Zen 7 only once Zen 6 CPUs are available on the market.

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Key Takeaways

1. AMD is expected to enhance gaming capabilities in Zen 6 CPUs by increasing the size of the 3D V-Cache.
2. Zen 7 is rumored to introduce a unified CPU architecture with various core types, including “Classic,” “Dense,” “Efficiency,” and “Low-Power” cores.
3. The new “3D Core” in Zen 7 will feature individual cache chiplets for each core, rather than a shared cache unit.
4. AMD is heavily investing in the latest process node technology for Zen 7, aiming for cutting-edge manufacturing from TSMC or Samsung.
5. Anticipation for more details on Zen 7, particularly regarding the 3D Core, is high, with expectations of improved gaming performance.

We are currently at a stage in the progression of AMD Zen 5 Ryzen 9000 CPUs where there is an uptick in leaks and speculation about future AMD CPU designs. We’ve shared a lot of information about Zen 6 enhancements, such as the expected CPU core counts, clock speeds, and cache capacities. Additionally, leaks have verified that AMD plans to boost the gaming capabilities of Zen 6 CPUs further by enlarging the 3D V-Cache.

AMD’s Future Plans

Thanks to insights from Moore’s Law Is Dead, we might have a clearer picture of AMD’s strategy for CPU architectures post-Zen 6. Zen 7, or whatever name the successor to Zen 6 will carry, is said to introduce a range of new features, including a novel “3D Core”.

According to the information provided by MLID, AMD aims to create a unified CPU architecture with Zen 7, which will then be divided into various product categories. Reportedly, Team Red is working on new core types, including “Classic,” “Dense,” “Efficiency,” and “Low-Power” cores for Zen 7. Moreover, AMD is investing heavily in the latest process node for Zen 7, meaning they will utilize whatever cutting-edge nodes are available from foundries like TSMC or Samsung at that time.

The Exciting New 3D Core

Despite the interesting details shared by MLID, none are as thrilling as the introduction of Zen 7’s new “3D Core.”

MLID hasn’t disclosed too much about the 3D Core, as it seems the leaker is reserving details for a more comprehensive Zen 7 leak in the future. However, what we do know about the 3D Cores for Zen 7 is quite intriguing.

To begin with, while Zen 7’s 3D Core uses the same cache-stacking concept seen in 3D V-Cache, it is fundamentally distinct. From our understanding, each Zen 7 3D Core will feature its own cache chiplet, instead of having a single cache unit shared across the entire CCD.

Presently, AMD’s 3D V-Cache CPUs, like the Ryzen 7 9800X3D, utilize one 64 MB cache chiplet positioned beneath a CCD that houses 8 cores. This means the 64 MB 3D V-Cache is distributed across the CCD. MLID suggests that every 3D Core in a Zen 7 CPU will possess its own cache chiplet, rather than relying on one block for the entire CCD.

Anticipation for More Details

We’ll need to wait for a more detailed leak from MLID regarding Zen 7 to gain additional insights about the 3D core. Until that happens, it’s an exciting prospect if AMD is indeed pursuing this direction with Zen 7, as it could lead to significantly enhanced gaming performance.

It’s already established that 3D V-Cache is extremely beneficial for gaming. Over the last two CPU generations, the top gaming CPUs available have been AMD models featuring 3D V-Cache, such as the Ryzen 9 9950X3D and Ryzen 7 7800X3D. Thus, it’s easy to imagine that a Zen 7 CPU equipped with 3D Cores, each having its own cache chiplet, could dominate gaming performance.

As always, rumors like these are prone to inaccuracies or may overlook crucial details. Therefore, it’s wise to approach this information with a healthy skepticism.

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