Tag: xMEMS

  • xMEMS Lassen: High-Quality Audio for True Wireless Earbuds

    xMEMS Lassen: High-Quality Audio for True Wireless Earbuds

    Key Takeaways

    1. xMEMS has launched the Lassen MEMS micro-tweeter for true wireless stereo earbuds, eliminating the need for a separate piezo amplifier chip for compact designs.
    2. MEMS technology offers durable, robust devices that can withstand drops and last for years without wear.
    3. The Lassen micro-tweeter measures 3.2 x 5 x 1.15 mm and has a frequency response of 6 kHz to 20 kHz, producing sound levels up to 115dB SPL at 1 Vrms.
    4. This micro-tweeter is designed to be paired with a low-frequency driver to provide a complete audio experience due to the limitations of single drivers.
    5. Mass production of the Lassen micro-tweeter will start in September 2025, with samples currently available for audio designers.

    xMEMS has unveiled the Lassen MEMS micro-tweeter, designed specifically for true wireless stereo (TWS) earbuds. This innovative speaker does not need a separate piezo amplifier chip, allowing for more compact earbud designs. Mass production is set to begin in September 2025, and samples are currently available for audio designers.

    Evolution of Sound Reproduction

    To reproduce sound, air must be moved. Traditionally, earbuds have relied on conventional cone drivers due to their ready availability and simple manufacturability. Recently, newer technologies like balanced armature and planar drivers have emerged, but they all share the challenge of needing to move relatively large masses. This leads to slower responses to quick changes in music, resulting in audio distortion.

    The Durability of MEMS Technology

    MEMS, or micro-electromechanical systems, are tiny devices that are even smaller than a grain of rice and can be made using chip manufacturing methods. Silicon MEMS devices are incredibly robust, capable of withstanding drops without damage and functioning for years without wear.

    The Lassen MEMS micro-tweeter’s dimensions are 3.2 x 5 x 1.15 mm (0.126 x 0.197 x 0.045 in.), with a frequency response ranging from 6 kHz to 20 kHz. It can produce sound levels up to 115dB SPL at 1 Vrms without the need for external amplification. Its all-silicon, solid-state design allows the tweeter to deliver music with superior clarity and detail compared to other driver types.

    Complementary Sound Reproduction

    No single driver can cover a wide frequency range with high fidelity and minimal distortion, which is why the Lassen micro-tweeter is meant to be paired with a low-frequency driver for a complete audio experience.

    For those curious about xMEMS speaker technology, the Creative Labs Aurvana Ace lineup is available for testing (available on Amazon).

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  • Laptop Cooling Solutions 2025: Traditional vs. Innovative Options

    Laptop Cooling Solutions 2025: Traditional vs. Innovative Options

    The laptop industry is witnessing a pivotal moment, balancing between established cooling techniques and new solid-state options.

    Market leaders still rely on sophisticated traditional cooling systems, but innovative solid-state solutions from companies such as Ventiva, Frore, and xMEMS are set to transform the landscape. This competition extends beyond just managing heat; it’s about changing the fundamentals of performance, noise levels, and portability in computing devices.

    A Glimpse at Advanced Cooling Tech

    Several laptop models are now integrating these cutting-edge cooling technologies. The newcomers—Ventiva, Frore, and xMEMS—each offer a visionary take on how to manage thermal issues.

    While traditional cooling systems are great for sheer cooling capabilities, especially when dealing with powerful gaming processors boasting TDPs over 100W, they often fall short in terms of noise and size. On the other hand, solid-state technologies promise quiet operation, dependability (thanks to no moving parts), a more compact design, and improved energy efficiency, though they currently lag behind in performance.

    Future of Integrated Cooling

    The exciting idea of integrating cooling chiplets directly into processors, as proposed by xMEMS, signals a potential cooling revolution that could alter the industry landscape.

    Even though traditional cooling methods will still be relevant for high-performance machines, solid-state technologies may soon become the norm for ultrabooks and portable devices, like smartphones, in the not-so-distant future.

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