Tag: DUV Lithography

  • Kirin 9100 Leak: Energy Efficiency Matches Snapdragon 8 Gen 2

    Kirin 9100 Leak: Energy Efficiency Matches Snapdragon 8 Gen 2

    Earlier this week, a leak from well-known tech tipster Digital Chat Station (DCS) hinted at the development of a new Kirin chip at Huawei. Today, DCS followed up on Weibo, China’s social media platform, unveiling some additional insights.

    The leak indicates that Huawei is likely to use a “domestically developed n+2/3 process” to produce its next Kirin chip, probably named the Kirin 9100. This suggests a 5nm node, with DCS explaining that it will utilize Deep Ultraviolet (DUV) lithography with multiple patterning for its production.

    Manufacturing Process

    Using this approach, Huawei will achieve transistor sizes similar to those produced at 5nm, but it won’t be the same as the leading-edge EUV (extreme ultraviolet) lithography utilized by TSMC and Samsung. Since DUV lithography requires multiple exposures to create the desired pattern on the chip, it can result in higher production costs and potentially lower chip yield compared to EUV, which can print more intricate designs with a single exposure.

    Efficiency and Performance

    Despite these challenges, DCS notes that the new chip will bring “quite obvious” improvements in energy efficiency over the previous Kirin chip. However, it may not completely match the efficiency of Qualcomm’s latest offerings. According to the tipster, the new Kirin chip is expected to be on par with the Snapdragon 8 Gen 2. If not, DCS asserts that it will still be more efficient than the Snapdragon 8+ Gen 1.

    It’s crucial to remember that these details are still leaks, and specific information such as the Kirin model number, core configuration, and the targeted release date remain unknown.

    Manufacturing Uncertainties

    Moreover, the leak does not specify which foundry will manufacture the chip. While DCS mentions that it will be domestically produced, since TSMC and Samsung are not options due to US restrictions, there is uncertainty about which Chinese foundry is capable of a 5nm DUV process. SMIC is a potential candidate, but it is under scrutiny from the US government regarding its ability to produce advanced chips.

    Kirin 9100 Leak: Energy Efficiency Matches Snapdragon 8 Gen 2
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  • SMIC’s 5nm Breakthrough to Power Huawei Mate 70 Processors

    SMIC’s 5nm Breakthrough to Power Huawei Mate 70 Processors

    SMIC has played a vital role in producing Huawei's Kirin chips, including the Kirin 9000S and 9010, both of which are fabricated using a 7nm process. The foundry is reportedly working on its own 5nm chip production technique.

    Milestone Achievement

    Recent reports from Business Korea and Hankyung indicate that SMIC has successfully reached this milestone, meaning their 5nm process is now prepared for chip manufacturing.

    This achievement is remarkable, especially given the infrastructure issues SMIC faces due to US export limitations. However, the reports highlight that SMIC's new 5nm node depends on the older Deep Ultraviolet (DUV) lithography rather than the more advanced Extreme Ultraviolet (EUV) technology.

    Lithography Technologies

    DUV lithography employs deep ultraviolet light with a wavelength of approximately 193nm to engrave circuit patterns onto silicon wafers.

    In contrast, EUV lithography utilizes much shorter extreme ultraviolet light (around 13.5nm). This shorter wavelength facilitates the creation of finer features, enabling the production of more powerful and efficient chips. Consequently, EUV is deemed essential for achieving the most advanced chip designs.

    The reason SMIC cannot adopt EUV technology stems from ongoing US-China tensions. ASML, a major supplier of EUV lithography machines, is barred by US export regulations from providing its technology to Chinese foundries like SMIC. Hence, SMIC must rely on DUV lithography for its 5nm node.

    Future Prospects

    Despite concerns about production yield, Huawei is expected to utilize processors manufactured using SMIC's new 5nm node in its upcoming Mate 70 series.

    Additionally, there are rumors of a new Huawei laptop featuring a Kirin chip designed for PCs that is purported to compete with Apple's M2 in terms of performance. Whether these rumors hold true remains to be seen.

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