Tag: Snapdragon Chipsets

  • Redmi K80 Pro to Feature Ultrasonic In-Display Fingerprint Sensor

    Redmi K80 Pro to Feature Ultrasonic In-Display Fingerprint Sensor

    Redmi is anticipated to launch the Redmi K80 series smartphones in China this November. This series is expected to include at least three models: the Redmi K80e, Redmi K80, and Redmi K80 Pro. A fresh leak from tipster Digital Chat Station sheds light on the fingerprint scanning technology that will be incorporated in the Redmi K80 lineup.

    Redmi K80 Pro: Ultrasonic In-Screen Fingerprint Sensor

    Although the tipster DCS did not specify the exact model in the screenshot, he notes that ultrasonic in-display fingerprint sensors are predominantly found in high-end flagship models. For sub-brands, only the premium versions featuring the Snapdragon 8 Gen 4 chipset will include ultrasonic fingerprint sensors. The lower-end variants will be equipped with optical in-screen fingerprint sensors, which have a shorter focus range and offer a different user experience.

    Previous Reports and Speculations

    Earlier reports have indicated that the entire Xiaomi 15 series, which includes Xiaomi 15, 15 Pro, and 15 Ultra, will feature ultrasonic in-screen fingerprint sensors. It’s worth noting that last year’s Xiaomi 14 series came with optical in-screen fingerprint sensors.

    According to the recent leak, Redmi’s sub-brand will include an ultrasonic in-display fingerprint sensor in the Redmi K80 Pro, while the standard Redmi K80 may only have an optical in-screen fingerprint reader.

    Specifications and Features

    Regarding other specifications, the Redmi K80 and K80 Pro are expected to be powered by the Snapdragon 8 Gen 3 and Snapdragon 8 Gen 4 chipsets, respectively. Both phones are likely to feature OLED panels with 1.5K and 2K resolutions. A recent report also suggests that both models will house a 6,000mAh battery. Additionally, it’s probable that the Redmi K80 and K80 Pro will be rebranded as the Poco F7 and F7 Pro for the global market next year.

  • Samsung skips Exynos 2400 for Z Fold6 and Flip6, picks Qualcomm

    Samsung skips Exynos 2400 for Z Fold6 and Flip6, picks Qualcomm

    Samsung is reportedly opting not to use its Exynos chips in the upcoming Galaxy Z Fold6 and Z Flip6, according to The Elec, a Korean publication. Instead, the company will continue to rely on Snapdragon chipsets for its foldable devices, a trend that has been consistent so far.

    Performance and Power Efficiency

    Samsung has made strides in improving the performance and power efficiency of its in-house silicon over the past few generations. The goal is likely to gain more control over its smartphone business while also reducing costs. Historically, Exynos has often lagged behind its Snapdragon counterparts in terms of performance. However, recent developments indicate that Exynos is starting to catch up with Qualcomm. A recent report even suggests that the upcoming Exynos 2500 chipset will surpass the Snapdragon 8 Gen 4 in power efficiency. Nevertheless, this new chipset is expected to debut with the S25 series, leaving the Exynos 2400 and last year’s Snapdragon 8 Gen 3 as the current options for the 6th generation foldables.

    Exynos 2400: Still Not Efficient Enough

    Despite these advancements, Samsung MX (the smartphone business unit) has decided to continue its partnership with Qualcomm for its foldable phones, as reported by The Elec. The decision is attributed to the Exynos 2400 chipset still not meeting the required power efficiency standards. Last year’s fifth-generation flip phone featured a 3700mAh battery.

    There are rumors that the Z Flip6 will feature a 3880mAh battery, which Samsung might market as a 4000mAh battery, similar to the Galaxy S24. However, this capacity is still deemed insufficient for a flagship chipset, pushing Samsung to prioritize power efficiency even if it’s not the most cost-effective option.

    The Galaxy Z Fold6 has already appeared on Geekbench, and the phone is expected to be launched around mid-July.

  • Honor 200, 200 Pro with Snapdragon 8s Gen 3, Snapdragon 8 Gen 3

    Honor 200, 200 Pro with Snapdragon 8s Gen 3, Snapdragon 8 Gen 3

    Honor is reportedly preparing to launch the Honor 200 series specifically for the Chinese market. Recently, two Honor smartphones with model numbers ELP-AN00 and ELI-AN00 received approval from the 3C authority in China. These devices are anticipated to be part of the upcoming Honor 200 series, set to make its debut in May. Recent leaks have provided insights into the chipsets that will power both these smartphones.

    3C Certification for Honor 200 Series Devices

    The 3C certification for the purported Honor 200 and 200 Pro models hints at the potential inclusion of 100W fast charging support for both devices. At present, the listed model numbers are ELP-AN00 and ELI-AN00, without clear distinctions between the standard version and the Pro variant. What is evident from their 3C certification is the likelihood of both models supporting 100W fast charging.

    Several leaks have suggested that the Honor 200 duo might feature a quad-curved OLED panel with a 1.5K resolution. According to tipster Teme, the Pro model could integrate a dual selfie camera setup housed in a pill-shaped cutout. The main rear camera is expected to offer variable aperture, OIS support, and a telephoto lens.

    Another source claimed that the Honor 200 is likely to be powered by the Snapdragon 8s Gen 3 chipset, while the Pro variant could come with the Snapdragon 8 Gen 3. Notably, the Honor 100 and 100 Pro, launched in November 2023, were equipped with the Snapdragon 7 Gen 3 and 8 Gen 2 chipsets, respectively. The same source also mentioned significant changes to the design of the rear camera module in the Honor 200 series.


    Honor 200, 200 Pro with Snapdragon 8s Gen 3, Snapdragon 8 Gen 3