Key Takeaways
1. Manufacturing Process: The Dimensity 8500 will be built using TSMC’s 4-nanometer technology, featuring an eight-core CPU with ARM’s Cortex-A725 cores.
2. Performance Specs: It includes a super core clocked at 3.4 GHz, with higher clock speeds for other cores aimed at improving efficiency and performance for mid-range devices.
3. Graphics Capabilities: The chip features a Mali-G720 GPU, with a clock speed around 1.5 GHz, and benchmark results indicate it may outperform some recent Snapdragon flagship models.
4. Development Comparison: Development of the Dimensity 8500 began after the Dimensity 9500, which utilizes a more advanced 3-nanometer process, indicating a focus on efficiency in a budget-friendly design.
5. Upcoming Devices: First smartphones with the Dimensity 8500 are in development, promising enhanced display quality and significant battery capacity.
Leaker Digital Chat Station has recently shared some new insights regarding their previous leak about the Dimensity 8500 specifications. Fresh details have now come to light concerning the expected clock speeds and overall chip design of this upcoming SoC.
Chip Specifications
The updated information indicates that the Dimensity 8500 will be manufactured using TSMC’s 4-nanometer process technology. It consists of an eight-core CPU configuration that solely employs ARM’s Cortex-A725 big cores. The design reportedly includes a super core that operates at 3.4 GHz, while the remaining cores are also clocked higher than previous versions. This arrangement is intended to enhance both efficiency and performance for mid-range devices.
Graphics Performance
In terms of graphics, the processor is said to incorporate a Mali-G720 GPU, although no specific details are available regarding the number of clusters, with a clock speed around 1.5 GHz.
As per the newly obtained benchmark results from the leak, the chip achieves a score of roughly 2.2 million points on AnTuTu. Digital Chat Station has asserted that the GPU’s theoretical capabilities might exceed some of the latest Snapdragon flagship models.
Development Timeline
The Dimensity 8500 began its development soon after the release of the Dimensity 9500 in September. The Dimensity 9500, which is built on a 3-nanometer process, boasts a more sophisticated eight-core setup. This includes one high-performance C1-Ultra core clocked at 4.21 GHz, three C1-Premium cores at 3.5 GHz, and four C1-Pro cores running at 2.7 GHz.
When compared to the Dimensity 9500, the leaks concerning the Dimensity 8500 indicate that Mediatek aims to offer comparable efficiency within a more compact and budget-friendly format. Although it is developed on an older 4nm node, the Dimensity 8500 is designed to cater to a wider audience of mid-range smartphones.
Upcoming Devices
According to the latest details, the first smartphones featuring the Dimensity 8500 are currently under development. One of these models aims to deliver enhanced display quality, while another emphasizes a substantial battery capacity.
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