Tag: TSMC N3E

  • Xring O1 Die Shot Reveals Details of Xiaomi’s New Mobile SoC

    Xring O1 Die Shot Reveals Details of Xiaomi’s New Mobile SoC

    Key Takeaways

    1. The Xiaomi Xring O1 competes closely with Qualcomm’s Snapdragon 8 Elite in performance tests, highlighting its strong capabilities.
    2. The chip features a compact die area of 114.7 mm², similar to the Apple A18 Pro, thanks to advanced TSMC technology.
    3. It has a powerful 10-core CPU configuration, including two Cortex-X925 cores and a dedicated 16 MB L3 cache.
    4. The GPU is an Arm Immortalis-G925 MP16, and the chip uses LPDDR5T-9600 memory modules, resembling designs from Qualcomm and MediaTek.
    5. The 5G modem is an external component sourced from MediaTek, contributing to the chip’s compact design.

    The Xiaomi Xring O1 has made a noticeable impact by competing closely with Qualcomm’s Snapdragon 8 Elite in Geekbench tests. This is impressive, especially considering that even well-known brands like Samsung struggle with this challenge, likely due to Samsung Foundry’s reliance on TSMC’s technology. Recently, Geekerwan and Kurnalsalts have provided a detailed analysis of Xiaomi’s latest chip.

    Compact Design

    The die area of the Xiaomi Xring O1 measures a mere 114.7 mm², with 109.5 mm² of that being utilized. This size is comparable to the Apple A18 Pro, which was made possible through its production on TSMC’s N3E node, the same technology used by Apple, Qualcomm, and MediaTek for their Dimensity 9400.

    High-Performance Components

    Most of the die’s area is occupied by a powerful 10-core CPU, which includes two Cortex-X925 cores, four Cortex-A725 cores, and two Cortex-A520 cores. Additionally, there’s a dedicated 16 MB L3 cache for the CPU, along with several other caches for the other cores. Adjacent to the CPU, the chip features a 6-core NPU with a 16 MB cache. Xiaomi hasn’t clarified whether this NPU is developed in-house or obtained from another company.

    GPU and Connectivity

    The GPU utilized in the Xring O1 is the Arm Immortalis-G925 MP16, while the ISP seems to be an internal design by Xiaomi. Furthermore, the Xring O1 is equipped with LPDDR5T-9600 memory modules. In terms of design, it shares similarities with competitors from Qualcomm and MediaTek. However, a notable absence is the 5G modem, which is believed to be an external component sourced from MediaTek. This modem is not integrated into the die, likely explaining the chip’s compact size.

    Source:
    Link

    Tags: , ,
  • PS6 Leak: Zen 5 CPU, UDNA GPU, and 8K Gaming Features Revealed

    PS6 Leak: Zen 5 CPU, UDNA GPU, and 8K Gaming Features Revealed

    Leaked information indicates that the development of Sony’s PlayStation 6 (PS6) is progressing faster than expected. A leaker known as Kepler_L2 on NeoGAF forums revealed that the design for the console’s system-on-chip (SoC) is completed, and it’s currently in the pre-silicon validation stage. The first tapeout, referred to as A0, is planned for later this year. In simple terms, Sony has wrapped up the design of its main processing chip and is now putting it through thorough virtual testing. They aim to start producing the initial batch of these chips soon to evaluate their performance in real-world scenarios.

    Hardware Details

    According to the leak, the PS6 will feature a custom APU from AMD, which is being made by TSMC. This chip will integrate a Zen 5 CPU and an UDNA GPU, both leveraging state-of-the-art production processes. Intel lost the chance to create the PS6 processor, with AMD winning the contract in 2022. The Zen 5 CPU is rumored to come with 8 cores and 16 threads, promising a notable boost in performance compared to the Zen 2 CPU used in the PS5.

    The UDNA GPU, previously known as RDNA 5, will be built using TSMC’s N3E process. It is speculated to offer advanced features like X3D cache technology, similar to the AMD Ryzen 7 9800X3D desktop chip, which will enhance performance for gaming and other computational tasks.

    Enhanced Gaming Experience

    With the PS6, gamers can expect an upgraded gaming experience, supporting 4K at 120FPS and 8K at 60FPS, driven by the Zen 5 CPU and UDNA GPU. The PS5 made a huge leap in performance compared to the PS4, increasing computing power from 1.84 teraflops to 10.3 teraflops. While the exact performance boost for the PS6 is still uncertain, and native 4K resolution is not assured, the console is likely to use AI-driven upscaling technologies to achieve high-quality visuals. Major improvements are expected for Sony’s PlayStation Spectral Super Resolution (PSSR) and AMD’s upcoming FidelityFX Super Resolution 5 (FSR 5).

    Tags: , ,
  • Why Snapdragon 8 Gen 4 Costs More Than 8 Gen 3

    Why Snapdragon 8 Gen 4 Costs More Than 8 Gen 3

    Qualcomm has announced that the Snapdragon Summit is set for October 24th to 26th, where the Snapdragon 8 Gen 4 chipset will be unveiled. This new processor is intended to power flagship smartphones in 2025.

    The Snapdragon 8 Gen 4 has been a topic of discussion for months, with speculation that it will be more costly, leading to increased prices for future flagship phones.

    Price Increase Details

    Industry analyst Ming-Chi Kuo has provided insights into the anticipated price rise for Qualcomm’s Snapdragon 8 Gen 4 processor, codenamed SM8750. According to Kuo, the chip, expected to begin mass production in the latter half of 2024, may see a 25-30% price increase compared to the current Snapdragon 8 Gen 3 (SM8650), which is priced around $190-$200 per unit. This would place the Snapdragon 8 Gen 4’s price between $237.50 and $260.

    The primary driver for this price increase is the utilization of TSMC’s latest and more advanced N3E production node for the Snapdragon 8 Gen 4, according to Kuo. Although the new node will offer performance enhancements, it also incurs higher manufacturing costs.

    Market Demand and Future Prospects

    Despite the increased price, Kuo anticipates robust demand for the Snapdragon 8 Gen 4 due to the expanding high-end smartphone market, particularly those featuring AI capabilities. The new chip's shipments are expected to grow at a “high single-digit rate” compared to its predecessor.

    In other news, Kuo also discussed the future of Windows on ARM (WOA) processors. He projects shipments of Qualcomm’s existing X Elite and X Plus chips in WOA devices to reach approximately 2 million units in 2024. Kuo predicts that this segment will see year-on-year growth of at least 100-200% in 2025.

    Low-Cost WOA Processors

    Additionally, Kuo suggests that modified versions of the X Elite and X Plus chips will be released in 2025, which will reduce the cost of WOA devices.

    Qualcomm is reportedly planning to introduce a low-cost WOA processor codenamed Canim for mainstream devices priced between $599 and $799. This budget-friendly chip, produced on TSMC’s N4 node, will maintain the same AI processing power (40 TOPS) as its more expensive counterparts, according to Kuo.

    Tags: ,