Tag: MediaTek Dimensity 9500

  • Vivo X300 Pro Leaked: Exciting Hardware Upgrades Expected

    Vivo X300 Pro Leaked: Exciting Hardware Upgrades Expected

    Key Takeaways

    1. Vivo has announced the X Fold5 as the lightest book-style foldable phone, surpassing its predecessor, the X Fold3.
    2. The upcoming Vivo X300 Pro is expected to launch shortly after the iPhone 16 Pro Max and will feature the MediaTek Dimensity 9500 chipset.
    3. The X300 Pro is rumored to have a large battery exceeding 7,000 mAh for extended battery life.
    4. It will include a new Sony IMX09A camera sensor with a 50 MP resolution, replacing the IMX818 used in previous models.
    5. Advanced image processing technologies, including Sony’s UHCG circuit, DCG HDR, and DCG+VS, will be utilized for improved low-light photography and dynamic range.

    Vivo has unveiled the X Fold5, now holding the title of the lightest book-style foldable in the world, surpassing the X Fold3. However, Digital Chat Station has quickly shifted focus to one of Vivo’s upcoming standard flagship smartphones. This time, the leaker is talking about the X300 Pro, which is expected to launch shortly after Apple introduces the iPhone 16 Pro Max (currently priced at $1,049 for refurbished models on Amazon).

    New Chipset Anticipated

    As per Digital Chat Station, Vivo plans to equip the X300 Pro with the upcoming MediaTek Dimensity 9500 chipset. Interestingly, initial performance metrics for the Dimensity 9500 have already appeared on Geekbench, and we’ve discussed those details in another article. Reports suggest that Vivo will pair the Dimensity 9500 with a battery exceeding 7,000 mAh, which should provide impressive longevity.

    Impressive Camera Features

    In a post on Weibo, Digital Chat Station has mentioned that the X300 Pro will highlight the new IMX09A camera sensor from Sony. This sensor is expected to replace the IMX818 found in devices such as the X200 Pro and X200 Pro mini. The IMX09A is believed to feature a 1/1.28-inch optical format, with pixels measuring 1.22 μm and a native resolution of 50 MP.

    Advanced Image Processing Technology

    Furthermore, Digital Chat Station claims that the X300 Pro will utilize Sony’s ultra-high conversion gain (UHCG) circuit technology to reduce image noise when shooting in low-light environments. The leaker also notes that this device will employ DCG HDR and DCG+VS technologies to enhance dynamic range. If these claims hold true, it’s possible that the X300 Pro might also include an OmniVision sensor in some capacity. As for complete specifications and details regarding the X300 Pro, those are likely to be revealed only in the autumn.

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  • ARM’s New Travis Core: IPC Boost and SME Support Explained

    ARM’s New Travis Core: IPC Boost and SME Support Explained

    Key Takeaways

    1. ARM is set to unveil a new high-performance CPU core named Travis in September, focusing on improving IPC (instructions per cycle).
    2. The Travis core is expected to deliver significant double-digit IPC improvements over its predecessor, emphasizing efficiency over just higher clock speeds.
    3. It will support the Scalable Matrix Extension (SME) to enhance performance for AI and machine learning tasks, aligning with ARM’s strategy for diverse workloads.
    4. MediaTek is expected to be the first to use the Travis core in its upcoming Dimensity 9500 chip, competing against Qualcomm’s Snapdragon 8 Elite 2.
    5. The new MediaTek chip is reportedly showing impressive performance, benefiting from both the CPU enhancements and a new GPU design, possibly ARM’s Mali-G1 Ultra.

    ARM’s upcoming CPU enhancement has recently become more concrete, at least according to leaks. A new report from industry insider Digital Chat Station suggests that ARM will unveil a new high-performance CPU core named Travis this coming September. The chief focus of this core is said to be its IPC, or instructions per cycle.

    Understanding IPC’s Importance

    IPC is a metric that evaluates how much processing a chip can accomplish at a specified clock speed. According to DCS, the Travis core is expected to deliver double-digit IPC improvements when compared to its predecessor. This is a significant advancement, especially as chip manufacturers are now prioritizing efficiency and intelligent workload distribution instead of merely increasing clock speeds.

    New Features of the Travis Core

    The Travis core will also feature support for the Scalable Matrix Extension (SME), which aims to enhance performance for AI and machine learning tasks. SME is a part of ARM’s larger plan to update compute architecture to handle a variety of workloads across mobile and edge devices more effectively.

    Adding credibility to the leak, DCS has released images that seem to be from an official ARM press event, which confirms these features.

    MediaTek’s Role in the Launch

    While ARM is leading the design of the core, it seems that MediaTek will be the first to utilize it in a commercial product. The Dimensity 9500 is anticipated to be MediaTek’s response to whatever Qualcomm is developing with the Snapdragon 8 Elite 2.

    DCS indicates that the new MediaTek chip is already demonstrating impressive performance, likely benefiting from not only the CPU enhancements but also a new GPU design, which is rumored to be ARM’s Mali-G1 Ultra, codenamed Drage.

    ARM has yet to make any official statements, but if these leaks are accurate, the Travis core could represent a significant change in the technology behind next-generation Android flagship devices.

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    ARM's New Travis Core: IPC Boost and SME Support Explained

     

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  • MediaTek Dimensity 9500 Chip Launch Expected Before Snapdragon 8 Elite 2

    MediaTek Dimensity 9500 Chip Launch Expected Before Snapdragon 8 Elite 2

    Key Takeaways

    1. MediaTek’s Dimensity 9500 is expected to launch before Qualcomm’s Snapdragon 8 Elite 2.
    2. The Snapdragon Summit is scheduled for September 23, 2025, where the Snapdragon 8 Elite 2 will be announced.
    3. The Dimensity 9500 is anticipated to enhance performance and AI capabilities.
    4. The launch of these chipsets will lead to new flagship Android smartphones featuring advanced specifications.
    5. Previous models like Oppo Find X8 and Vivo X200 utilized the Dimensity 9400, while upcoming models will likely feature the new Dimensity 9500.

    MediaTek seems to be ahead of Qualcomm this year, especially with the next-gen flagship processors. The anticipated Dimensity 9500 SoC might be released before the expected Snapdragon 8 Elite 2. This new chipset is expected to enhance performance, AI capabilities, and much more. Here’s everything we know so far.

    Dimensity 9500 Release Expected Before Snapdragon 8 Elite 2

    Last year, both the MediaTek Dimensity 9400 and Qualcomm Snapdragon 8 Elite were launched in October. However, the Dimensity chip was introduced just a few days prior to its Snapdragon counterpart. A recent leak suggests that the upcoming Dimensity 9500 will maintain this trend of being announced first. Qualcomm has already stated that the Snapdragon Summit is set for September 23, 2025, where they are expected to formally introduce the Snapdragon 8 Elite 2.

    Anticipated Features of the MediaTek Dimensity 9500

    Although there is no official launch date for the Dimensity 9500 yet, known leaker Digital Chat Station has indicated that it will likely come out before the Snapdragon processor. It could potentially be unveiled as early as September 2025. With these new chips being launched, we can also expect a wave of flagship Android smartphones to be released, showcasing advanced specifications and performance.

    To remind you, the Oppo Find X8 and Vivo X200 series utilized the Dimensity 9400, which means we can look forward to the Find X9 and X300 series featuring the Dimensity 9500. Similarly, the Galaxy S25 series, OnePlus 13, among others, used the Snapdragon 8 Elite, and they are expected to upgrade to the Snapdragon 8 Elite 2 for their next models. It’s important to note that this information is still unverified, so it’s wise to take it with a grain of salt for the time being.

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  • Oppo Find X9 Pro Could Lose Key Feature from Find X8 Pro

    Oppo Find X9 Pro Could Lose Key Feature from Find X8 Pro

    Key Takeaways

    1. Oppo has launched the Find X8 Ultra alongside the Find X8s and Find X8s Plus, with the Find X9 series expected to follow later this year.
    2. The Find X9 Pro is rumored to feature a MediaTek Dimensity 9500 chipset and a new camera design.
    3. Unlike the previous model, the Find X9 Pro is expected to have a triple camera arrangement instead of a quad configuration.
    4. The new camera setup will likely include dedicated wide and ultra-wide-angle lenses, along with a single periscope camera.
    5. There is speculation about the use of a 200 MP sensor for the periscope camera, potentially a more advanced one to distinguish it from other flagship devices.

    Oppo has just unveiled the Find X8 Ultra, introducing it alongside the Find X8s and Find X8s Plus earlier this month. However, there are already fresh insights from Digital Chat Station regarding Oppo’s future plans for the Find X9 series.

    Changes in Camera Design

    In the past, Oppo has worked to make its flagship models stand out with unique dual periscope zoom cameras. The Find X8 Ultra was highlighted in comparison to the iPhone 16 Pro Max and Galaxy S25 Ultra, which is currently priced at $1,067.99 on Amazon.

    According to a post on Weibo by Digital Chat Station, Oppo appears to be taking a different approach for the Find X9 Pro. Set to launch this autumn with a MediaTek Dimensity 9500 chipset, there were initial expectations of a quad rear camera configuration similar to its predecessor.

    New Prototype Features

    However, it seems that the latest prototypes are now featuring a triple camera arrangement instead. Digital Chat Station suggests that the Find X9 Pro will retain dedicated wide and ultra-wide-angle lenses. In contrast to the Find X8 Pro’s dual telephoto setup, the new model is expected to include a single periscope camera based on an unspecified 200 MP sensor. There is a possibility that it could use the Samsung ISOCELL HP9 found in the Vivo X200 Ultra and Xiaomi 15 Ultra, but it wouldn’t be surprising if Oppo chose a more advanced sensor to set the Find X9 Pro apart from other flagship devices.

    Digital Chat Station has provided intriguing updates about the Find X9 series, hinting at innovations that could change Oppo’s flagship lineup.

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  • Snapdragon 8 Elite 2 and Dimensity 9500 Phones Launching Soon

    Snapdragon 8 Elite 2 and Dimensity 9500 Phones Launching Soon

    Key Takeaways

    1. Qualcomm and MediaTek are launching their next high-end chips sooner than previous models, with MediaTek’s Dimensity 9500 expected mid-2025 and Qualcomm’s Snapdragon 8 Elite 2 in early October.

    2. Smartphones using these new chips may also be released earlier than planned, with rumors suggesting some devices could debut as soon as late September.

    3. Vivo or Oppo is likely to be the first to launch a phone with the Dimensity 9500, while Xiaomi may introduce a device with the Snapdragon 8 Elite 2.

    4. The Dimensity 9500 will feature a redesigned 2+6 CPU cluster layout, moving away from the previous all-big-core design.

    5. Snapdragon 8 Elite 2 is expected to support ARM’s SME instruction set, potentially enhancing its performance to compete with Apple’s upcoming M4 chip.

    Qualcomm and MediaTek are currently developing their next high-end chips, and both companies are expected to release their new SoCs sooner than their last models. Reports suggest that MediaTek may debut the Dimensity 9500 around mid-2025, while the Snapdragon 8 Elite 2 could be revealed in early October.

    Early Smartphone Releases

    Not only could the chips be launched sooner, but the smartphones that use them might also come out ahead of schedule. A recent rumor from China claims that manufacturers are planning to introduce devices a month earlier than initially anticipated.

    Digital Chat Station shared on Weibo that the first batch of phones powered by Snapdragon 8 Elite 2 and Dimensity 9500 is “definitely” set for an October launch. Some manufacturers may even release their devices sooner, possibly by late September.

    Who Will Launch First?

    Following past patterns, either Vivo or Oppo is likely to be the first to release a phone with the Dimensity 9500, while Xiaomi could be among the initial brands to introduce a device with the Snapdragon 8 Elite 2.

    Major Changes for Dimensity 9500

    We have gained some early insights into the features of these new chips, and it looks like MediaTek’s Dimensity 9500 is set for a significant redesign. A previous report indicates that the upcoming MediaTek flagship will use a 2+6 CPU cluster layout, which is a notable shift from the all-big-core design of the Dimensity 9300 and 9400.

    The reason for this change isn’t completely understood, particularly since MediaTek was a pioneer in the big-core approach, but the new chip is expected to include two Cortex-X930 “Travis” cores along with six Cortex-A730 “Gelas” cores.

    On the other hand, Qualcomm’s Snapdragon 8 Elite 2 is said to support ARM’s SME (Scalable Matrix Extension) instruction set, which could enhance its performance to be more in line with Apple’s forthcoming M4 chip.

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