Samsung considers implementing 3D chiplet technology in Exynos mobile APs
Samsung Considers 3D Chiplets for Exynos Mobile APs Samsung Electronics is reportedly considering the application of 3D chiplet technology to its Exynos mobile application processors (APs). According to a company official familiar with the matter, Samsung believes that there are significant benefits to be gained from this technology. The Advantages of Chiplets Chiplets are a next-generation […]
Samsung considers implementing 3D chiplet technology in Exynos mobile APs Read More »