Key Takeaways
1. Honor is set to launch new smartphones, including the Honor 400 series, Honor GT Pro, and foldable models like the Magic V4 and Magic V2 Flip in China.
2. The Honor Magic V2 Flip will feature a tailored LTPO display and be powered by the Snapdragon 8 Gen 3 chipset, but additional specifications are not yet available.
3. The Honor Magic V4 will have an approximately 8-inch LTPO foldable internal display, a side-mounted fingerprint scanner, and run on the Snapdragon 8 Elite chipset.
4. The Magic V4 is expected to include a 50MP main camera and a telephoto lens, although the telephoto lens may not be of flagship quality.
5. A key focus for the Magic V4 is a thinner design, with a launch expected around June, aiming to be slimmer than the previous Magic V3 model.
Honor is gearing up to unveil a range of new smartphones in China, which will include the Honor 400 series, the Honor GT Pro, and innovative foldable models like the Magic V4 and Magic V2 Flip. Recently, the leaker known as Digital Chat Station (DCS) provided insights about the Magic V4 in a post on Weibo. Now, he has shared more information, offering first-time details on the Magic V2 Flip as well.
Honor Magic V2 Flip
DCS’s recent leak gives us a glimpse into the Honor Magic V2 Flip and Magic V4. The Honor Magic V2 Flip is said to come with a tailored LTPO display and will be powered by the Snapdragon 8 Gen 3 chipset. Unfortunately, the leak does not mention any other specs regarding the device. To compare, last year’s Honor Magic V Flip boasted a 6.8-inch foldable LTPO OLED screen and utilized the Snapdragon 8+ Gen 1 chipset.
Honor Magic V4
The leak also indicates that the Honor Magic V4 will feature a bespoke LTPO foldable internal display that measures around 8 inches. For security purposes, it will include a side-mounted fingerprint scanner. Inside, the device will run on the Snapdragon 8 Elite chipset. In China, it will face competition from the Oppo Find N5, which is rumored to have a 7-core version of the Snapdragon 8 Elite. However, the Magic V4 is likely to come with the regular 8-core variant of the processor.
When it comes to photography, the Magic V4 is expected to include a 50-megapixel high-end main sensor along with a telephoto camera. While it should keep a periscope telephoto lens similar to its predecessor, the leak suggests that this lens may not be considered flagship quality.
Thinner Design and Launch Timeline
A major improvement this generation focuses on reducing thickness. The Magic V4 is anticipated to be slimmer than the Magic V3, which had a folded thickness of 9.2mm. Moreover, the leak implies that Honor is moving quickly with its release plans, with both foldable models likely to launch around June.